JPS61242021A - 露光装置 - Google Patents

露光装置

Info

Publication number
JPS61242021A
JPS61242021A JP60084106A JP8410685A JPS61242021A JP S61242021 A JPS61242021 A JP S61242021A JP 60084106 A JP60084106 A JP 60084106A JP 8410685 A JP8410685 A JP 8410685A JP S61242021 A JPS61242021 A JP S61242021A
Authority
JP
Japan
Prior art keywords
mask
substrate
pattern
stage
directions
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP60084106A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0154854B2 (enrdf_load_stackoverflow
Inventor
Junji Isohata
磯端　純二
Yoshiharu Nakamura
義治 中村
Masao Totsuka
戸塚　正雄
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Canon Inc
Original Assignee
Canon Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Canon Inc filed Critical Canon Inc
Priority to JP60084106A priority Critical patent/JPS61242021A/ja
Publication of JPS61242021A publication Critical patent/JPS61242021A/ja
Publication of JPH0154854B2 publication Critical patent/JPH0154854B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
JP60084106A 1985-04-19 1985-04-19 露光装置 Granted JPS61242021A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP60084106A JPS61242021A (ja) 1985-04-19 1985-04-19 露光装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP60084106A JPS61242021A (ja) 1985-04-19 1985-04-19 露光装置

Publications (2)

Publication Number Publication Date
JPS61242021A true JPS61242021A (ja) 1986-10-28
JPH0154854B2 JPH0154854B2 (enrdf_load_stackoverflow) 1989-11-21

Family

ID=13821266

Family Applications (1)

Application Number Title Priority Date Filing Date
JP60084106A Granted JPS61242021A (ja) 1985-04-19 1985-04-19 露光装置

Country Status (1)

Country Link
JP (1) JPS61242021A (enrdf_load_stackoverflow)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63175859A (ja) * 1987-01-16 1988-07-20 Ushio Inc 液晶基板製作の露光方式
WO1995016276A1 (fr) * 1993-12-07 1995-06-15 Kabushiki Kaisha Toshiba Afficheur et sa fabrication
JP2001312069A (ja) * 2000-04-28 2001-11-09 Canon Inc 液晶パネル用走査型露光装置および走査型露光方法
JP2008060576A (ja) * 2006-08-30 2008-03-13 Asml Netherlands Bv リソグラフィ装置及び方法
JP2009295614A (ja) * 2008-06-02 2009-12-17 Nec Electronics Corp 半導体デバイスの製造方法

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63175859A (ja) * 1987-01-16 1988-07-20 Ushio Inc 液晶基板製作の露光方式
WO1995016276A1 (fr) * 1993-12-07 1995-06-15 Kabushiki Kaisha Toshiba Afficheur et sa fabrication
US5656526A (en) * 1993-12-07 1997-08-12 Kabushiki Kaisha Toshiba Method of fabricating a display device
US5784135A (en) * 1993-12-07 1998-07-21 Kabushiki Kaisha Toshiba Display device in which display regions have non-linear boundaries and transmit light differently for the same applied voltage
JP2001312069A (ja) * 2000-04-28 2001-11-09 Canon Inc 液晶パネル用走査型露光装置および走査型露光方法
JP2008060576A (ja) * 2006-08-30 2008-03-13 Asml Netherlands Bv リソグラフィ装置及び方法
JP2009295614A (ja) * 2008-06-02 2009-12-17 Nec Electronics Corp 半導体デバイスの製造方法
US8455179B2 (en) 2008-06-02 2013-06-04 Renesas Electronics Corporation Method of forming semiconductor device by using reduction projection aligner

Also Published As

Publication number Publication date
JPH0154854B2 (enrdf_load_stackoverflow) 1989-11-21

Similar Documents

Publication Publication Date Title
US4878086A (en) Flat panel display device and manufacturing of the same
US5715037A (en) Scanning exposure apparatus
US5760881A (en) Exposure apparatus with light shielding portion for plotosensitive elements
US4708466A (en) Exposure apparatus
US4814830A (en) Flat panel display device and manufacturing of the same
KR101605567B1 (ko) 노광방법, 노광장치 및 디바이스 제조방법
JPH0584663B2 (enrdf_load_stackoverflow)
JPS61226924A (ja) 露光装置
JPH0515054B2 (enrdf_load_stackoverflow)
KR100308608B1 (ko) 위치맞춤장치및투영노광장치
US20190235389A1 (en) Multi-configuration digital lithography system
JPS61242021A (ja) 露光装置
US7256865B2 (en) Methods and apparatuses for applying wafer-alignment marks
JPH06232027A (ja) 投影露光装置
JPH0917718A (ja) 露光装置及びこれを用いたデバイス生産方法
JPH02310912A (ja) 露光方法及びその装置
WO1998006009A1 (en) Lithography system with remote multisensor alignment
JP2656204B2 (ja) マスク交換装置
JPH08339959A (ja) 位置合わせ方法
TW514982B (en) Exposing method, aligner and mask
JPS62183518A (ja) 露光装置
JPH0584664B2 (enrdf_load_stackoverflow)
JPH1152545A (ja) レチクルおよびそれによって転写されたパターンならびにレチクルと半導体ウエハとの位置合わせ方法
JPS61247026A (ja) 露光装置
JPS62183517A (ja) 露光方法