JPS61230397A - 高熱伝導多層セラミツク配線基板 - Google Patents

高熱伝導多層セラミツク配線基板

Info

Publication number
JPS61230397A
JPS61230397A JP60072165A JP7216585A JPS61230397A JP S61230397 A JPS61230397 A JP S61230397A JP 60072165 A JP60072165 A JP 60072165A JP 7216585 A JP7216585 A JP 7216585A JP S61230397 A JPS61230397 A JP S61230397A
Authority
JP
Japan
Prior art keywords
substrate
multilayer ceramic
high heat
ceramic wiring
wiring substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP60072165A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0523077B2 (enrdf_load_stackoverflow
Inventor
嶋田　勇三
泰弘 黒川
和明 内海
秀男 高見沢
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp filed Critical NEC Corp
Priority to JP60072165A priority Critical patent/JPS61230397A/ja
Publication of JPS61230397A publication Critical patent/JPS61230397A/ja
Publication of JPH0523077B2 publication Critical patent/JPH0523077B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H05K3/4626—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials
    • H05K3/4629—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials laminating inorganic sheets comprising printed circuits, e.g. green ceramic sheets
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/4673—Application methods or materials of intermediate insulating layers not specially adapted to any one of the previous methods of adding a circuit layer
    • H05K3/4676—Single layer compositions

Landscapes

  • Parts Printed On Printed Circuit Boards (AREA)
  • Laminated Bodies (AREA)
  • Ceramic Products (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
JP60072165A 1985-04-05 1985-04-05 高熱伝導多層セラミツク配線基板 Granted JPS61230397A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP60072165A JPS61230397A (ja) 1985-04-05 1985-04-05 高熱伝導多層セラミツク配線基板

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP60072165A JPS61230397A (ja) 1985-04-05 1985-04-05 高熱伝導多層セラミツク配線基板

Publications (2)

Publication Number Publication Date
JPS61230397A true JPS61230397A (ja) 1986-10-14
JPH0523077B2 JPH0523077B2 (enrdf_load_stackoverflow) 1993-03-31

Family

ID=13481356

Family Applications (1)

Application Number Title Priority Date Filing Date
JP60072165A Granted JPS61230397A (ja) 1985-04-05 1985-04-05 高熱伝導多層セラミツク配線基板

Country Status (1)

Country Link
JP (1) JPS61230397A (enrdf_load_stackoverflow)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62275079A (ja) * 1986-05-22 1987-11-30 日立金属株式会社 表面被覆ＡｌＮ系セラミツクス
US5298333A (en) * 1988-09-06 1994-03-29 Gkss-Forschungszentrum Geesthacht Gmbh Conductive surface layer

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62275079A (ja) * 1986-05-22 1987-11-30 日立金属株式会社 表面被覆ＡｌＮ系セラミツクス
US5298333A (en) * 1988-09-06 1994-03-29 Gkss-Forschungszentrum Geesthacht Gmbh Conductive surface layer

Also Published As

Publication number Publication date
JPH0523077B2 (enrdf_load_stackoverflow) 1993-03-31

Similar Documents

Publication Publication Date Title
JPH0452000B2 (enrdf_load_stackoverflow)
JPS60253294A (ja) 多層セラミツク基板
JPS61230397A (ja) 高熱伝導多層セラミツク配線基板
JPS6310594A (ja) 高熱伝導多層セラミツク配線基板
JPH0544840B2 (enrdf_load_stackoverflow)
JPS6276596A (ja) 多層セラミツク配線基板
JPH0443440B2 (enrdf_load_stackoverflow)
JPS6284594A (ja) 多層セラミツク配線基板
JPS63292693A (ja) 高熱伝導多層セラミック配線基板
JPS6276594A (ja) 多層セラミツク配線基板
JPS6276595A (ja) 多層セラミツク配線基板
JPS6276592A (ja) 多層セラミツク配線基板
JPH0415637B2 (enrdf_load_stackoverflow)
JPS6271294A (ja) 多層セラミツク配線基板
JPH0445997B2 (enrdf_load_stackoverflow)
JPS6273797A (ja) 多層セラミツク配線基板
JPS6276589A (ja) 多層セラミツク配線基板
JP3171695B2 (ja) 窒化アルミニウム回路基板の製造方法
JPS6276593A (ja) 多層セラミツク配線基板
JP2754806B2 (ja) 窒化アルミニウム基板用導体ペースト
JPH0415638B2 (enrdf_load_stackoverflow)
JPS61230399A (ja) 高熱伝導多層セラミツク配線基板の製造方法
JPH0415640B2 (enrdf_load_stackoverflow)
JPH0443439B2 (enrdf_load_stackoverflow)
JPS6285495A (ja) 多層セラミツク配線基板

Legal Events

Date Code Title Description
EXPY Cancellation because of completion of term