JPH05239320A - Molding material of epoxy resin for sealing - Google Patents

Abstract

PURPOSE:To obtain the subject material useful for sealing electric parts, electronic parts, semiconductor element, etc., having excellent adhesiveness to lead frame and moldability, containing a polysiloxane in a specific ratio. CONSTITUTION:The objective material contains 0.1-5wt.% based on whole the amount of the material of a polysiloxane (preferably one containing methyl group or benzoyl group). A bisphenol A type epoxy resin, a novolak type epoxy resin, a glycidyl type epoxy resin, etc., may be cited as the epoxy resin used for the material.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a sealing epoxy resin molding material for sealing electrical parts, electronic parts, semiconductor elements and the like.

[0002]

2. Description of the Related Art In recent years, plastics have been used to improve the performance of electrical and electronic equipment, to improve reliability and productivity, but to improve heat resistance and thermal conductivity, inorganic fillers have been used. When the amount was increased, the adhesiveness with the lead frame was deteriorated, resulting in peeling and deterioration of moisture resistance.

[0003]

As described in the prior art, when the amount of the inorganic filler is increased, the adhesiveness with the lead frame deteriorates. The present invention has been made in view of the above-mentioned problems in the prior art, and an object of the present invention is to provide an epoxy resin molding material for sealing, which has excellent adhesiveness to a lead frame.

[0004]

In the present invention, polysiloxane is contained in an amount of 0.1 to 5% by weight (hereinafter simply referred to as "%").
For the epoxy resin molding material for sealing, which is characterized by containing, it is possible to achieve the above object,
The present invention will be described in detail.

The epoxy resin used in the present invention includes bisphenol A type epoxy resin, bisphenol F type epoxy resin, novolac type epoxy resin, halogenated epoxy resin, glycidyl type epoxy resin, polymer type epoxy resin and the like. Any epoxy resin can be used.
As the polysiloxane, all polysiloxanes can be used, but it is preferable to use one containing a methyl group or a benzoyl group in terms of compatibility, and the addition amount is 0.1 to 5% of the total amount. is necessary. That is, if it is less than 0.1%, the lead frame adhesiveness is not improved, and
This is because if it exceeds%, the releasability is lowered. As the inorganic filler, any inorganic filler such as talc, clay, silica, calcium carbonate, aluminum hydroxide, glass fiber, asbestos fiber, ceramic fiber can be used and is not particularly limited. As the cross-linking agent and / or the curing agent, a phenol resin, a melamine resin, an acrylic resin, an isocyanate, an amine-based curing agent, an acid anhydride, a Lewis acid complex compound or the like is used, and it is not particularly limited. As the curing accelerator used if necessary, phosphorus-based and / or tertiary amine-based curing accelerators and the like can be used. Further, if necessary, a silicon compound, a coupling agent, or the like for reducing the stress can be added. Thus, the above materials are blended, mixed, kneaded, pulverized, and further granulated as required to obtain an epoxy resin molding material for sealing. Further, regarding molding of the molding material for sealing, sealing molding is performed by compression molding, transfer molding, injection molding or the like.

The present invention will be described below based on examples.

[0007]

[Examples 1 and 2 and Comparative Example] The materials are blended, mixed, kneaded and crushed according to the formulation table of Table 1 to obtain an epoxy resin molding material for encapsulation, and then the encapsulating molding material is transferred to a transfer molding machine. Mold temperature is 175 ℃, molding pressure is 50Kg / cm
^{2. The} element was sealed and molded with a curing time of 3 minutes. A bisphenol A type epoxy resin was used as the epoxy resin, a novolac type phenol resin was used as the phenol resin, and a methyl group-containing polysiloxane was used as the polysiloxane.

The performances of Examples 1 and 2 and Comparative Example are shown in Table 2. The lead adhesion is Kgf, and the peeling failure is the number of peeling failures in 100 moldings actually.

[0009]

[Table 1]
(Part by weight)

[0010]

[Table 2]

[0011]

The present invention is constructed as described above.
It has been confirmed that the epoxy resin molding material for encapsulation having the structure described in the claims has improved lead frame adhesiveness and moldability and is excellent in the present invention.

 ─────────────────────────────────────────────────── ─── Continuation of the front page (72) Inventor Ryuzo Hara 1048, Kadoma, Kadoma City, Osaka Prefecture Matsushita Electric Works Co., Ltd.

Claims (1)

[Claims] 1. A polysiloxane having a total amount of 0.1 to 5
An epoxy resin molding material for encapsulation, characterized in that it is contained in a weight percentage.