JP3563200B2 - Electronic components - Google Patents

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Publication number
JP3563200B2
JP3563200B2 JP14798896A JP14798896A JP3563200B2 JP 3563200 B2 JP3563200 B2 JP 3563200B2 JP 14798896 A JP14798896 A JP 14798896A JP 14798896 A JP14798896 A JP 14798896A JP 3563200 B2 JP3563200 B2 JP 3563200B2
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Japan
Prior art keywords
electronic component
leads
mounting plate
capacitor
end surface
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JP14798896A
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Japanese (ja)
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JPH09306783A (en
Inventor
誠一 西野
公三郎 大久保
博幸 中川
孝 横山
武 野々口
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Nichicon Capacitor Ltd
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Nichicon Capacitor Ltd
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Priority to JP14798896A priority Critical patent/JP3563200B2/en
Priority to US08/844,496 priority patent/US5880926A/en
Publication of JPH09306783A publication Critical patent/JPH09306783A/en
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/301—Assembling printed circuits with electric components, e.g. with resistor by means of a mounting structure
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3421—Leaded components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3431—Leadless components
    • H05K3/3442—Leadless components having edge contacts, e.g. leadless chip capacitors, chip carriers

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  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)

Description

【０００１】
【発明の属する技術分野】
この発明は、リード線形式の電子部品のプリント基板への取付を容易にするために、その端面に実装用の絶縁板を取付けた、いわゆるリードレスの電子部品に関する。
【０００２】
【従来の技術及びその課題】
従来のこの種のリードレス電子部品として、例えば特開昭５９−２１１２１３号公報に示されているような電解コンデンサが存在する。
このリードレスアルミ電解コンデンサは、図３に示すように、コンデンサ素子１を金属ケース２内に収納し、コンデンサ素子１より伸びるリード３、３をケース２の開口端を封口する封口部材４を通して引き出してなるコンデンサ本体５と、このコンデンサ本体５のリード３、３を引き出した端面に当接され、かつリード３、３が貫通する貫通孔６、６及び外表面に設けた貫通孔６、６につながる凹溝７、７を有する絶縁性取付板８とからなり、貫通孔６、６を貫通したリード３、３の先端部を丸棒のまま、又は偏平加工を施して凹溝７、７内に納めるように折曲げ、この折曲げ部から先をプリント基板への半田付部とするものである。
【０００３】
