JPH01118562A - Epoxy resin composition for sealing semiconductor - Google Patents
Epoxy resin composition for sealing semiconductorInfo
- Publication number
- JPH01118562A JPH01118562A JP27341687A JP27341687A JPH01118562A JP H01118562 A JPH01118562 A JP H01118562A JP 27341687 A JP27341687 A JP 27341687A JP 27341687 A JP27341687 A JP 27341687A JP H01118562 A JPH01118562 A JP H01118562A
- Authority
- JP
- Japan
- Prior art keywords
- epoxy resin
- groups
- resin composition
- epoxy
- inorganic filler
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000003822 epoxy resin Substances 0.000 title claims abstract description 26
- 229920000647 polyepoxide Polymers 0.000 title claims abstract description 26
- 239000000203 mixture Substances 0.000 title claims abstract description 19
- 239000004065 semiconductor Substances 0.000 title claims description 6
- 238000007789 sealing Methods 0.000 title 1
- 239000011256 inorganic filler Substances 0.000 claims abstract description 7
- 229910003475 inorganic filler Inorganic materials 0.000 claims abstract description 7
- 150000002460 imidazoles Chemical class 0.000 claims description 9
- XYFCBTPGUUZFHI-UHFFFAOYSA-N Phosphine Chemical compound P XYFCBTPGUUZFHI-UHFFFAOYSA-N 0.000 claims description 7
- 238000005538 encapsulation Methods 0.000 claims description 4
- 229910000073 phosphorus hydride Inorganic materials 0.000 claims description 4
- 239000010680 novolac-type phenolic resin Substances 0.000 claims description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 abstract description 9
- 229920003986 novolac Polymers 0.000 abstract description 9
- 125000003700 epoxy group Chemical group 0.000 abstract description 8
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N phenol group Chemical group C1(=CC=CC=C1)O ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 abstract description 8
- RIOQSEWOXXDEQQ-UHFFFAOYSA-N triphenylphosphine Chemical compound C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1 RIOQSEWOXXDEQQ-UHFFFAOYSA-N 0.000 abstract description 8
- RAXXELZNTBOGNW-UHFFFAOYSA-N imidazole Natural products C1=CNC=N1 RAXXELZNTBOGNW-UHFFFAOYSA-N 0.000 abstract description 6
- 239000000843 powder Substances 0.000 abstract description 5
- 229920005989 resin Polymers 0.000 abstract description 5
- 239000011347 resin Substances 0.000 abstract description 5
- 125000002887 hydroxy group Chemical group [H]O* 0.000 abstract description 4
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 abstract description 3
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 abstract description 3
- LXBGSDVWAMZHDD-UHFFFAOYSA-N 2-methyl-1h-imidazole Chemical compound CC1=NC=CN1 LXBGSDVWAMZHDD-UHFFFAOYSA-N 0.000 abstract description 3
- 239000003063 flame retardant Substances 0.000 abstract description 3
- 229920001568 phenolic resin Polymers 0.000 abstract description 3
- 239000005011 phenolic resin Substances 0.000 abstract description 3
- 239000000377 silicon dioxide Substances 0.000 abstract description 3
- 238000004898 kneading Methods 0.000 abstract description 2
- ADCOVFLJGNWWNZ-UHFFFAOYSA-N antimony trioxide Chemical compound O=[Sb]O[Sb]=O ADCOVFLJGNWWNZ-UHFFFAOYSA-N 0.000 description 4
- -1 chlorine ions Chemical class 0.000 description 3
- 230000009477 glass transition Effects 0.000 description 3
- 150000003003 phosphines Chemical class 0.000 description 3
- LLEASVZEQBICSN-UHFFFAOYSA-N 2-undecyl-1h-imidazole Chemical compound CCCCCCCCCCCC1=NC=CN1 LLEASVZEQBICSN-UHFFFAOYSA-N 0.000 description 2
- 239000006229 carbon black Substances 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 2
- 239000003086 colorant Substances 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 239000006082 mold release agent Substances 0.000 description 2
- 239000004843 novolac epoxy resin Substances 0.000 description 2
- 150000002989 phenols Chemical class 0.000 description 2
- 238000001721 transfer moulding Methods 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- QTWJRLJHJPIABL-UHFFFAOYSA-N 2-methylphenol;3-methylphenol;4-methylphenol Chemical compound CC1=CC=C(O)C=C1.CC1=CC=CC(O)=C1.CC1=CC=CC=C1O QTWJRLJHJPIABL-UHFFFAOYSA-N 0.000 description 1
