JPH05239184A - Sealing epoxy resin molding material - Google Patents

Abstract

PURPOSE:To obtain the subject molding material, comprising a biphenyl skeletal epoxy resin and excellent in crack and heat resistances and high thermal conductivity and useful as electrical and electronic parts, etc. CONSTITUTION:The objective molding material comprises preferably 50-100wt.% biphenyl skeletal epoxy resin having >=2 epoxy groups in one molecule.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a sealing epoxy resin molding material for sealing electrical parts, electronic parts, semiconductor elements and the like.

[0002]

2. Description of the Related Art In recent years, plastics have been used to improve the performance of electrical and electronic equipment, to improve reliability and productivity, but to improve heat resistance and thermal conductivity, inorganic fillers have been used. When the amount was increased, the crack resistance at the time of soldering with moisture absorption was lowered. When reactive silicon or addition type silicon is used as a measure against this, strength is lowered, when silicon rubber is used, low stress characteristics are lowered, and when addition type silicon and a dispersant are used, there is a problem that hygroscopicity is increased.

[0003]

As described in the prior art, when the amount of the inorganic filler is increased, the crack resistance at the time of the moisture absorbing soldering process is deteriorated. The present invention has been made in view of the above problems in the prior art, and an object of the present invention is to provide an epoxy resin molding material for encapsulation which is excellent in crack resistance during a moisture absorption soldering process.

[0004]

Means for Solving the Problems The present invention is an epoxy resin molding material for encapsulation which is characterized by containing a biphenyl skeleton epoxy resin. Therefore, the above object can be achieved. The details will be described.

As the epoxy resin used in the present invention, any epoxy resin having a biphenyl skeleton having two or more epoxy groups in one molecule can be used. The amount of the biphenyl skeleton epoxy resin is preferably 50 to 100% by weight (hereinafter simply referred to as%) of the epoxy resin. Ie 5
This is because if it is less than 0%, it is difficult to improve the crack resistance at the time of soldering with moisture absorption. Other epoxy resins added as required include bisphenol A type epoxy resin, bisphenol F type epoxy resin, novolac type epoxy resin, halogenated epoxy resin, glycidyl type epoxy resin, polymer type epoxy resin. For example, all epoxy resins can be used. Talc as the inorganic filler,
Inorganic fillers such as clay, silica, calcium carbonate, aluminum hydroxide, glass fiber, asbestos fiber and ceramic fiber can be generally used without any particular limitation. As the cross-linking agent and / or the curing agent, phenol resin, melamine resin, acrylic resin, isocyanate,
Amine-based curing agents, acid anhydrides, Lewis acid complex compounds and the like are used and are not particularly limited. As the curing accelerator used if necessary, phosphorus-based and / or tertiary amine-based curing accelerators and the like can be used. Further, if necessary, a silicon compound, a coupling agent, or the like for reducing the stress can be added. Thus, the above materials are blended, mixed, kneaded, pulverized, and further granulated as required to obtain an epoxy resin molding material for sealing. Further, regarding molding of the molding material for sealing, sealing molding is performed by compression molding, transfer molding, injection molding or the like.

The present invention will be described below based on examples.

[0007]

[Examples and Comparative Examples] Materials are compounded, mixed, kneaded and pulverized according to the composition table of Table 1 to obtain an epoxy resin molding material for encapsulation, and then the molding material for encapsulation is subjected to gold molding using a transfer molding machine. Mold temperature 175 ° C., molding pressure 50 Kg / cm ² ,
The element was sealed and molded with a curing time of 3 minutes. A bisphenol A type epoxy resin was used as the epoxy resin, and a novolac type phenol resin was used as the phenol resin.

The performances of Examples and Comparative Examples are shown in Table 2. The crack resistance during the moisture absorption soldering treatment was observed in the corrosion state of the aluminum wire in the PCT test. The heat cycle property is as follows: -65 ° C for 30 minutes, 25 ° C for 5 minutes, then 150
Holding at 30 ° C. for 30 minutes is set as one cycle, and the number of times until occurrence of defects is shown.

[0009]

[Table 1]
(Part by weight)

[0010]

[Table 2]

[0011]

The present invention is constructed as described above.
It has been confirmed that the epoxy resin molding material for encapsulation having the structure described in the claims has excellent crack resistance during moisture-absorption soldering and is excellent in the present invention.

Claims (1)

[Claims] 1. An epoxy resin molding material for encapsulation, which contains a biphenyl skeleton epoxy resin.