JPH0616908A - Sealing epoxy resin molding material - Google Patents

Abstract

PURPOSE:To obtain a sealing epoxy resin molding material excellent in adhesiveness to lead wires and metallic mold releasability. CONSTITUTION:The sealing epoxy resin molding material is characterized by including a reactional product of polyethylene oxide with a modified silicone oil therein.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a sealing epoxy resin molding material for sealing electrical parts, electronic parts, semiconductor elements and the like.

[0002]

2. Description of the Related Art In recent years, plastics have been used to improve the performance of electric and electronic devices, improve their reliability, and improve their productivity. However, poor mold releasability is a problem. .
Although it is easy to solve the problem with only the mold releasability, the mold releasability could not be improved without impairing the lead adhesion.

[0003]

As described in the prior art, the conventional materials cannot improve the mold releasability without impairing the lead adhesion. The present invention has been made in view of the above problems in the prior art,
It is an object of the invention to provide an epoxy resin molding material for encapsulation which is excellent in mold releasability without impairing lead adhesion.

[0004]

The present invention has achieved the above object because it is an epoxy resin molding material for sealing which is characterized by containing a reaction product of oxidized polyethylene and modified silicone oil. The present invention will be described in detail below.

The epoxy resin used in the present invention includes bisphenol A type epoxy resin, bisphenol F type epoxy resin, novolac type epoxy resin, flexible epoxy resin, halogenated epoxy resin, glycidyl ester type epoxy resin, high All epoxy resins such as molecular type epoxy resins can be used. As the inorganic filler, any inorganic filler such as talc, clay, silica, calcium carbonate, aluminum hydroxide, glass fiber, asbestos fiber, ceramic fiber can be used and is not particularly limited. As the cross-linking agent and / or the curing agent, a phenol resin, a melamine resin, an acrylic resin, an isocyanate, an amine-based curing agent, an acid anhydride, a Lewis acid complex compound, or the like is used as necessary and is not particularly limited. As the curing accelerator used as necessary, phosphorus-based and / or 3
A primary amine-based curing accelerator or the like can be used. As the release agent, it is necessary to use a reaction product of oxidized polyethylene and modified silicone oil, and the addition amount is 0.01 to the total amount.
It is preferably 5% by weight (hereinafter simply referred to as%).
That is, if it is less than 0.01%, the releasability is not improved, and if it exceeds 5%, the lead adhesion tends to be deteriorated. If necessary, other releasing agent may be used in combination with the above reaction product. The oxidized polyethylene preferably has an acid value of 10 or more. Epoxy group as modified silicone oil,
It preferably contains an amino group and the like. The ratio of the oxidized polyethylene and the modified silicone oil is not particularly limited, and the mixture of both is treated at 60 to 180 ° C. for 20 to 1
It can be made into a reaction product by heating for 20 minutes. Thus, the above materials are blended, mixed, kneaded, pulverized, and further granulated as necessary to obtain an epoxy resin molding material for sealing. Further, regarding molding of the molding material for sealing, sealing molding is performed by compression molding, transfer molding, injection molding or the like.

The present invention will be described below based on examples.

[0007]

[Examples 1 to 3 and Comparative Example] Materials were compounded, mixed, kneaded, and pulverized according to the compounding table of Table 1 to obtain epoxy resin molding materials for sealing. The epoxy resin had an epoxy equivalent of 4
A brominated epoxy resin of 00 was used, and 20 parts by weight of an oxidized polyethylene wax having an acid value of 12 (hereinafter simply referred to as "part") and 29 parts of an epoxy equivalent of 600 epoxy-modified silicone were heated and reacted at 80 ° C for 60 minutes as a release agent for the reactant. The used one was used. As the coupling agent, γ-glycidoxypropyltrimethoxysilane was used. Next, the molding material for sealing was sealed and molded using a transfer molding machine at a mold temperature of 175 ° C., a molding pressure of 50 Kg / cm ² , and a curing time of 3 minutes.

[0008]

[Table 1]
(Part) The performances of Examples 1 to 3 and Comparative Example are shown in Table 2.

The lead adhesion is measured in Kg unit by using 42 alloy of the lead material and chromium of the lead plating material for evaluation.
The unit of the mold releasing force is Kg. The cloudiness of the mold is due to the appearance observation.

[0010]

[Table 2]

[0011]

The present invention is constructed as described above.
In the epoxy resin molding material for encapsulation having the structure described in the claims, while maintaining the lead adhesion, it has the effect of improving the mold releasability, and that the present invention is excellent. confirmed.

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Claims (2)

[Claims] 1. An epoxy resin molding material for encapsulation, which contains a reaction product of oxidized polyethylene and modified silicone oil. 2. The amount of the reaction product is 0.01 to 5% by weight of the total amount.
The epoxy resin molding material for encapsulation according to claim 1, wherein