- WJQOZHYUIDYNHM-UHFFFAOYSA-N 2-tert-Butylphenol Chemical compound CC(C)(C)C1=CC=CC=C1O WJQOZHYUIDYNHM-UHFFFAOYSA-N 0.000 description 1
- ULKLGIFJWFIQFF-UHFFFAOYSA-N 5K8XI641G3 Chemical compound CCC1=NC=C(C)N1 ULKLGIFJWFIQFF-UHFFFAOYSA-N 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- 239000005062 Polybutadiene Substances 0.000 description 1
- 239000006087 Silane Coupling Agent Substances 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 125000001931 aliphatic group Chemical group 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 125000003118 aryl group Chemical group 0.000 description 1
- 159000000007 calcium salts Chemical class 0.000 description 1
- 239000004203 carnauba wax Substances 0.000 description 1
- 235000013869 carnauba wax Nutrition 0.000 description 1
- 239000003638 chemical reducing agent Substances 0.000 description 1
- 239000000460 chlorine Substances 0.000 description 1
- 229910052801 chlorine Inorganic materials 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 239000007822 coupling agent Substances 0.000 description 1
- 229930003836 cresol Natural products 0.000 description 1
- 229910002026 crystalline silica Inorganic materials 0.000 description 1
- 235000014113 dietary fatty acids Nutrition 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000000194 fatty acid Substances 0.000 description 1
- 229930195729 fatty acid Natural products 0.000 description 1
- 150000004665 fatty acids Chemical class 0.000 description 1
- 239000005350 fused silica glass Substances 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- 229910052736 halogen Inorganic materials 0.000 description 1
- 150000002367 halogens Chemical class 0.000 description 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 125000000962 organic group Chemical group 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 229920002857 polybutadiene Polymers 0.000 description 1
- 238000011417 postcuring Methods 0.000 description 1
- 239000011342 resin composition Substances 0.000 description 1
- 235000012239 silicon dioxide Nutrition 0.000 description 1
- 229920002545 silicone oil Polymers 0.000 description 1
- 229910001415 sodium ion Inorganic materials 0.000 description 1
- 125000001424 substituent group Chemical group 0.000 description 1
- 239000012756 surface treatment agent Substances 0.000 description 1
- 239000000454 talc Substances 0.000 description 1
- 229910052623 talc Inorganic materials 0.000 description 1
- 230000000930 thermomechanical effect Effects 0.000 description 1
- BPSIOYPQMFLKFR-UHFFFAOYSA-N trimethoxy-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CO[Si](OC)(OC)CCCOCC1CO1 BPSIOYPQMFLKFR-UHFFFAOYSA-N 0.000 description 1
- 239000001993 wax Substances 0.000 description 1
Abstract
Description
【発明の詳細な説明】
［産業上の利用分野］
本発明は半導体封止用エポキシ樹脂組成物に関するもの
である。DETAILED DESCRIPTION OF THE INVENTION [Industrial Field of Application] The present invention relates to an epoxy resin composition for semiconductor encapsulation.
［従来の技術］
半導体素子の封止には、大量生産に適するエポキシ樹脂
組成物による低圧トランスファー成形が一般的である。[Prior Art] Low-pressure transfer molding using an epoxy resin composition suitable for mass production is generally used to seal semiconductor devices.
かかるエポキシ樹脂組成物中に添加される硬化促進剤と
しては、イミダゾール類、ジアザビジグアルケン類、有
機ホスフィン類が一般に知られている。As curing accelerators added to such epoxy resin compositions, imidazoles, diazabidigalkenes, and organic phosphines are generally known.
しかしながら、これらのものをそれぞれ単独で使用する
場合、次のような問題がある。すなわち、イミダゾール
類の場合には、耐湿性及び電気特性に劣り、アルミニウ
ム電極の腐蝕が問題となる。However, when each of these is used alone, there are the following problems. That is, in the case of imidazoles, moisture resistance and electrical properties are poor, and corrosion of aluminum electrodes becomes a problem.
また、有機ホスフィル類の場合には、経済性や硬化性能
の面からトリフェニルホスフィンが一般的に使用される
が、イミダゾール類に比べてガラス転移点の低い成形物
しか得られない。ざらに、ジアザビシクロアルケン類の
場合にはその硬化性能に問題があり、具体的にはパリの
発生、ポストキュア中の収縮等の問題が生じる。Further, in the case of organic phospheres, triphenylphosphine is generally used from the viewpoint of economy and curing performance, but only molded products with a lower glass transition point than imidazoles can be obtained. In general, diazabicycloalkenes have problems with their curing performance, specifically problems such as generation of flakes and shrinkage during post-curing.
