JPH05311044A - Epoxy resin molding material for sealing - Google Patents

Abstract

PURPOSE:To improve the thermal conductivity by incorporating a hygroscopic good thermal conductor coated with a silane coupling agent. CONSTITUTION:100 pts.wt. epoxy resin is mixed with 10-400 pts.wt. hygroscopic good thermal conductor coated with a silane coupling agent, and if necessary, an inorganic filler, a cross-linking agent and/or a curing agent, a cure accelerator comprising a phosphorus compound and/or a tertiary amine, a silicon compound, a coupling agent, etc., and the mixture is milled, ground and, if necessary, granulated.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a sealing epoxy resin molding material for sealing electrical parts, electronic parts, semiconductor elements and the like.

[0002]

2. Description of the Related Art In recent years, plastics have been used to improve the performance of electric and electronic devices, to improve their reliability and productivity. High thermal conductivity is strongly required. Therefore, silica and alumina fillers having high thermal conductivity are used, but the thermal conductivity of the former is 50 to 60 cal / cm. sec. ° C. ×
10 ⁻⁴ , the latter 60 to 70 cal / cm. sec. ° C.
It is about 10 ⁻⁴ .

[0003]

As described in the prior art, the thermal conductivity is 50 to 70 cal / cm.sup.2 even when silica or alumina filler having excellent high thermal conductivity is used. sec.
° C. It is about 10 ⁻⁴ . The present invention has been made in view of the above-mentioned problems in the prior art, and an object of the present invention is to provide an epoxy resin molding material for sealing which has excellent thermal conductivity.

[0004]

Means for Solving the Problems The present invention is an epoxy resin molding material for encapsulation which is characterized in that it contains a hygroscopic and good heat conductor coated with a silane coupling agent. The present invention will be described in detail below.

The epoxy resin used in the present invention is a bisphenol A type epoxy resin having two or more epoxy groups in one molecule, a bisphenol F type epoxy resin, a novolac type epoxy resin, a halogenated epoxy resin, and glycidyl. General epoxy resins such as type epoxy resin and polymer type epoxy resin can be used. Aluminum nitride, kaolin clay, graphite, etc. are used as the good heat-absorbing material, and since they have high hygroscopicity as they are, they are silane coupling agents such as vinyltrichlorosilane, vinyltrisbetamethoxyethoxysilane, gammaaminopropyltriethoxysilane. It is used after being coated with. The addition amount of the hygroscopic and good thermal conductor is preferably 10 to 400 parts with respect to 100 parts by weight of the resin (hereinafter simply referred to as “part”). That is, if it is less than 10 parts, it is difficult to improve the thermal conductivity, and if it exceeds 400 parts, the hygroscopicity tends to increase. The coating of the silane coupling agent having good hygroscopicity and good thermal conductivity is, for example, a mixture of the silane coupling agent and then dried, or a baking treatment of the silane coupling agent, but is not particularly limited. As the inorganic filler other than the hygroscopic and good thermal conductor which is added as necessary, talc, silica, calcium carbonate, aluminum hydroxide, glass fiber, asbestos fiber, ceramic fiber and the like can be used in general. It is not particularly limited. As the cross-linking agent and / or the curing agent, a phenol resin, a melamine resin, an acrylic resin, an isocyanate, an amine-based curing agent, an acid anhydride, a Lewis acid complex compound or the like is used, and it is not particularly limited. As the curing accelerator used if necessary, phosphorus-based and / or tertiary amine-based curing accelerators and the like can be used. Further, if necessary, a silicon compound, a coupling agent, or the like for reducing the stress can be added. Thus, the above materials are blended, mixed, kneaded, pulverized, and further granulated as required to obtain an epoxy resin molding material for sealing. Further, regarding molding of the molding material for sealing, sealing molding is performed by compression molding, transfer molding, injection molding or the like.

The present invention will be described below based on examples.

[0007]

[Examples 1 and 2 and Comparative Example] The materials are blended, mixed, kneaded and crushed according to the formulation table of Table 1 to obtain an epoxy resin molding material for encapsulation, and then the encapsulating molding material is transferred to a transfer molding machine. Mold temperature is 175 ℃, molding pressure is 50Kg / cm
^{2. The} element was sealed and molded with a curing time of 3 minutes. A bisphenol A type epoxy resin is used as the epoxy resin, a novolac type phenol resin is used as the phenol resin, and the hygroscopic and good thermal conductor is gamma aminopropyltriethoxysilane based on 100 parts of the hygroscopic and good thermal conductor. Two parts were baked.

The performances of Examples 1 and 2 and Comparative Example are shown in Table 2.

[0009]

[Table 1]
(Part by weight)

[0010]

[Table 2]

[0011]

The present invention is constructed as described above.
It was confirmed that the epoxy resin molding material for encapsulation having the structure described in the claims has improved thermal conductivity and is excellent in the present invention.

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Claims (1)

[Claims] 1. An epoxy resin molding material for encapsulation, which contains a hygroscopic and good thermal conductor coated with a silane coupling agent.