JPS6122363U - Film composition of bonding pad - Google Patents
Film composition of bonding padInfo
- Publication number
- JPS6122363U JPS6122363U JP10521084U JP10521084U JPS6122363U JP S6122363 U JPS6122363 U JP S6122363U JP 10521084 U JP10521084 U JP 10521084U JP 10521084 U JP10521084 U JP 10521084U JP S6122363 U JPS6122363 U JP S6122363U
- Authority
- JP
- Japan
- Prior art keywords
- bonding pad
- film composition
- wiring
- film
- conductor film
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/02—Bonding areas ; Manufacturing methods related thereto
- H01L24/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
- H01L24/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/02—Bonding areas; Manufacturing methods related thereto
- H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
- H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
- H01L2224/05001—Internal layers
- H01L2224/05005—Structure
- H01L2224/05009—Bonding area integrally formed with a via connection of the semiconductor or solid-state body
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/02—Bonding areas; Manufacturing methods related thereto
- H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
- H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
- H01L2224/0554—External layer
- H01L2224/0555—Shape
- H01L2224/05556—Shape in side view
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/02—Bonding areas; Manufacturing methods related thereto
- H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
- H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
- H01L2224/0554—External layer
- H01L2224/0555—Shape
- H01L2224/05556—Shape in side view
- H01L2224/05558—Shape in side view conformal layer on a patterned surface
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Wire Bonding (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Abstract] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第１区は本考案のワイヤポンデイングパット部の膜構成
の断面図であり、第２図は従来のワイヤボンデイングパ
ッド部の膜構成断面図である。
１・・・・・・セラミック基板、２・・・・・・抵抗体
膜、３・・・・・・第一配線クローム導体膜、４・・・
・・・第二配線アルミニウム導体膜、５・・・・・・層
間絶縁膜、６・・・・・・上部電極（金層を含む）、３
１，４１．６１・・・・・・スルーホール開孔後の各々
の膜のスルーホール表面。Section 1 is a cross-sectional view of the film structure of the wire bonding pad portion of the present invention, and FIG. 2 is a cross-sectional view of the film structure of the conventional wire bonding pad portion. DESCRIPTION OF SYMBOLS 1... Ceramic substrate, 2... Resistor film, 3... First wiring chrome conductor film, 4...
... Second wiring aluminum conductor film, 5 ... Interlayer insulating film, 6 ... Upper electrode (including gold layer), 3
1,41.61... Through-hole surface of each membrane after through-hole opening.
Claims (1)
配線アルミニウム導体膜の２層構造とし、スルホール部
のみを第一配線クローム導体膜たけの１層構造としてボ
ンデイングパツド部の表面を平坦化するようにしたこと
を特徴とするボンデイングパツドの膜構成。The bonding pad part has a two-layer structure of the first wiring chrome conductor film and the second wiring aluminum conductor film, and only the through-hole part has a single-layer structure of the first wiring chrome conductor film to flatten the surface of the bonding pad part. The film structure of the bonding pad is characterized by:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10521084U JPS6122363U (en) | 1984-07-13 | 1984-07-13 | Film composition of bonding pad |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10521084U JPS6122363U (en) | 1984-07-13 | 1984-07-13 | Film composition of bonding pad |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6122363U true JPS6122363U (en) | 1986-02-08 |
Family
ID=30664545
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10521084U Pending JPS6122363U (en) | 1984-07-13 | 1984-07-13 | Film composition of bonding pad |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6122363U (en) |
-
1984
- 1984-07-13 JP JP10521084U patent/JPS6122363U/en active Pending
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