JPS61233049A - Epoxy resin molding material for sealing - Google Patents

Abstract

PURPOSE:To provide the titled composition having remarkably improved moisture resistance, by compounding zinc salt, aluminum salt and/or magnesium salt of phosphoric acid, boric acid and/or oxalic acid to a base resin. CONSTITUTION:The objective epoxy resin molding material contains at least one kind of salt selected from zinc salt, aluminum salt and magnesium salt of phosphoric acid, boric acid and oxalic acid. The salt used as the above additive is the one having an electric conductivity of <=50mus/cm and containing <=10ppm of hydrolyzable sodium ion and <=10ppm of hydrolyzable chlorine ion.

Description

DETAILED DESCRIPTION OF THE INVENTION [Technical Field] The present invention relates to an epoxy resin molding material for sealing, which is mainly used for resin molded products for sealing electrical and electronic parts.

[Background technology]

In recent years, plastic sealing has been used to make electrical and electronic equipment thinner, more reliable, and more productive. These electrical and electronic components include transistors, diodes, capacitors, filters, rectifiers, resistors, coils, etc., and recent high-density, highly integrated semiconductor ICICs have moisture resistance related to aluminum corrosion. has become a problem. As a countermeasure to this problem, attempts have been made to use molding materials with less impurities, but these have not been fully satisfactory.

[Purpose of the invention]

An object of the present invention is to provide an epoxy resin molding material for sealing that has excellent moisture resistance.

[Disclosure of the invention]

The present invention provides zinc salts, aluminum salts of phosphorous acid, boric acid, oxalic acid,
An epoxy resin molding material for sealing characterized by containing at least one type of magnesium salt, which can improve aluminum corrosion resistance and greatly improve moisture resistance. The six zinc salts, aluminum salts, and magnesium salts of phosphoric acid, boric acid, and oxalic acid used in the present invention include zinc phosphate, aluminum phosphate, dimagnesium phosphate, trimagnesium phosphate, zinc borate, and boric acid. It can contain aluminum, magnesium borate, zinc oxalate, aluminum oxalate, etc.
At least one of these is added, and preferably the electrical conductivity is 50 μ- or less, and the hydrolyzable sodium ion content and hydrolyzable chlorine ion content are each 10 ppm or less for better moisture resistance. This is desirable because it improves sexual performance. In addition, if the epoxy resin used in the present invention is a curable epoxy resin having two or more epoxy groups in one molecule, bisphenol A type epoxy resin, Noporapuku type epoxy resin, flexible epoxy resin, or halogenated epoxy resin can be used. Epoxy resins, glycidyl ester type epoxy resins, polymer type epoxy resins, etc. may be used, but there are no particular limitations. Examples of curing agents include amine curing agents, polyamide resins, aliphatic polyamines, acid anhydride curing agents, and Lewis acids. Complex compounds, phenolic resins, isocyanates, etc. can be used, and there are no particular limitations.
As the inorganic filler, use any inorganic filler such as fused silica, crystalline silica, glass fiber, glass powder, calcium silicate, calcium carbonate, alumina, clay, antimony dioxide, barium sulfate, boron nitride, silicon carbide, etc. Can be done.

As described above, in the present invention, at least one of zinc salts, aluminum salts, and magnesium salts of phosphoric acid, boric acid, and oxalic acid is added to the epoxy resin, curing agent, inorganic filler, mold release agent, coupling agent, coloring agent, etc. After one kind is added, it is mixed, kneaded, pulverized, and further granulated if necessary to obtain an epoxy resin molding material for sealing. Furthermore, regarding the molding of this molding material, it is suitable for multi-cavity molding of electronic components such as transistors, diodes, capacitors, filters, rectifiers, resistors, coils, etc. by transfer molding, injection molding, etc., as well as compression molding, etc. It is applicable.

The present invention will be explained in detail below based on examples.

The materials were blended, mixed, and kneaded according to the formulation table of Examples 1 and 2 and Conventional Example Table 1 to obtain an epoxy resin molding material for sealing. The Hypuri-Fud IC was sealed and molded with a curing time of 3 minutes.

Table 1: Talesol novolac type epoxy resin with an epoxy equivalent of 220 and a softening point of 80°C.

*2 Hydroxyl equivalent: 104, softening point: 87°C.

*3 Electrical conductivity 40 μB/as, hydrolyzability) I
Hydrolyzable chlorine ion content sppm *4 Electrical conductivity 45 μS/cIII, Hydrolyzable sodium ion content 120 pp pm, Hydrolyzable chlorine ion-containing group "PPrflm" [Effects of the invention] ] As is clear from Table 2, the moisture resistance of Examples 1 and 2 and the conventional example confirms that the performance of the epoxy resin molding material for sealing of the present invention is good and superior to that of the present invention.

*Time until IO failure occurs in the Pressure Cutcher Test (PCT) at 133°C and xootlb humidity.

Claims (2)

[Claims] (1) An epoxy resin molding material for sealing, characterized in that it contains at least one of zinc salts, aluminum salts, and magnesium salts of phosphoric acid, boric acid, and oxalic acid. (2) The electrical conductivity of the zinc salt, aluminum salt, and magnesium salt of phosphoric acid, boric acid, and oxalic acid is 50 μs/cm or less, and the hydrolyzable sodium ion content and hydrolyzable chlorine ion content are each 10 ppm or less. An epoxy resin molding material for sealing according to claim 1, characterized in that: