JPS6123393A - 多層回路基板及びその製造方法 - Google Patents

多層回路基板及びその製造方法

Info

Publication number
JPS6123393A
JPS6123393A JP14354684A JP14354684A JPS6123393A JP S6123393 A JPS6123393 A JP S6123393A JP 14354684 A JP14354684 A JP 14354684A JP 14354684 A JP14354684 A JP 14354684A JP S6123393 A JPS6123393 A JP S6123393A
Authority
JP
Japan
Prior art keywords
via hole
conductor
ceramic green
circuit board
multilayer circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP14354684A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0137880B2 (enrdf_load_stackoverflow
Inventor
浩一 熊谷
島崎　新二
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP14354684A priority Critical patent/JPS6123393A/ja
Publication of JPS6123393A publication Critical patent/JPS6123393A/ja
Publication of JPH0137880B2 publication Critical patent/JPH0137880B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Production Of Multi-Layered Print Wiring Board (AREA)
JP14354684A 1984-07-11 1984-07-11 多層回路基板及びその製造方法 Granted JPS6123393A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP14354684A JPS6123393A (ja) 1984-07-11 1984-07-11 多層回路基板及びその製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP14354684A JPS6123393A (ja) 1984-07-11 1984-07-11 多層回路基板及びその製造方法

Publications (2)

Publication Number Publication Date
JPS6123393A true JPS6123393A (ja) 1986-01-31
JPH0137880B2 JPH0137880B2 (enrdf_load_stackoverflow) 1989-08-09

Family

ID=15341259

Family Applications (1)

Application Number Title Priority Date Filing Date
JP14354684A Granted JPS6123393A (ja) 1984-07-11 1984-07-11 多層回路基板及びその製造方法

Country Status (1)

Country Link
JP (1) JPS6123393A (enrdf_load_stackoverflow)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5093186A (en) * 1989-09-26 1992-03-03 Ngk Spark Plug Co., Ltd. Multilayer ceramic wiring board
JPH04123782U (ja) * 1991-04-23 1992-11-10 ダイハツ工業株式会社 自動車の後部車体構造

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS56147499A (en) * 1980-04-18 1981-11-16 Hitachi Ltd Method of manufacturing multilayer ceramic board

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS56147499A (en) * 1980-04-18 1981-11-16 Hitachi Ltd Method of manufacturing multilayer ceramic board

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5093186A (en) * 1989-09-26 1992-03-03 Ngk Spark Plug Co., Ltd. Multilayer ceramic wiring board
JPH04123782U (ja) * 1991-04-23 1992-11-10 ダイハツ工業株式会社 自動車の後部車体構造

Also Published As

Publication number Publication date
JPH0137880B2 (enrdf_load_stackoverflow) 1989-08-09

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