JPS61248517A - 化合物半導体薄膜の製造装置 - Google Patents

化合物半導体薄膜の製造装置

Info

Publication number
JPS61248517A
JPS61248517A JP60088927A JP8892785A JPS61248517A JP S61248517 A JPS61248517 A JP S61248517A JP 60088927 A JP60088927 A JP 60088927A JP 8892785 A JP8892785 A JP 8892785A JP S61248517 A JPS61248517 A JP S61248517A
Authority
JP
Japan
Prior art keywords
gas
compound semiconductor
ejection plate
gas ejection
pedestal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP60088927A
Other languages
English (en)
Japanese (ja)
Other versions
JPH039608B2 (enExample
Inventor
Yasuhiro Ishii
康博 石井
Yoshimoto Fujita
藤田　良基
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Oki Electric Industry Co Ltd
Original Assignee
Oki Electric Industry Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Oki Electric Industry Co Ltd filed Critical Oki Electric Industry Co Ltd
Priority to JP60088927A priority Critical patent/JPS61248517A/ja
Publication of JPS61248517A publication Critical patent/JPS61248517A/ja
Publication of JPH039608B2 publication Critical patent/JPH039608B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/20—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials
    • H10P14/24—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials using chemical vapour deposition [CVD]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/20—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials
    • H10P14/29—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials characterised by the substrates
    • H10P14/2901—Materials
    • H10P14/2922—Materials being non-crystalline insulating materials, e.g. glass or polymers
JP60088927A 1985-04-26 1985-04-26 化合物半導体薄膜の製造装置 Granted JPS61248517A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP60088927A JPS61248517A (ja) 1985-04-26 1985-04-26 化合物半導体薄膜の製造装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP60088927A JPS61248517A (ja) 1985-04-26 1985-04-26 化合物半導体薄膜の製造装置

Publications (2)

Publication Number Publication Date
JPS61248517A true JPS61248517A (ja) 1986-11-05
JPH039608B2 JPH039608B2 (enExample) 1991-02-08

Family

ID=13956536

Family Applications (1)

Application Number Title Priority Date Filing Date
JP60088927A Granted JPS61248517A (ja) 1985-04-26 1985-04-26 化合物半導体薄膜の製造装置

Country Status (1)

Country Link
JP (1) JPS61248517A (enExample)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09326365A (ja) * 1996-06-04 1997-12-16 Nippon Pillar Packing Co Ltd 縦型加熱処理装置
JP2012015476A (ja) * 2010-06-30 2012-01-19 Samsung Mobile Display Co Ltd 基板加工装置

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09326365A (ja) * 1996-06-04 1997-12-16 Nippon Pillar Packing Co Ltd 縦型加熱処理装置
JP2012015476A (ja) * 2010-06-30 2012-01-19 Samsung Mobile Display Co Ltd 基板加工装置

Also Published As

Publication number Publication date
JPH039608B2 (enExample) 1991-02-08

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