そして、これら硬化促進剤が有する個々の問題を克服す
る方法として、有機ホスフィンとジアザビシクロアルケ
ン類とを併用使用することが提案されている（特開昭６
１−８１，４２６号）が、この方法では電気特性は向上
するものの耐熱性の向上は望めない。As a method to overcome the individual problems of these curing accelerators, it has been proposed to use organic phosphines and diazabicycloalkenes in combination (Japanese Patent Application Laid-Open No. 6-111)
No. 1-81,426), although this method improves the electrical properties, no improvement in heat resistance can be expected.
［発明が解決しようとする問題点］
そこで、本発明者等は、硬化促進剤として、有機ホスフ
ィンとイミダゾール類とを所定量づつ併用使用すること
により、個々の硬化促進材が有する種々の問題を克服し
得ることを見出し、本発明に到達した。[Problems to be Solved by the Invention] Therefore, the present inventors solved the various problems that the individual curing accelerators have by using predetermined amounts of organic phosphines and imidazoles in combination as curing accelerators. We have discovered that this problem can be overcome, and have arrived at the present invention.
従って、本発明の目的は、優れた成形性を保持すると共
に、耐湿性、電気特性及び耐熱性において優れた性能を
発揮する半導体封止用エポキシ樹脂組成物を提供するこ
とにある。Therefore, an object of the present invention is to provide an epoxy resin composition for semiconductor encapsulation that maintains excellent moldability and exhibits excellent performance in moisture resistance, electrical properties, and heat resistance.
Ｅ問題点を解決するための手段］
すなわち、本発明は、エポキシ樹脂、ノボラック型フエ
フェノール樹脂、硬化促進剤及び無機充填材を含有する
エポキシ樹脂組成物において、上記硬化促進剤として、
エポキシ基に対し０．５〜１０モル％の有機ホフィン及
び０．０５〜１．０モル％のイミダゾール類を用いるこ
とを特徴とする半導体封止用エポキシ樹脂組成物である
。Means for Solving Problem E] That is, the present invention provides an epoxy resin composition containing an epoxy resin, a novolac type phephenol resin, a curing accelerator, and an inorganic filler, as the curing accelerator.
This is an epoxy resin composition for semiconductor encapsulation characterized by using 0.5 to 10 mol% of organic phofin and 0.05 to 1.0 mol% of imidazoles based on the epoxy group.
本発明で使用するエポキシ樹脂は、１分子中にエポキシ
基を２個以上有するものであり、それが脂肪族、芳香族
いずれのエポキシ樹脂でもよいが、フェノール、クレゾ
ール等の各種のフェノール類より合成されるノボラック
型エポキシ樹脂が好ましい。エポキシ樹脂中のイオン性
不純物は少ないほど好ましく、具体的には遊離のナトリ
ウムイオン及び塩素イオンがそれぞれ５ｐｐｍ以下であ
り、加水分解性ハロゲンについては５００ ｐｐｍ以下
であることが望ましい。The epoxy resin used in the present invention has two or more epoxy groups in one molecule, and it can be either an aliphatic or aromatic epoxy resin, but it can be synthesized from various phenols such as phenol and cresol. Preferred are novolak-type epoxy resins. It is preferable that the amount of ionic impurities in the epoxy resin is as small as possible; specifically, it is desirable that the amount of free sodium ions and chlorine ions is 5 ppm or less, and the amount of hydrolyzable halogen is 500 ppm or less.
ノボラック型フェノール樹脂は、硬化剤として作用する
ものでおり、１分子中にフェノール性水酸基を２個以上
有するものが用いられる。具体的には、フェノールノボ
ラック樹脂、タレゾールノボラック樹脂、ｔｅｒｔ−ブ
チルフェノールノボラック樹脂等が挙げられる。The novolak type phenolic resin acts as a curing agent, and those having two or more phenolic hydroxyl groups in one molecule are used. Specific examples include phenol novolak resin, talesol novolak resin, tert-butylphenol novolak resin, and the like.
エポキシ樹脂とノボラック型フェノール樹脂とは、エポ
キシ基とフェノール性水酸基の比が０゜７〜１．３の範
囲で使用される。The epoxy resin and the novolac type phenolic resin are used in a ratio of epoxy groups to phenolic hydroxyl groups in the range of 0.7 to 1.3.
