JPH06256467A - Epoxy resin molding material for sealing - Google Patents

Abstract

PURPOSE:To obtain a material for sealing excellent in cracking resistance after a moisture absorption and soldering treatment by incorporating an epoxy resin having a 2,7-naphthalenediol diglycidyl ether skeleton. CONSTITUTION:A mixture comprising 50-100wt.%, based on the mixture, epoxy resin having a 2,7-naphthalenediol diglycidyl ether skeleton and optionally other epoxy resins (e.g. bisphenol A epoxy resin) is mixed with an inorganic filler (e.g. talc), a crosslinking agent, a curing agent (e.g. novolac phenolic resin), a cure accelerator (e.g. triphenylphosphine), etc., and the resulting mixture is ground to obtain the objective material. This material can be desirably used for sealing an electrical component, an electronic component or the like and does not peel from the face of the lead frame die pad after a moisture absorption and soldering treatment.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a sealing epoxy resin molding material for sealing electrical parts, electronic parts, semiconductor elements and the like.

[0002]

2. Description of the Related Art In recent years, plastics have been used to improve the performance of electrical and electronic equipment, improve reliability, and improve productivity. There is a problem that peeling from the die pad surface occurs and leads to package cracking.

[0003]

As described in the prior art, the conventional material has a problem in crack resistance at the time of moisture absorption soldering. The present invention has been made in view of the above problems in the prior art, and an object of the present invention is to provide an epoxy resin molding material for encapsulation which is excellent in crack resistance during a moisture absorption soldering process.

[0004]

Means for Solving the Problems The present invention is an epoxy resin molding material for encapsulation which is characterized by containing an epoxy resin having a 2.7 naphthalenediol diglycidyl ether skeleton. The present invention will be described in detail below.

The epoxy resin used in the present invention includes bisphenol A type epoxy resin, bisphenol F type epoxy resin, novolac type epoxy resin, flexible epoxy resin, halogenated epoxy resin, glycidyl ester type epoxy resin, Although it is possible to use general epoxy resins such as molecular type epoxy resins, it is necessary to contain an epoxy resin having a 2.7 naphthalenediol diglycidyl ether skeleton, and 50 to 100% by weight of the epoxy resin amount (hereinafter simply %)) Is desirable. As the inorganic filler, any inorganic filler such as talc, clay, silica, calcium carbonate, aluminum hydroxide, glass fiber, asbestos fiber, ceramic fiber can be used and is not particularly limited. As the cross-linking agent and / or the curing agent, if necessary, a phenol resin, a melamine resin, an acrylic resin, an isocyanate, an amine curing agent,
An acid anhydride, a Lewis acid complex compound or the like is used, but it is preferable to use a tetrahydroindene derivative. As the curing accelerator used as necessary, phosphorus-based and / or 3
A primary amine-based curing accelerator or the like can be used. Thus, the above materials are blended, mixed, kneaded, pulverized, and further granulated as necessary to obtain an epoxy resin molding material for sealing. Further, regarding molding of the molding material for sealing, sealing molding is performed by compression molding, transfer molding, injection molding or the like.

The present invention will be described below based on examples.

[0007]

Examples 1 and 2 and Comparative Example Materials were compounded, mixed, kneaded and crushed according to the compounding table of Table 1 to obtain an epoxy resin molding material for encapsulation. As the epoxy resin, 2.7 naphthalenediol diglycidyl was used. An ether skeleton epoxy resin and a brominated epoxy resin having an epoxy equivalent of 400 were used, a tetrahydroindene derivative having an OH group as a reactive group, and a phenol resin used was a novolac type phenol resin. Next, using a transfer molding machine, the molding material for sealing is subjected to a mold temperature of 175 ° C. and a molding pressure of 50 Kg / c.
The element was sealed and molded at m ² and a curing time of 3 minutes.

[0008]

[Table 1]
(Part) The performances of Examples 1 and 2 and Comparative Example are shown in Table 2.

The crack resistance during the moisture absorption soldering treatment is PCT
It was observed in the corrosion state of the aluminum wire in the test.

[0010]

[Table 2]

[0011]

The present invention is constructed as described above.
It was confirmed that the epoxy resin molding material for encapsulation having the structure described in the claims has good crack resistance during moisture absorption soldering treatment, and is excellent in the present invention.

Claims (2)

[Claims] 1. An epoxy resin molding material for encapsulation, which contains an epoxy resin having a 2.7 naphthalene diol diglycidyl ether skeleton. 2. The epoxy resin having a 2.7 naphthalene diol diglycidyl ether skeleton is 50 to 50 times the epoxy resin amount.
The epoxy resin molding material for encapsulation according to claim 1, which is 100% by weight.