JPH05239185A - Sealing epoxy resin molding material - Google Patents

Abstract

PURPOSE:To obtain the subject molding material, comprising methylenebis(methyl-t-butylphenol), excellent in reliability of withstand voltage in moisture and useful as electrical and electronic parts, etc. CONSTITUTION:The objective molding material comprises 2,2-methylenebis(4- methyl-6-t-butylphenol) in an amount of 1-30 pts.wt. based on 100 pts.wt. resin such as bisphenol A type epoxy resin.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a sealing epoxy resin molding material for sealing electrical parts, electronic parts, semiconductor elements and the like.

[0002]

2. Description of the Related Art In recent years, plastics have been used to improve the performance of electric and electronic devices, improve reliability, and improve productivity. However, it has not been possible to improve the actual device reliability because it has no remarkable effect.

[0003]

As described in the prior art, it has not been possible to satisfy the reliability in withstanding pressure in humidity. The present invention has been made in view of the above-mentioned problems in the prior art, and an object of the present invention is to provide an epoxy resin molding material for encapsulation that can satisfy the reliability in pressure and humidity.

[0004]

The present invention provides 2.2 methylenebis (4.methyl.6.6.tert-butylphenol).
Since the epoxy resin molding material for encapsulation is characterized by containing, it is possible to achieve the above object, and the present invention will be described in detail below.

The epoxy resin used in the present invention includes bisphenol A type epoxy resin, bisphenol F type epoxy resin, novolac type epoxy resin, halogenated epoxy resin, glycidyl type epoxy resin, polymer type epoxy resin and the like. Any epoxy resin can be used.
The addition amount of 2.2 methylenebis (4.methyl.6.tertiarybutylphenol) is preferably 1 to 30 parts with respect to 100 parts by weight of the resin (hereinafter simply referred to as “part”). That is, if it is less than 1 part, it is difficult to improve the pressure resistance reliability in humidity.
This is because if it exceeds 0 part, the strength tends to decrease.
2.2 Methylenebis (4.methyl.6.tertiarybutylphenol) may be added directly, but it is preferable to add it in the form of a masterbatch preheated and melted with the epoxy resin. As the inorganic filler, talc, clay, silica, calcium carbonate, aluminum hydroxide,
Inorganic fillers such as glass fibers, asbestos fibers, ceramic fibers and the like can be used in general and are not particularly limited. As the cross-linking agent and / or the curing agent, a phenol resin, a melamine resin, an acrylic resin, an isocyanate, an amine-based curing agent, an acid anhydride, a Lewis acid complex compound or the like is used, and it is not particularly limited. As the curing accelerator used if necessary, phosphorus-based and / or tertiary amine-based curing accelerators and the like can be used. Further, if necessary, a silicon compound, a coupling agent, or the like for reducing the stress can be added. Thus, blending and mixing the above materials,
The epoxy resin molding material for encapsulation is obtained by kneading, pulverizing and further granulating as required. Further, regarding molding of the molding material for sealing, sealing molding is performed by compression molding, transfer molding, injection molding or the like.

The present invention will be described below based on examples.

[0007]

[Examples 1 and 2 and Comparative Example] The materials are blended, mixed, kneaded and crushed according to the formulation table of Table 1 to obtain an epoxy resin molding material for encapsulation, and then the encapsulating molding material is transferred to a transfer molding machine. Mold temperature is 175 ℃, molding pressure is 50Kg / cm
^{2. The} element was sealed and molded with a curing time of 3 minutes. A bisphenol A type epoxy resin is used as the epoxy resin, a novolac type phenol resin is used as the phenol resin, and 2.2 methylenebis (4.methyl.
6. (Tert-butylphenol) was used.

The performances of Examples 1 and 2 and Comparative Example are shown in Table 2. USPCBT is 50% defective arrival time and melt viscosity is poise at 150 ° C.

[0009]

[Table 1]
(Part by weight)

[0010]

[Table 2]

[0011]

The present invention is constructed as described above.
It was confirmed that the epoxy resin molding material for encapsulation having the structure described in the scope of claims has improved pressure resistance in humidity and is excellent in the present invention.

Claims (2)

[Claims] 1. An epoxy resin molding material for encapsulation, which contains 2.2 methylenebis (4.methyl.6.6.tert-butylphenol). 2. The amount of 2.2 methylenebis (4.methyl.6.6.tert-butylphenol) is 1 to 30 parts by weight with respect to 100 parts by weight of the resin.
The epoxy resin molding material for encapsulation according to [4].