硬化促進剤に用いられる有機ホスフィンとしては、置換
基が全て有機基である第三ホスフィン化合物が好ましく
、より好ましくはトリアリールホスフィンが用いられ、
具体的にはトリフェニルホスフィンが挙げられる。また
、イミダゾール類としては、各種置換イミダゾールが用
いられ、具体的にはイミダゾール、２−メチルイミダゾ
ール、２−エチル−４−メチルイミダゾール、２−ウン
デシルイミダゾール等があげられる。As the organic phosphine used in the curing accelerator, a tertiary phosphine compound in which all substituents are organic groups is preferable, and triarylphosphine is more preferably used,
A specific example is triphenylphosphine. Moreover, various substituted imidazoles are used as imidazoles, and specific examples include imidazole, 2-methylimidazole, 2-ethyl-4-methylimidazole, 2-undecylimidazole, and the like.
上記有機ホスフィンの使用量は、エポキシ基に対し０．
５〜１０モル％であり、好ましくは０゜８〜２．０モル
％である。これより少ないと硬化が遅くパリ等の問題が
生じ、多いと硬化が速く流動性に問題が生じ、いずれも
成形性に難がある。The amount of the organic phosphine used is 0.00% relative to the epoxy group.
It is 5 to 10 mol%, preferably 0.8 to 2.0 mol%. If the amount is less than this, curing will be slow and problems such as flaking will occur, and if it is more than this, curing will be fast and problems will arise in fluidity, and in either case, moldability will be difficult.
また、イミダゾール類の使用量は、エポキシ基に対し０
．０５〜１．０モル％であり、好ましくは０．２〜０．
５モル％である。これより多いと電気特性に難があり、
少ないとガラス転移点が下がり耐熱性に難がある。In addition, the amount of imidazoles used is 0 relative to the epoxy group.
．． 05 to 1.0 mol %, preferably 0.2 to 0.0 mol %.
It is 5 mol%. If the amount is higher than this, there will be problems with electrical characteristics.
If the amount is too low, the glass transition point will drop, resulting in poor heat resistance.
用いられる無機充填材としては、石英ガラス粉末、結晶
シリカ粉末、溶融シリカ粉末、タルク、アルミナ、ガラ
ス繊維等が挙げられるが、好ましくはシリカ粉末であり
、その使用量は組成物全体に対し６５〜８５重量％が好
ましい。Examples of the inorganic filler used include quartz glass powder, crystalline silica powder, fused silica powder, talc, alumina, glass fiber, etc., but silica powder is preferred, and the amount used is 65 to 65% of the total composition. 85% by weight is preferred.
本発明のエポキシ樹脂組成物中には、必要に応じて各種
ワックス、高級脂肪酸あるいはそのカルシウム塩等の離
型剤、カーボンブラック等の着色剤、シランカップリン
グ剤等の表面処理剤、各種シリコンオイル、ポリブタジ
ェン等の低応力化剤、ハロゲン化エポキシ樹脂、三酸化
アンチモン等の難燃剤等を配合することができる。The epoxy resin composition of the present invention may optionally contain various waxes, mold release agents such as higher fatty acids or their calcium salts, coloring agents such as carbon black, surface treatment agents such as silane coupling agents, and various silicone oils. , a stress reducing agent such as polybutadiene, a halogenated epoxy resin, a flame retardant such as antimony trioxide, etc. can be blended.
エポキシ樹脂組成物は、エポキシ樹脂、ノボラック型フ
ェノール樹脂、硬化促進剤及び無機充填材並びにその他
の必要に応じて添加される添加剤をミキサー等により混
合した後、ロール、ニーダ−等で混練することにより製
造される。The epoxy resin composition is prepared by mixing an epoxy resin, a novolac type phenolic resin, a curing accelerator, an inorganic filler, and other additives added as necessary with a mixer, etc., and then kneading with a roll, kneader, etc. Manufactured by.
