JPH05230178A - Epoxy resin molding material for sealing - Google Patents

Abstract

PURPOSE:To obtain the subject molding material containing a silicone-modified epoxy resin, a silicone-modified novolak type phenol resin and an inorganic filler, excellent in heat resistance, high thermal conductivity and crack resistance and useful for electrical and electronic parts. CONSTITUTION:The objective molding material contains (A) a silicone-modified epoxy resin which is a reaction product of an aminosilicone-modified epoxy resin and a vinyl group-containing silicone and a hydrodienesilicone and (B) a silicone-modified novolak type phenol resin which is a reaction product of an epoxysilicone-modified phenol resin, a vinyl group-containing silicone and a hydrodienesilicone and (C) an inorganic filter such as talc.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a sealing epoxy resin molding material for sealing electrical parts, electronic parts, semiconductor elements and the like.

[0002]

2. Description of the Related Art In recent years, plastics have been used to improve the performance of electrical and electronic equipment, to improve reliability and productivity, but to improve heat resistance and thermal conductivity, inorganic fillers have been used. When the amount was increased, the crack resistance and the moldability at the time of the moisture absorbing solder treatment were lowered. When reactive silicon or addition type silicon is used as a measure against this, strength is lowered, when silicon rubber is used, low stress characteristics are lowered, and when addition type silicon and a dispersant are used, there is a problem that hygroscopicity is increased.

[0003]

As described in the prior art, when the amount of the inorganic filler is increased, the crack resistance and the moldability at the time of the hygroscopic soldering process are deteriorated. The present invention has been made in view of the above problems in the prior art, and its object is to provide a sealing epoxy having excellent heat resistance, high thermal conductivity, crack resistance during moisture absorption soldering, and moldability. To provide a resin molding material.

[0004]

DISCLOSURE OF THE INVENTION The present invention provides a sealing epoxy resin molding material containing a silicon-modified epoxy resin, a silicon-modified novolac-type phenol resin, and an inorganic filler. The present invention has been accomplished, and the present invention will be described in detail below.

The silicone-modified epoxy resin used in the present invention is a reaction product of aminosilicon-modified epoxy resin, vinyl group-containing silicone and hydrogen silicone. Amino silicone modified epoxy resin has an amino equivalent of 70
It is an epoxy resin having a biphenyl skeleton to which 0 to 10000, preferably 2000 to 4000 aminosilicone is added. The vinyl group-containing silicon is one having two or more vinyl groups directly bonded to a silicon atom in one molecule. Hydrogen silicon has two or more hydrogen atoms directly bonded to silicon atoms in one molecule. The reaction of aminosilicon modified epoxy resin, vinyl group-containing silicone, and hydrogen silicone is 50 to 16
The reaction product can be obtained by heating at 0 ° C. for 20 to 120 minutes. As silicone modified novolac type phenolic resin, epoxy silicone modified phenolic resin,
It is a reaction product of vinyl group-containing silicon and hydrogen silicon. The epoxy silicon-modified phenol resin may be a phenol resin to which epoxy silicon is added, but it is preferable to use a novolac type phenol resin as the phenol resin. The vinyl group-containing silicon is one having two or more vinyl groups directly bonded to a silicon atom in one molecule. Hydrogen silicon has two or more hydrogen atoms directly bonded to silicon atoms in one molecule. The reaction of the aminosilicon-modified epoxy resin, vinyl group-containing silicone, and hydrogen silicone can be performed by heating at 50 to 160 ° C. for 20 to 120 minutes to obtain a reaction product. As the inorganic filler, any inorganic filler such as talc, clay, silica, calcium carbonate, aluminum hydroxide, glass fiber, asbestos fiber, ceramic fiber can be used and is not particularly limited. As the cross-linking agent and / or the curing agent, a phenol resin, a melamine resin, an acrylic resin, an isocyanate, an amine-based curing agent, an acid anhydride, a Lewis acid complex compound or the like is used, but at least the above silicon-modified novolac-type phenol resin is contained. It is necessary. As the curing accelerator used if necessary, phosphorus-based and / or tertiary amine-based curing accelerators and the like can be used. Further, a coupling agent or the like can be added if necessary. Thus, the above materials are blended, mixed, kneaded, pulverized, and further granulated as required to obtain an epoxy resin molding material for sealing. Further, regarding molding of the molding material for sealing, sealing molding is performed by compression molding, transfer molding, injection molding or the like.

The present invention will be described below based on examples.

[0007]

EXAMPLES AND COMPARATIVE EXAMPLES 1 TO 3 The materials were blended, mixed, kneaded and pulverized in accordance with the blending table shown in Table 1 to obtain epoxy resin molding materials for sealing. 15 parts of vinyl group-containing silicon and 15 parts of hydrogen silicone are added to 70 parts by weight of biphenyl skeleton epoxy resin (hereinafter simply referred to as “part”) to which aminosilicon is added, and the mixture is heated at 80 ° C. for 90 minutes to produce a reaction product. And As the silicone-modified novolac-type phenol resin, 10 parts of vinyl group-containing silicon and 10 parts of hydrogen silicone were added to 80 parts of epoxy silicone-modified phenol resin, and the mixture was heated at 90 ° C. for 40 minutes to obtain a reaction product. Next, the molding material for sealing was sealed and molded using a transfer molding machine at a mold temperature of 175 ° C., a molding pressure of 50 Kg / cm ² , and a curing time of 3 minutes.

The performance of Examples and Comparative Examples 1 to 3 is the second
It looks like a table. Crack resistance during moisture absorption solder treatment is P
It was observed in the state of corrosion of the aluminum wire in the CT test. The heat cycle property was shown by the number of times until the occurrence of defects, with 30 cycles at -65 ° C, holding at 25 ° C for 5 minutes, and holding at 150 ° C for 30 minutes as one cycle. Also, the moldability was examined by a spiral flow test.

[0009]

The present invention is constructed as described above.
In the epoxy resin molding material for encapsulation having the structure described in the claims, while maintaining heat resistance and high thermal conductivity, it has the effect of improving crack resistance and moldability at the time of moisture absorbing solder treatment. ing.

 ─────────────────────────────────────────────────── ─── Continuation of the front page (72) Inventor Muneasa Torii 1048, Kadoma, Kadoma City, Osaka Prefecture Matsushita Electric Works Co., Ltd.

Claims (3)

[Claims] 1. An epoxy resin molding material for encapsulation, comprising a silicon-modified epoxy resin, a silicon-modified novolac type phenol resin, and an inorganic filler. 2. The epoxy resin molding material for encapsulation according to claim 1, wherein the silicone-modified epoxy resin is a reaction product of aminosilicon-modified epoxy resin, vinyl group-containing silicon, and hydrogen silicone. 3. The encapsulating epoxy resin molding material according to claim 1, wherein the silicon-modified novolac-type phenol resin is a reaction product of an epoxy-silicon-modified phenol resin, vinyl group-containing silicon, and hydrogen silicone.