JPS61220413A - Manufacture of electrolytic capacitor - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION [Industrial Application Field] The present invention relates to a method of manufacturing an electrolytic capacitor, and particularly to a method of manufacturing an electrolytic capacitor that is compatible with surface mounting on a substrate.

[Conventional technology]

In recent years, with the automation and high integration of electronic component mounting processes,
There is a demand for leadless electronic components that can be surface mounted on substrates.

Generally, when making an electrolytic capacitor leadless, there is a method described in Japanese Patent Laid-Open No. 59-211213 and shown in FIG. 2. That is, the insulating plate 13 is arranged on the end face of the electrolytic capacitor 1, and the leads 8 are inserted into the through holes 16 provided in the insulating plate 13.Then, the leads 8 are protruded from the back side of the insulating plate 13, and the leads 8 are inserted into the through holes 16 provided in the insulating plate 13. It is bent along the back surface to form a substantially flat surface on the back surface of the insulating plate 13.

In such a conventional manufacturing method of the leadless electrolytic capacitor 1, the conventional structure is not changed (the substrate 14
The electrolytic capacitor 1 that enables surface mounting can be easily manufactured.

[Problem to be solved]

However, when manufacturing a leadless electrolytic capacitor 1 using a conventional manufacturing method, the diameter size ranges from 0.2 to 0.4.
It was necessary to bend the lead 8, which was as small as a crane.

Therefore, by this bending process, the capacitor element 2
Mechanical stress is applied to the parts 8, or the parts 8 may be damaged, which complicates the manufacturing process. Also,
The insulating plate 13 and the electrolytic capacitor 1 are simply connected by bending the lead 8 and mooring it. Therefore, the mechanical strength is weak, and there is a possibility that the electrolytic capacitor 1 and the insulating plate 13 may come apart during the mounting process on the board 14.

Further, in the electrolytic capacitor 1 obtained by the conventional manufacturing method, only the portion 8 leading from the electrolytic capacitor 1 is in electrical contact with the conductor portion 15 of the substrate 14. Therefore, the contact area between the electrolytic capacitor 1 and the conductor portion 15 must be narrowed, and therefore, it may be considered to form the tips of the leads 8 in a flat shape in advance. However, still,
It is difficult to provide a sufficient contact area, and the process of forming the leads 8 into a flat shape is complicated and difficult.

Furthermore, when a general electronic component is mounted on a board by reflow soldering or the like, the solder 17 is welded so as to creep up onto the end surface of the lead 8, as shown in FIG. Therefore, if the area of the end face of the lead 8 is small, the conductor portion 1 of the substrate 14
In some cases, the electrical connection between the lead 5 and the lead 8 becomes defective.

Therefore, it is conceivable to bend the tips of the leads B located on the back surface of the insulating plate 13 from the back surface of the insulating plate 13 along the side surfaces, but this process is complicated because the leads 8 are minute.

An object of the present invention is to realize a single-dress electrolytic capacitor that can be surface mounted on a substrate without changing the structure of a conventional electrolytic capacitor.

[Means to solve problems]

In this invention, a piece-shaped terminal made of a solderable metal and having a through hole formed in the center and an insulating plate made of a heat-resistant synthetic resin are integrally molded on both sides of the insulating plate. The electrode plate is placed on the outer surface of the sealing body attached to the opening of the exterior case in which the capacitor element is housed, and the lead led from the capacitor element is inserted into the through hole provided in the terminal of the electrode plate. The feature is that the terminals and leads are connected by pressing both sides of a set of plates.

〔Example〕

Embodiments of the present invention will be described below with reference to the drawings.

FIG. 1 is a partial cross-sectional view showing a first embodiment of the invention;
FIG. 3 is a perspective view showing the external shape of the electrode plate used in the first embodiment. FIG. 4 is a perspective view showing a second embodiment of the invention.

In FIG. 1, an electrolytic capacitor 1 is formed by housing a capacitor element 2 formed by winding an electrode foil 3 and an electrolytic paper 4 in a bottomed cylindrical outer case 5 made of aluminum or the like. A sealing body 6 made of elastic rubber or the like is placed in the opening of the exterior case 5.

The lead 8 is electrically connected to the electrode foil 3, penetrates the sealing body 6, and projects from the end surface of the sealing body 6 to the outside.

On the outer surface of the sealing body 6 of the electrolytic capacitor 1, an electrode plate 9 as shown in FIG. 3 is arranged. This electrode plate 9 is
It consists of an insulating plate 1o made of a heat-resistant synthetic resin such as polyethylene terephthalate or epoxy, and a piece-shaped terminal 11 made of copper, iron, etc. that can be soldered, and the terminals 11 are integrated on both opposing sides of the insulating plate 10. Consisting of a molded configuration.

