JPH05217705A - Epoxy resin molding material for sealing - Google Patents

Abstract

PURPOSE:To improve the adhesion with a lead frame by making it contain a specified quantity of reactants between hydrogenorganopolysiloxane and vinyl silane coupling agents. CONSTITUTION:For epoxy resin, bisphenol A type epoxy resin, bisphenol F type epoxy resin, novolak type epoxy resin, flexible epoxy resin, high molecular epoxy resin, or the like is used. As hydrogenorganopolysiloxane, the one which includes alkyl groups, phenyl groups, etc., is used, and also as vinyl silane coupling agent, the one which includes metoxy groups, etoxy groups, etc., is used. The reaction between hydrogenorganopolysiloxane and vinyl silane coupling agents is performed by heating them for 20-120min. at 50-160 deg.C, whereby the reactant is gotten, and the quantity of this reactants is 0.01-1.5wt.% of the whole, and if is under 0.1%, the crack resistance after moisture absorptive treatment hardly improves, and if it is over 1.5%, it becomes easy to cause bleed.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a sealing epoxy resin molding material for sealing electrical parts, electronic parts, semiconductor elements and the like.

[0002]

2. Description of the Related Art In recent years, plastics have been used to improve the performance of electrical and electronic equipment, as well as to improve their reliability and productivity. There was a problem that it occurred and led to a package crack.

[0003]

As described in the prior art, with the conventional material, peeling from the lead frame die pad surface occurs, which easily leads to package cracks. The present invention has been made in view of the above-mentioned problems in the prior art, and an object of the present invention is to provide an epoxy resin molding material for sealing, which has excellent adhesiveness to a lead frame.

[0004]

Means for Solving the Problems The present invention provides an encapsulating epoxy resin molding material containing a reaction product of a hydrogenoorganopolysiloxane and a vinylsilane coupling agent. The present invention will be described in detail below.

The epoxy resin used in the present invention includes bisphenol A type epoxy resin, bisphenol F type epoxy resin, novolac type epoxy resin, flexible epoxy resin, halogenated epoxy resin, glycidyl ester type epoxy resin, high All epoxy resins such as molecular type epoxy resins can be used. It is preferable to use one containing an alkyl group, a phenyl group or the like as the hydrogenoorganopolysiloxane, and to use one having a number of n of 2 to 200. As the vinyl silane coupling agent, one containing a methoxy group, an ethoxy group or the like is preferably used. The reaction between the hydrogenoorganopolysiloxane and the vinylsilane coupling agent is 50 to 1
The reaction product can be obtained by heating at 60 ° C. for 20 to 120 minutes, and the ratio of both is not particularly limited, but the addition amount of the reaction product is 0.1 to 1.5% by weight (hereinafter simply referred to as “%”). It is desirable that it is). That is, if it is less than 0.1%, it is difficult to improve the crack resistance after the moisture absorption soldering treatment,
This is because if it exceeds 1.5%, bleeding tends to occur and the appearance of the molded product tends to deteriorate. As the inorganic filler, talc, clay, silica, calcium carbonate,
Inorganic fillers such as aluminum hydroxide, glass fiber, asbestos fiber, and ceramic fiber can be used in general, and there is no particular limitation. As the cross-linking agent and / or the curing agent, phenol resin, melamine resin, acrylic resin,
Isocyanate, amine-based curing agents, acid anhydrides, Lewis acid complex compounds and the like are used without particular limitation. As the curing accelerator used if necessary, phosphorus-based and / or tertiary amine-based curing accelerators and the like can be used. Thus, the above materials are blended, mixed, kneaded, pulverized, and further granulated as required to obtain an epoxy resin molding material for sealing. Further, regarding molding of the molding material for sealing, sealing molding is performed by compression molding, transfer molding, injection molding or the like.

The present invention will be described below based on examples.

[0007]

[Examples 1 and 2 and Comparative Examples 1 and 2] Materials were compounded, mixed, kneaded and crushed according to the compounding table of Table 1 to obtain epoxy resin molding materials for encapsulation. As an epoxy resin, an epoxy equivalent of 475 was used. Bisphenol A type epoxy resin of
As the reaction product, 10 parts by weight of hydrogen organopolysiloxane (hereinafter simply referred to as “part”) was added with 2 parts of vinylsilane coupling agent, and the reaction product was heated at 80 ° C. for 90 minutes. A novolac-type phenol resin was used as. Next, the molding material for sealing was sealed and molded using a transfer molding machine at a mold temperature of 175 ° C., a molding pressure of 50 Kg / cm ² , and a curing time of 3 minutes.

[0008]

[Table 1]
(Part) The performances of Examples 1 and 2 and Comparative Examples 1 and 2 are shown in Table 2.

Adhesiveness is the adhesive strength with the lead frame.

[0010]

[Table 2]

[0011]

The present invention is constructed as described above.
It was confirmed that the epoxy resin molding material for encapsulation having the structure described in the claims has a large adhesive strength with the lead frame and is excellent in the present invention.

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Claims (2)

[Claims] 1. An epoxy resin molding material for encapsulation, which contains a reaction product of a hydrogenene organopolysiloxane and a vinylsilane coupling agent. 2. The encapsulation according to claim 1, wherein the amount of the reaction product of the hydrogen organopolysiloxane and the vinyl silane coupling agent is 0.1 to 1.5% by weight of the whole. Epoxy resin molding material.