しかし、このコンデンサでは、凹溝７、７内に折曲げて納めたリード３、３の周面の外側部分のみが基板への半田付面となるために半田付面積が小さくなり、コンデンサをプリント基板に面実装する工程において、プリント基板に対するコンデンサの位置決めが困難である。そして、コンデンサとプリント基板の導体との接触面積が狭いために相互間に付着する溶融半田量が少なく、従って、接着強度を十分にとることができない。また、リード３、３を折曲げる際に内部のコンデンサ素子１にストレスが加わって特性を劣化させ易く、これを軽減するためにリード３、３の折曲げ予定箇所に切り込みを入れるなど、予め折曲げ易くすることも行われているが、これにより、プリント基板に実装したコンデンサに衝撃や振動が加わった場合に、リードが折曲げ部で断線することがある。
【０００４】
更にこのようなコンデンサには、コンデンサ素子に取付板を結合する際に、リードを小径の貫通孔に挿通しなければならぬ問題がある。この挿通作業は、手作業で行えば極めて非能率的なものとなり、自動化しようとすればコンデンサ素子と取付板の相互関係に非常な高精度を要し、特にリードが細線の場合は２本のリードが必ずしも平行になっていないので、その取扱いが困難である。そのためにこのような作業を自動化すると、装置が如何に精巧であっても、リードが貫通孔に挿通されずにコンデンサ本体端面と取付板との間で偏平な塊状に圧縮された形となり、このようなものが完成品として送出されることがある。量産工程では、このような不良品が１個でも発見されると、そのロットの製品の全てを廃棄することになるので、これによる損害は非常に大きい。
【０００５】
上述のような取付板付きの電解コンデンサの問題点を解決するために、図４に示すように貫通孔６、６の代わりにスリット９、９を取付板８に設けることが考えられる。同図において、取付板８の外表面には、インサート成形により金属板端子１０、１０が接合されており、取付板８の一側縁８ａから金属板端子１０、１０へ向けて互いに平行なスリット９、９が設けられている。コンデンサ本体５のリード３、３の長さは取付板８の厚さにほぼ等しく、その間隔はスリット９、９の間隔にほぼ等しい。
【０００６】
上述の取付板８とコンデンサ本体５とを結合する際は、リード３、３を取付板側縁８ａからスリット９、９内へ導入し、取付板８とコンデンサ本体５との位置を所定関係に保ち、リード３、３をそれぞれ金属板端子１０、１０へレーザー溶接する。
【０００７】
図４に示したコンデンサは、リードを小径の貫通孔へ挿通しなくてよいので生産が容易であり、リードを折曲げなくてよいのでコンデンサ素子への悪影響やリードの断線を回避することができる。また面積が広い金属板端子が存在するため、プリント基板導体への半田付が容易である。しかし各リードを各金属板端子に確実に接続するためには各リードを各スリットの最奥部に位置させなければならぬが、各リードを各スリットの最奥部に押当てる力だけでこの状態を維持しようとすると、リードに過大な力が加わって、リードが撓曲したり、コンデンサ特性に悪影響を与えたりする惧れがある。従って本発明は、これらのコンデンサ本体への悪影響を防ぐことを目的とする。
【０００８】
【課題を解決するための手段】
本発明の電子部品は、電子部品本体と、その一端面に当接された絶縁物製の取付板とからなる。上記電子部品本体の上記端面からは複数のリードが引出されている。上記取付板は外表面に上記各リードにそれぞれ対応する金属板端子を有し、上記取付板の一側縁から上記各金属板端子へ向けて互いに平行なスリットが形成されている。上記各リードはこれらスリット内に位置し、上記各金属板端子にそれぞれ電気的に接続されている。
【０００９】
本発明の特徴として、上記取付板の上記電子部品本体に当接している内表面における少なくとも上記側縁と反対側の半部には、上記電子部品本体の上記端面の周縁部分に沿って隆起した凸縁部が形成されている。この凸縁部の両端は、上記側縁方向に向かって互いに平行に延長されているのが望ましい。また、上記凸縁部は、上記電子部品本体の上記端面をほぼその全周にわたって囲むように形成してもよい。
【００１０】
取付板を電子部品本体に結合する際に、リードは上記側縁側からスリットに沿って導入されて金属板端子位置へ到達し、電子部品本体の端面の周縁部分が上記凸縁部に当接することによってその位置に規制され、その上で金属板端子に半田付または溶接によって接続される。従ってリードに過大な力は加わらない。また、上記凸縁部を電子部品本体の周縁部分のほぼ全周にわたって設けた場合には、取付板に電子部品を押付ける力だけでリードを適正な接続位置に規制することができる。
【００１１】
【発明の実施の形態】
図１において、コンデンサ本体５の端面５ａに絶縁物製の取付板８が当接している。取付板８の外側面、即ち下面には、対向する側縁８ｂ、８ｃよりそれぞれ中心方向に向けて金属板端子１０、１０が接合され、別の側縁８ａよりそれぞれ金属板端子１０、１０へ向けて互いに平行なスリット９、９が形成されている。コンデンサ本体５の端面５ａからは、取付板８の厚さにほぼ等しいリード３、３がスリット９、９の間隔に等しい間隔で導出されており、これらリード３、３はそれぞれスリット９、９の最奥部において金属板端子１０、１０にレーザー溶接されている。
【００１２】
取付板８のコンデンサ本体５との当接面１１における側縁８ａと反対側の半部には、コンデンサ本体における端面５ａから周面５ｂへの移行曲面５ｃと相補的な曲面を持った凸縁部１２ａが形成され、凸縁部１２ａの両端からは側縁８ａの方向に向かって直線状の凸縁部１２ｂ、１２ｃが互いに平行に伸延している。この直線状凸縁部１２ｂ、１２ｃは必ずしも存在しなくてもよい。