The terminal 11 of the electrode plate 9 also has a through hole 12 near the center.
is formed. The through hole 12 penetrates from the top surface to the back surface of the electrode plate 9 and is formed to have approximately the same diameter as the lead 8 of the electrolytic capacitor 1 .

To join the electrode plate 9 and the electrolytic capacitor 1, as shown in FIG. 3, first, the upper surface of the electrode plate 9 is placed so as to face the outer surface of the sealing body 6 of the electrolytic capacitor l. At the same time, a portion 8 of the electrolytic capacitor 1 is inserted into the through hole 12 provided in the terminal 11 of the electrode plate 9.
Crimp the sides of the electrode plate 9 from the direction of the lead 8 and the terminal 1.
Connect with 1. Note that this crimping may be performed from a direction perpendicular to the direction of arrow X shown in FIG. 3.

[For production]

The electrolytic capacitor 1 obtained according to the embodiment of this invention is
Electrode plate 9 is arranged on the end face, and electrolytic capacitor 1
A portion 8 is connected to a terminal 11 of an electrode plate 9 by crimping. Therefore, the electrolytic capacitor 1 can stand on its own.

Insulation between the outer case 5 of the electrolytic capacitor 1 and the terminals 11 of the electrode plate 9 is ensured by a sleeve 7 covering the outer surface of the outer case 5.

This sleeve 7 is made of synthetic resin such as vinyl chloride, and is in close contact with the surface of the outer case 5.

Furthermore, the insulation between the outer case 5 and the electrode plate 9 may be achieved by means other than the sleeve 7 as shown in the first embodiment, for example, by applying synthetic resin to the upper surface of the electrode plate 9. good.

〔Effect of the invention〕

As described above, in the present invention, a piece-shaped terminal made of a metal that can be soldered and having a through hole formed in the center, and an insulating plate made of a heat-resistant synthetic resin are arranged on both sides of the insulating plate. The integrally molded electrode plate is placed on the outer surface of the sealing body that is attached to the opening of the outer case in which the capacitor element is housed, and the leads from the capacitor element are inserted into the through holes provided in the terminals of the electrode plate. This feature connects the leads and the terminals of the electrode plate by inserting them through the capacitor and pressing the sides of a pair of electrode plates, so the electrolytic capacitor's leads hold the electrode plate, allowing the electrolytic capacitor to stand on its own. At the same time, a flat surface is formed on the back surface of the electrode plate. Therefore, it is possible to surface-mount the electrolytic capacitor on a substrate without changing the structure of the conventional electrolytic capacitor.

Further, the leads led from the electrolytic capacitor are inserted into the through holes of the electrode plate and are pressed to be electrically connected to the terminals of the electrode plate, so there is no need to process the leads as in the conventional case.

Therefore, it is possible to eliminate mechanical stress on the capacitor element due to bending of the leads and deterioration or damage in the mechanical strength of the leads themselves. Moreover, the manufacturing process can also be simplified.

Furthermore, when the electrolytic capacitor obtained by this invention is mounted on a board, the area of the terminal electrically connected to the lead of the electrolytic capacitor is formed to be wider than that of a conventional leadless electrolytic capacitor. There is. therefore,
The solder creeps up over a wide range of the side surfaces of the terminals of the electrode plate, ensuring reliable electrical connection between the electrolytic capacitor and the wiring on the board.

As described above, this invention is a useful invention that provides an electrolytic capacitor that can be surface mounted on a substrate without changing the structure of a conventional electrolytic capacitor.

[Brief explanation of the drawing]

FIG. 1 is a partial cross-sectional view showing the structure of an electrolytic capacitor obtained according to the present invention. FIG. 2 is a partial sectional view showing the structure of a conventional glue-less type electrolytic capacitor, and FIG. 3 is a perspective view illustrating a process of joining an electrode plate and a lead in an embodiment. 1... Electrolytic capacitor, 2... Capacitor element, 3...
Electrode foil, 4. Electrolytic paper, 5. Exterior case, 6. Sealing body, 7. Sleeve, 8. Lead, 9. Electrode plate, 1
0.13...Insulating plate, 11...Terminal, 12.16...Through hole, 14...Substrate, 15...Conductor portion, 17...Solder.

Claims (1)

[Claims] (1) An electrode plate in which a piece-shaped terminal made of solderable metal with a through hole formed in the center and an insulating plate made of heat-resistant synthetic resin are integrally molded on both sides of the insulating plate. is placed on the outer surface of the sealing body attached to the opening of the exterior case in which the capacitor element is housed, and the leads from the capacitor element are inserted into the through holes provided in the terminals of the electrode plate. A method for manufacturing an electrolytic capacitor, which comprises connecting terminals of an electrode plate and leads by pressing a pair of both sides.