JPS61234550A - チツプキヤリア - Google Patents

チツプキヤリア

Info

Publication number
JPS61234550A
JPS61234550A JP60077229A JP7722985A JPS61234550A JP S61234550 A JPS61234550 A JP S61234550A JP 60077229 A JP60077229 A JP 60077229A JP 7722985 A JP7722985 A JP 7722985A JP S61234550 A JPS61234550 A JP S61234550A
Authority
JP
Japan
Prior art keywords
cap
semiconductor component
compound
semiconductor part
heat
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP60077229A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0455337B2 (https=
Inventor
Mutsuo Tsuji
睦夫 辻
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp filed Critical NEC Corp
Priority to JP60077229A priority Critical patent/JPS61234550A/ja
Priority to FR8513819A priority patent/FR2570383B1/fr
Publication of JPS61234550A publication Critical patent/JPS61234550A/ja
Publication of JPH0455337B2 publication Critical patent/JPH0455337B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/70—Fillings or auxiliary members in containers or in encapsulations for thermal protection or control
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/68—Shapes or dispositions thereof
    • H10W70/682—Shapes or dispositions thereof comprising holes having chips therein
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07541—Controlling the environment, e.g. atmosphere composition or temperature
    • H10W72/07551—Controlling the environment, e.g. atmosphere composition or temperature characterised by changes in properties of the bond wires during the connecting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
JP60077229A 1984-09-20 1985-04-11 チツプキヤリア Granted JPS61234550A (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP60077229A JPS61234550A (ja) 1985-04-11 1985-04-11 チツプキヤリア
FR8513819A FR2570383B1 (fr) 1984-09-20 1985-09-18 Composition stable conductrice de la chaleur et bloc de dispositif semi-conducteur dans lequel cette composition est utilisee

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP60077229A JPS61234550A (ja) 1985-04-11 1985-04-11 チツプキヤリア

Publications (2)

Publication Number Publication Date
JPS61234550A true JPS61234550A (ja) 1986-10-18
JPH0455337B2 JPH0455337B2 (https=) 1992-09-03

Family

ID=13628027

Family Applications (1)

Application Number Title Priority Date Filing Date
JP60077229A Granted JPS61234550A (ja) 1984-09-20 1985-04-11 チツプキヤリア

Country Status (1)

Country Link
JP (1) JPS61234550A (https=)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0738009A (ja) * 1993-06-25 1995-02-07 Matsushita Electric Works Ltd チップキャリア
EP0786806A1 (en) * 1996-01-23 1997-07-30 Montpellier Technologies High I/O density package for high power wire-bonded IC chips and method for making the same
KR20020068208A (ko) * 2001-02-20 2002-08-27 에쓰에쓰아이 주식회사 반도체 조립체의 방열판 구조 및 그 제조 방법

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7060747B2 (en) * 2001-03-30 2006-06-13 Intel Corporation Chain extension for thermal materials

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0738009A (ja) * 1993-06-25 1995-02-07 Matsushita Electric Works Ltd チップキャリア
EP0786806A1 (en) * 1996-01-23 1997-07-30 Montpellier Technologies High I/O density package for high power wire-bonded IC chips and method for making the same
KR20020068208A (ko) * 2001-02-20 2002-08-27 에쓰에쓰아이 주식회사 반도체 조립체의 방열판 구조 및 그 제조 방법

Also Published As

Publication number Publication date
JPH0455337B2 (https=) 1992-09-03

Similar Documents

Publication Publication Date Title
US5710459A (en) Integrated circuit package provided with multiple heat-conducting paths for enhancing heat dissipation and wrapping around cap for improving integrity and reliability
KR970005712B1 (ko) 고 열방출용 반도체 패키지
KR970013239A (ko) 반도체장치 및 그 실장 구조
JPS6376444A (ja) チツプキヤリア
US5200640A (en) Hermetic package having covers and a base providing for direct electrical connection
JPS6221249A (ja) 半導体装置
JPS61234550A (ja) チツプキヤリア
JPH0326544B2 (https=)
JPH04114455A (ja) 半導体装置及びその実装構造
JP3107385U (ja) チップの封入構造
JPH0382060A (ja) 半導体装置
JPH046860A (ja) 半導体装置
JPH03266456A (ja) 半導体チップ用放熱部材及び半導体パッケージ
JP2646994B2 (ja) ヒートシンク付ピングリッドアレイ
JP2828385B2 (ja) Ｉｃパッケージの構造
JPS6221251A (ja) 多層セラミツクパツケ−ジ
JPS61193470A (ja) チツプキヤリアのチツプ搭載構造
JPH02240953A (ja) 半導体装置
JPH10326852A (ja) ベアチップ実装方法および半導体集積回路装置
JPH034039Y2 (https=)
JPH04219966A (ja) 半導体素子
JPS60213047A (ja) チツプキヤリア
JPH03101256A (ja) 半導体装置
JPH0283955A (ja) 半導体装置
JPH03292799A (ja) プリント配線板ユニットの放熱構造