【００１３】
この実施形態では、コンデンサ本体端面５ａに取付板当接面１１を当接させた状態で、リード３、３を側縁８ａの側からスリット９、９内へ導入して移動させると、リード３、３がスリット９、９の最奥部に到達したときにコンデンサ本体が凸縁部１２ａに接触する。この状態でリード３、３は金属板端子１０、１０に接触するので、リード３、３に過大な力を与えずにこれを金属板端子１０、１０に溶接することができる。
【００１４】
図２においては、取付板８の当接面１１には、スリット９、９の部分を除いて、全周にわたり凸縁部１２が形成されており、この凸縁部１２は全体にわたりコンデンサ本体５の移行曲面５ｃと相補的な曲面を持っている。
【００１５】
この実施形態では、リード３、３を斜方向よりスリット９、９内へ導入し、コンデンサ本体端面５ａを取付板当接面１１に当接させることにより、リード３、３を金属板端子に接触させ、コンデンサ本体５と取付板８とを互いに押付ける方向の力によってこの位置関係を維持させることができるので、リード３、３に過大な力が加わるのを防ぐことができる。
【００１６】
上述の各実施形態は、本発明を円筒形アルミ電解コンデンサに実施したものであるが、同様に一端面よりリードが導出されている他の電子部品にも実施することができる。
【００１７】
【発明の効果】
以上のように、本発明によるときは、複数のリードが一端より導出されている電子部品本体に取付板を結合して面実装型に変更する際に、リードを取付板の貫通孔に挿通しなければならない問題を解決すると同時に、各リードを取付板に設けられている各金属板端子にそれぞれ溶接する際に、各リードに有害な横方向の過大な力を与えずに電子部品本体と取付板の位置関係を適正に維持することができる。
【図面の簡単な説明】
【図１】本発明の一実施形態を示し、（ａ）は底面図のＡ−Ａ線に沿う部分断面図、（ｂ）は底面図である。
【図２】本発明の他の実施形態を示し、（ａ）は底面図のＢ−Ｂ線に沿う部分断面図、（ｂ）は底面図である。
【図３】従来の面実装型電子部品の一例を示し、（ａ）は部分切断正面図、（ｂ）は底面図である。
【図４】本発明によらない改良された面実装型電子部品の一例を示し、（ａ）は部分切断正面図、（ｂ）は底面図である。
【符号の説明】
３ リード
５ 電子部品本体
８ 取付板
８ａ 側縁
９ スリット
１０ 金属板端子
１１ 当接面
１２ 凸縁部[0001]
TECHNICAL FIELD OF THE INVENTION
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a so-called leadless electronic component in which a mounting insulating plate is attached to an end surface of the electronic component in order to facilitate attachment of a lead wire type electronic component to a printed circuit board.
[0002]
[Prior art and its problems]
As a conventional leadless electronic component of this type, there is an electrolytic capacitor as disclosed in, for example, JP-A-59-212213.
In this leadless aluminum electrolytic capacitor, as shown in FIG. 3, a capacitor element 1 is housed in a metal case 2, and leads 3, 3 extending from the capacitor element 1 are pulled out through a sealing member 4 for sealing an open end of the case 2. And the through holes 6, 6 which are in contact with the end faces of the capacitor body 5 from which the leads 3, 3 are drawn out and through which the leads 3, 3 penetrate, and the through holes 6, 6 provided on the outer surface. Insulating mounting plate 8 having connected concave grooves 7, 7, and the ends of leads 3, 3 penetrating through holes 6, 6 remain round rods or are subjected to flattening to form grooves 7, 7. The bent portion is to be soldered to the printed circuit board.
