JPH04270723A - Sealing epoxy resin molding material - Google Patents

Abstract

PURPOSE:To obtain a sealing epoxy resin molding material having low stress properties by including 0.01-5wt.% fluorine-based surfactant therein and providing compatible adhesion and moldability. CONSTITUTION:A sealing epoxy resin molding material is obtained by blending a curable epoxy resin such as a bisphenol A type or a novolak type epoxy resin having >=2 epoxy groups in one molecule with a curing agent and/or a crosslinking agent such as a phenolic resin or a melamine resin, a curing accelerator such as a phosphorus-based or a tertiary amine-based curing accelerator, an inorganic powdery filler such as talc or clay, a fibrous filler such as glass fibers or pulp fibers and a fluorine-based surfactant such as acrylic acid or methacrylic acid having a fluorinated alkyl ester structure possessing an alkyl group in an amount of 0.01-5wt.% based on the whole, mixing and kneading the resultant blend and further, as necessary, granulating the prepared kneaded blend. The resultant molding material is then molded by using transfer molding, injection molding, etc.

Description

[Detailed description of the invention]

0001

[Industrial Application Field] The present invention is applicable to electrical parts, electronic parts,
This invention relates to epoxy resin molding materials for sealing semiconductor chips and the like.

0002

[Background Art] In recent years, the performance of electrical equipment and electronic equipment has improved,
In order to improve reliability and productivity, plastic sealing has come to be used. In these molding materials for encapsulation, adhesion and adhesion between the lead frame, the chip, and the molding material for encapsulation are important. For this reason, attempts have been made to reduce the amount of mold release agent in the molding material for sealing, but this has the disadvantage that reducing the amount of mold release agent significantly reduces mold releasability and worsens molding workability.

0003

[Problems to be Solved by the Invention] As mentioned in the prior art, in the conventional epoxy resin molding materials for sealing,
It has been extremely difficult to achieve both adhesion and moldability. The present invention has been made in view of the above-mentioned problems in the prior art, and its object is to provide an epoxy resin molding material for sealing that has excellent adhesion and moldability.

0004

[Means for Solving the Problems] The present invention provides an epoxy resin molding material for sealing characterized by containing 0.01 to 5% by weight (hereinafter simply referred to as %) of a fluorosurfactant. Having achieved the object, the present invention will now be described in detail.

[0005] As the epoxy resin used in the present invention, 1
Curable epoxy resins having two or more epoxy groups in the molecule include bisphenol A epoxy resins, novolac epoxy resins, flexible epoxy resins,
Any of halogenated epoxy resins, glycidyl ester type epoxy resins, polymer type epoxy resins, etc. may be used, and there are no particular limitations. Examples of curing agents and/or crosslinking agents include phenolic resins, melamine resins, acrylic resins, urea resins, isocyanates, aliphatic polyamines, polyamide resins, amine-based curing agents such as aromatic diamines, acid anhydride curing agents, Lewis acid complex compounds, etc. is used. As the curing accelerator, phosphorus-based and/or tertiary amine-based curing accelerators can be used, and are not particularly limited. Fillers include inorganic powder fillers such as talc, clay, silica, calcium carbonate, and aluminum hydroxide, and fibrous fillers such as glass fiber, asbestos fiber, pulp fiber, synthetic fiber, and ceramic fiber, either alone or in combination. However, if necessary, the surface of the filler can be treated with a coupling agent. As the fluorine-based surfactant, those having a fluorinated alkyl ester structure having an alkyl group, such as acrylic acid and methacrylic acid, are preferable. The amount of the fluorosurfactant added is preferably 0.01 to 5% of the total amount. That is, if it is less than 0.01%, moldability tends to decrease, and if it exceeds 5%, adhesion tends to decrease. The above-mentioned materials are mixed, kneaded, and further granulated if necessary to obtain an epoxy resin molding material for sealing. Transfer molding, compression molding, injection molding, etc. can be used for molding the molding material.

The present invention will be explained below based on examples.

[0007]

[Examples 1 to 3 and Comparative Example] The epoxy resin molding material for sealing was obtained by blending, mixing, kneading, and pulverizing the materials based on the recipe in Table 1. The epoxy resin had an epoxy equivalent of 220 , an epoxy resin with a softening point of 80°C was used. For phenolic resin, the hydroxyl equivalent is 104 and the softening point is 87.
°C using phenolic resin. As for silica, crystalline silica was used. As for the fluorine-based surfactant, a fluorinated alkyl ester surfactant was used. As for the curing accelerator, imidazole acid anhydride was used. Next, using the epoxy resin molding material for sealing, the semiconductor chip was
It was sealed and molded at ℃ for 3 minutes. The performance of the molding materials of Examples 1 to 3 and the comparative example was
As shown in the table, adhesion was measured using an ultrasonic flaw detector for adhesion failures of 20 samples after the moisture absorption soldering test, and the number of failures of 40 samples after 100 hours at 2 atmospheres was measured for the PCT test.

[0008]

[0009]

[Effects of the Invention] The present invention is constructed as described above. The epoxy resin molding material for sealing having the configuration described in the claims had good adhesion and moldability, confirming the superiority of the present invention.

Claims (1)

[Claims] 1. An epoxy resin molding material for sealing, characterized in that it contains 0.01 to 5% by weight of a fluorosurfactant.