JPS6123652B2 - - Google Patents

Info

Publication number
JPS6123652B2
JPS6123652B2 JP52140001A JP14000177A JPS6123652B2 JP S6123652 B2 JPS6123652 B2 JP S6123652B2 JP 52140001 A JP52140001 A JP 52140001A JP 14000177 A JP14000177 A JP 14000177A JP S6123652 B2 JPS6123652 B2 JP S6123652B2
Authority
JP
Japan
Prior art keywords
bonding
wire
waveform
vibration
tool
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP52140001A
Other languages
English (en)
Japanese (ja)
Other versions
JPS5473562A (en
Inventor
Shunichiro Fujioka
Shunei Uematsu
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP14000177A priority Critical patent/JPS5473562A/ja
Publication of JPS5473562A publication Critical patent/JPS5473562A/ja
Publication of JPS6123652B2 publication Critical patent/JPS6123652B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07141—Means for applying energy, e.g. ovens or lasers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07531—Techniques
    • H10W72/07532—Compression bonding, e.g. thermocompression bonding
    • H10W72/07533—Ultrasonic bonding, e.g. thermosonic bonding
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped

Landscapes

  • Wire Bonding (AREA)
JP14000177A 1977-11-24 1977-11-24 Wire bonding device Granted JPS5473562A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP14000177A JPS5473562A (en) 1977-11-24 1977-11-24 Wire bonding device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP14000177A JPS5473562A (en) 1977-11-24 1977-11-24 Wire bonding device

Related Child Applications (2)

Application Number Title Priority Date Filing Date
JP58241974A Division JPS59229833A (ja) 1983-12-23 1983-12-23 超音波ワイヤボンデイング方法
JP62026241A Division JPS62234338A (ja) 1987-02-09 1987-02-09 ワイヤボンデイング装置

Publications (2)

Publication Number Publication Date
JPS5473562A JPS5473562A (en) 1979-06-12
JPS6123652B2 true JPS6123652B2 (2) 1986-06-06

Family

ID=15258616

Family Applications (1)

Application Number Title Priority Date Filing Date
JP14000177A Granted JPS5473562A (en) 1977-11-24 1977-11-24 Wire bonding device

Country Status (1)

Country Link
JP (1) JPS5473562A (2)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS55105339A (en) * 1979-02-07 1980-08-12 Toshiba Corp Ultrasonic bonding method
JPS5637640A (en) * 1979-09-05 1981-04-11 Hitachi Ltd Method and apparatus for wire bonding
JPS5784741U (2) * 1980-11-12 1982-05-25
JPS57135735U (2) * 1981-02-20 1982-08-24
JPS58210629A (ja) * 1982-06-02 1983-12-07 Marine Instr Co Ltd ボンデイング方法及びその装置

Also Published As

Publication number Publication date
JPS5473562A (en) 1979-06-12

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