[0003]
However, in this capacitor, only the outer portions of the peripheral surfaces of the leads 3, 3 bent and housed in the concave grooves 7, become soldering surfaces to the substrate, so that the soldering area is reduced, and the capacitor is printed. In the process of surface mounting on a board, it is difficult to position the capacitor with respect to the printed board. Further, since the contact area between the capacitor and the conductor of the printed circuit board is small, the amount of molten solder adhering to each other is small, and thus it is not possible to obtain sufficient adhesive strength. In addition, when the leads 3 and 3 are bent, stress is easily applied to the internal capacitor element 1 to easily degrade the characteristics. In order to reduce the stress, cuts are made in the portions where the leads 3 and 3 are to be bent. Although it is also made easy to bend, when a shock or vibration is applied to the capacitor mounted on the printed circuit board, the lead may be broken at the bent portion.
[0004]
Further, such a capacitor has a problem that a lead must be inserted through a small-diameter through hole when the mounting plate is coupled to the capacitor element. This insertion work is extremely inefficient if performed manually, and if automation is to be performed, very high precision is required for the relationship between the capacitor element and the mounting plate. In particular, when the leads are thin wires, two wires are required. The handling is difficult because the leads are not necessarily parallel. Therefore, when such work is automated, no matter how sophisticated the device is, the leads are not inserted into the through holes but are compressed into a flat mass between the end face of the capacitor body and the mounting plate. Such may be sent out as a finished product. In the mass production process, if even one such defective product is found, all of the products of the lot are discarded, and the damage caused by this is extremely large.
[0005]
In order to solve the problem of the electrolytic capacitor with the mounting plate as described above, it is conceivable to provide slits 9 in the mounting plate 8 instead of the through holes 6 as shown in FIG. In the same figure, metal plate terminals 10 and 10 are joined to the outer surface of the mounting plate 8 by insert molding, and slits parallel to each other from one side 8a of the mounting plate 8 toward the metal plate terminals 10 and 10. 9 and 9 are provided. The lengths of the leads 3, 3 of the capacitor body 5 are substantially equal to the thickness of the mounting plate 8, and the distance between them is substantially equal to the distance between the slits 9, 9.
[0006]
When connecting the mounting plate 8 and the capacitor body 5, the leads 3, 3 are introduced into the slits 9, 9 from the mounting plate side edge 8a, and the positions of the mounting plate 8 and the capacitor body 5 are set in a predetermined relationship. The leads 3 and 3 are laser-welded to the metal plate terminals 10 and 10, respectively.
[0007]
The capacitor shown in FIG. 4 is easy to produce because it is not necessary to insert a lead into a small-diameter through hole, and it is not necessary to bend the lead, so that adverse effects on the capacitor element and disconnection of the lead can be avoided. . In addition, since a metal plate terminal having a large area exists, soldering to a printed circuit board conductor is easy. However, in order to securely connect each lead to each metal plate terminal, each lead must be located at the deepest part of each slit. If an attempt is made to maintain the state, an excessive force is applied to the lead, which may cause the lead to bend or adversely affect the capacitor characteristics. Therefore, an object of the present invention is to prevent these adverse effects on the capacitor body.
[0008]
[Means for Solving the Problems]
The electronic component of the present invention includes an electronic component main body and an insulating mounting plate abutting on one end surface thereof. A plurality of leads are drawn out from the end face of the electronic component body. The mounting plate has a metal plate terminal corresponding to each of the leads on the outer surface, and slits parallel to each other are formed from one side edge of the mounting plate toward the metal plate terminals. The respective leads are located in these slits, and are electrically connected to the respective metal plate terminals.