［実施例］
実施例１〜６及び比較例１〜４
エポキシ当１２００のオルンクレゾールノボラックエボ
キシ樹脂（エポキシ樹脂Ａ＞８０重ｆｆ１部、臭素化フ
ェノールノボラックエポキシ樹脂（エポキシ樹脂Ｂ）２
０重組部、フェノール当量１０５のフェノールノボラッ
ク樹脂（硬化剤＞５０重量部、カルナバワックス（離型
剤）１重間部、三酸化アンチモン（難燃剤）４重量部、
γ−グリシドキシプロピルトリメトキシシラン（カップ
リング剤）１重量部、カーボンブラック（着色剤〉１重
量部及び平均粒径２０μｍの溶融粉砕シリカ（無機充填
材）４５０重量部に、硬化促進剤としてトリフェニルホ
スフィン、２−メチルイミダゾール又は２−ウンデシル
イミダゾールを第１表に示す割合で配合し、加熱ロール
で混練し、その後冷却粉砕してエポキシ樹脂組成物を得
た。[Examples] Examples 1 to 6 and Comparative Examples 1 to 4 1200 Oruncresol novolac epoxy resin per epoxy (epoxy resin A > 80 weight ff 1 part, brominated phenol novolac epoxy resin (epoxy resin B) 2
0 weight parts, phenol novolac resin with phenol equivalent weight 105 (curing agent > 50 parts by weight, carnauba wax (mold release agent) 1 weight part, antimony trioxide (flame retardant) 4 parts by weight,
1 part by weight of γ-glycidoxypropyltrimethoxysilane (coupling agent), 1 part by weight of carbon black (coloring agent), and 450 parts by weight of fused pulverized silica (inorganic filler) with an average particle size of 20 μm, as a hardening accelerator. Triphenylphosphine, 2-methylimidazole, or 2-undecylimidazole were blended in the proportions shown in Table 1, kneaded with heated rolls, and then cooled and ground to obtain an epoxy resin composition.
得られた各実施例及び比較例の樹脂組成物について、そ
れぞれトランスファー成形により成形体を製造し、ざら
に、１８０℃で６時間アフターキュアした後、第１表に
示す物性の測定を行った。For each of the obtained resin compositions of Examples and Comparative Examples, molded bodies were produced by transfer molding, and after roughly after-cured at 180°C for 6 hours, the physical properties shown in Table 1 were measured.
ガラス転移点は熱機械分析装置で測定し、吸水率は１３
３℃、３気圧の水蒸気中１００時間吸湿させて求めた。The glass transition point was measured using a thermomechanical analyzer, and the water absorption rate was 13.
It was determined by absorbing moisture in water vapor at 3°C and 3 atm for 100 hours.
結果を第１表に示す。The results are shown in Table 1.
［発明の効果］
本発明のエポキシ樹脂組成物は、良好な成形性を有して
成形時に優れた作業性を発揮するほか、優れた耐熱性、
耐湿性及び電気特性を有するものである。[Effects of the Invention] The epoxy resin composition of the present invention has good moldability and exhibits excellent workability during molding, as well as excellent heat resistance and
It has moisture resistance and electrical properties.
Claims (1)
化促進剤及び無機充填材を含有するエポキシ樹脂組成物
において、上記硬化促進剤として、エポキシ基に対し０
．５〜１０モル％の有機ホスフィン及び０．０５〜１．
０モル％のイミダゾール類を用いることを特徴とする半
導体封止用エポキシ樹脂組成物。(1) In an epoxy resin composition containing an epoxy resin, a novolac type phenolic resin, a curing accelerator, and an inorganic filler, the curing accelerator may be
．． 5-10 mol% organic phosphine and 0.05-1.
An epoxy resin composition for semiconductor encapsulation characterized by using 0 mol% of imidazoles.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP27341687A JPH01118562A (en) | 1987-10-30 | 1987-10-30 | Epoxy resin composition for sealing semiconductor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP27341687A JPH01118562A (en) | 1987-10-30 | 1987-10-30 | Epoxy resin composition for sealing semiconductor |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01118562A true JPH01118562A (en) | 1989-05-11 |
Family
ID=17527590
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP27341687A Pending JPH01118562A (en) | 1987-10-30 | 1987-10-30 | Epoxy resin composition for sealing semiconductor |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01118562A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1683841A1 (en) * | 2005-01-20 | 2006-07-26 | Rohm and Haas Company | Intumescent powder compositions and coatings made therefrom |
| JP2013166959A (en) * | 2005-12-22 | 2013-08-29 | Dow Global Technologies Llc | Curable epoxy resin composition having mixed catalyst system and laminate made therefrom |
-
1987
- 1987-10-30 JP JP27341687A patent/JPH01118562A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1683841A1 (en) * | 2005-01-20 | 2006-07-26 | Rohm and Haas Company | Intumescent powder compositions and coatings made therefrom |
| JP2013166959A (en) * | 2005-12-22 | 2013-08-29 | Dow Global Technologies Llc | Curable epoxy resin composition having mixed catalyst system and laminate made therefrom |
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