JPS6124821B2 - - Google Patents

Info

Publication number
JPS6124821B2
JPS6124821B2 JP51089114A JP8911476A JPS6124821B2 JP S6124821 B2 JPS6124821 B2 JP S6124821B2 JP 51089114 A JP51089114 A JP 51089114A JP 8911476 A JP8911476 A JP 8911476A JP S6124821 B2 JPS6124821 B2 JP S6124821B2
Authority
JP
Japan
Prior art keywords
metal wire
tip
wire
ball
bonding
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP51089114A
Other languages
English (en)
Japanese (ja)
Other versions
JPS5314650A (en
Inventor
Hisashi Yoshida
Tomio Kobayashi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP8911476A priority Critical patent/JPS5314650A/ja
Publication of JPS5314650A publication Critical patent/JPS5314650A/ja
Publication of JPS6124821B2 publication Critical patent/JPS6124821B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10W72/0711—
    • H10W72/01551—
    • H10W72/07141—
    • H10W72/07168—
    • H10W72/075—
    • H10W72/07502—
    • H10W72/07511—
    • H10W72/50—
    • H10W72/5524—

Landscapes

  • Wire Bonding (AREA)
  • Manufacture Of Metal Powder And Suspensions Thereof (AREA)
JP8911476A 1976-07-28 1976-07-28 Ball forming of alminum wire Granted JPS5314650A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP8911476A JPS5314650A (en) 1976-07-28 1976-07-28 Ball forming of alminum wire

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8911476A JPS5314650A (en) 1976-07-28 1976-07-28 Ball forming of alminum wire

Related Child Applications (2)

Application Number Title Priority Date Filing Date
JP58135806A Division JPS5946038A (ja) 1983-07-27 1983-07-27 ボンデイング装置
JP59259151A Division JPS6156425A (ja) 1984-12-10 1984-12-10 ボンデイング装置

Publications (2)

Publication Number Publication Date
JPS5314650A JPS5314650A (en) 1978-02-09
JPS6124821B2 true JPS6124821B2 (cg-RX-API-DMAC10.html) 1986-06-12

Family

ID=13961855

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8911476A Granted JPS5314650A (en) 1976-07-28 1976-07-28 Ball forming of alminum wire

Country Status (1)

Country Link
JP (1) JPS5314650A (cg-RX-API-DMAC10.html)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02195527A (ja) * 1989-01-23 1990-08-02 Mitsubishi Electric Corp 対物レンズ駆動装置

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02195527A (ja) * 1989-01-23 1990-08-02 Mitsubishi Electric Corp 対物レンズ駆動装置

Also Published As

Publication number Publication date
JPS5314650A (en) 1978-02-09

Similar Documents

Publication Publication Date Title
US5659656A (en) Semiconductor electrical heater and method for making same
KR890011036A (ko) 절연피복 와이어의 와이어 본딩방법 및 그 장치
US20060208033A1 (en) Apparatus and method for connecting coated wires
US3934108A (en) Lead bonding method and apparatus
JPS5916409B2 (ja) ワイヤボンド形成方法
JPS6124821B2 (cg-RX-API-DMAC10.html)
US6862800B2 (en) Method for connection of coated lead wire to terminal of coil bobbin
US3950631A (en) Device for welding a wire by means of thermo-compression bonding
JPS5946038A (ja) ボンデイング装置
US4489231A (en) Method for preparing electrical conductor
JPS6156425A (ja) ボンデイング装置
US4039801A (en) Method for connecting a fine wire to a connecting pin
JPS6161534B2 (cg-RX-API-DMAC10.html)
JPS62152143A (ja) バンプ形成方法
JPS6333296B2 (cg-RX-API-DMAC10.html)
JP3457196B2 (ja) ボールボンディング方法
JPS5944836A (ja) ワイヤ−ボンデイング方法
JP2758819B2 (ja) ワイヤボンディング方法
GB1447287A (en) Attachment of thin lead wires to connecting elements of electrical components
JP2904618B2 (ja) ワイヤボンダー用ボール形成装置
JP4235353B2 (ja) リード線と端子の接合方法
JPH0644585B2 (ja) 絶縁被覆ワイヤのワイヤボンデイング方法
JPH01227458A (ja) バンプ電極形成方法
US1906115A (en) Combined rail bond and clamp
JPH0158861B2 (cg-RX-API-DMAC10.html)