[0009]
As a feature of the present invention, at least a half of the inner surface of the mounting plate in contact with the electronic component main body, which is opposite to the side edge, is protruded along a peripheral portion of the end surface of the electronic component main body. A convex edge is formed. It is desirable that both ends of the protruding edge portion extend parallel to each other toward the side edge direction. Further, the protruding edge may be formed so as to surround the end face of the electronic component main body substantially over its entire circumference.
[0010]
When connecting the mounting plate to the electronic component main body, the lead is introduced along the slit from the side edge side to reach the metal plate terminal position, and the peripheral portion of the end surface of the electronic component main body contacts the convex edge portion. And is connected to the metal plate terminal by soldering or welding. Therefore, no excessive force is applied to the lead. Further, when the protruding portion is provided over substantially the entire peripheral portion of the electronic component body, the lead can be restricted to an appropriate connection position only by a force pressing the electronic component against the mounting plate.
[0011]
BEST MODE FOR CARRYING OUT THE INVENTION
In FIG. 1, a mounting plate 8 made of an insulating material is in contact with an end face 5a of the capacitor body 5. Metal plate terminals 10 and 10 are joined to the outer side surface, that is, the lower surface of the mounting plate 8 from the opposing side edges 8b and 8c toward the center, respectively, and from the other side edge 8a to the metal plate terminals 10 and 10, respectively. The slits 9, 9 are formed parallel to each other. From the end face 5a of the capacitor body 5, leads 3 and 3, which are almost equal to the thickness of the mounting plate 8, are led out at intervals equal to the interval between the slits 9, 9. The innermost portion is laser-welded to the metal plate terminals 10 and 10.
[0012]
A convex edge having a curved surface complementary to a transition curved surface 5c from the end surface 5a to the peripheral surface 5b in the capacitor main body is provided on a half portion of the mounting plate 8 on the contact surface 11 with the capacitor main body 5 opposite to the side edge 8a. A portion 12a is formed, and linear protruding edges 12b and 12c extend parallel to each other from both ends of the protruding edge 12a toward the side edge 8a. The linear protruding edges 12b and 12c are not necessarily required.
[0013]
In this embodiment, when the leads 3, 3 are introduced into the slits 9, 9 from the side of the side edge 8a and moved while the mounting plate contact surface 11 is in contact with the capacitor body end surface 5a, the lead 3 When 3 reaches the innermost portion of the slits 9, 9, the capacitor body contacts the protruding edge 12a. In this state, the leads 3 and 3 come into contact with the metal plate terminals 10 and 10, so that the leads 3 and 3 can be welded to the metal plate terminals 10 and 10 without giving excessive force to the leads 3 and 3.
[0014]
2, the contact surface 11 of the mounting plate 8 is provided with a projecting edge portion 12 over the entire periphery except for the slits 9 and 9, and the projecting edge portion 12 covers the entire capacitor body 5 Has a curved surface complementary to the transition curved surface 5c.
[0015]
In this embodiment, the leads 3, 3 are introduced obliquely into the slits 9, 9, and the capacitor body end face 5a is brought into contact with the mounting plate contact surface 11, whereby the leads 3, 3 are brought into contact with the metal plate terminals. Since this positional relationship can be maintained by the force in the direction of pressing the capacitor body 5 and the mounting plate 8 together, it is possible to prevent an excessive force from being applied to the leads 3.
[0016]
In each of the above embodiments, the present invention is applied to a cylindrical aluminum electrolytic capacitor. However, the present invention can also be applied to other electronic components having leads extending from one end surface.
[0017]
【The invention's effect】
As described above, according to the present invention, when the mounting plate is connected to the electronic component body from which one or more leads are led out from one end to change to a surface mount type, the leads are inserted through the through holes of the mounting plate. In addition to solving the problems that must be solved, when each lead is welded to each metal plate terminal provided on the mounting plate, it is attached to the electronic component body without giving excessive harmful lateral force to each lead. The positional relationship between the plates can be properly maintained.
[Brief description of the drawings]
1A and 1B show an embodiment of the present invention, wherein FIG. 1A is a partial cross-sectional view taken along line AA of the bottom view, and FIG. 1B is a bottom view.
FIGS. 2A and 2B show another embodiment of the present invention, in which FIG. 2A is a partial sectional view taken along line BB of the bottom view, and FIG.
3A and 3B show an example of a conventional surface mount type electronic component, wherein FIG. 3A is a partially cutaway front view, and FIG. 3B is a bottom view.
4A and 4B show an example of an improved surface mount electronic component not according to the present invention, wherein FIG. 4A is a partially cutaway front view, and FIG. 4B is a bottom view.
[Explanation of symbols]
3 Lead 5 Electronic component body 8 Mounting plate 8a Side edge 9 Slit 10 Metal plate terminal 11 Contact surface 12 Convex edge

Claims (3)

複数のリードを同一端面より引出した電子部品本体と、この電子部品本体の上記端面に当接されその外表面に上記各リードにそれぞれ電気的に接続された金属板端子が設けられ一側縁よりそれぞれ上記各リードに向かう互いにほぼ平行なスリットを有する絶縁物製の取付板とよりなり、この取付板の上記電子部品本体に当接する内表面の周縁部分における少なくとも上記側縁とは反対側の半部に上記電子部品本体の端面の周縁部分に沿って隆起した凸縁部を形成したことを特徴とする電子部品。An electronic component main body having a plurality of leads drawn out from the same end surface, and a metal plate terminal which is in contact with the end surface of the electronic component main body and which is electrically connected to each of the leads on its outer surface is provided from one side edge. A mounting plate made of an insulator having slits substantially parallel to each other toward the respective leads, and at least a half of a peripheral portion of an inner surface of the mounting plate abutting on the electronic component body, the half being opposite to the side edge. An electronic component, wherein a protruding edge portion protruding along a peripheral portion of an end surface of the electronic component body is formed in the portion. 上記凸縁部の両端は上記取付板の上記側縁方向に向かって互いに平行に延長されていることを特徴とする請求項１に記載の電子部品。2. The electronic component according to claim 1, wherein both ends of the protruding edge portion extend parallel to each other toward the side edge direction of the mounting plate. 3. 複数のリードを同一端面より引出した電子部品本体と、この電子部品本体の上記端面に当接されその外表面に上記各リードにそれぞれ電気的に接続された金属板端子が設けられ一側縁よりそれぞれ上記各リードに向かう互いにほぼ平行なスリットを有する絶縁物製の取付板とよりなり、この取付板の上記電子部品本体に当接する内表面の周縁部分には、上記電子部品本体の端面の周縁部分に沿って隆起した凸縁部がほぼ全周にわたって形成されていることを特徴とする電子部品。An electronic component main body having a plurality of leads drawn out from the same end surface, and a metal plate terminal which is in contact with the end surface of the electronic component main body and which is electrically connected to each of the leads on its outer surface is provided from one side edge. A mounting plate made of an insulator having slits substantially parallel to each other toward the respective leads; a peripheral portion of an inner surface of the mounting plate abutting on the electronic component body; An electronic component, wherein a raised edge protruding along a portion is formed over substantially the entire circumference.
JP14798896A 1996-04-19 1996-05-16 Electronic components Expired - Lifetime JP3563200B2 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP14798896A JP3563200B2 (en) 1996-05-16 1996-05-16 Electronic components
US08/844,496 US5880926A (en) 1996-04-19 1997-04-18 Electronic device with mounting structure

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP14798896A JP3563200B2 (en) 1996-05-16 1996-05-16 Electronic components

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Publication Number Publication Date
JPH09306783A JPH09306783A (en) 1997-11-28
JP3563200B2 true JP3563200B2 (en) 2004-09-08

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