JPS61218151A - 半導体装置 - Google Patents
半導体装置Info
- Publication number
- JPS61218151A JPS61218151A JP60058951A JP5895185A JPS61218151A JP S61218151 A JPS61218151 A JP S61218151A JP 60058951 A JP60058951 A JP 60058951A JP 5895185 A JP5895185 A JP 5895185A JP S61218151 A JPS61218151 A JP S61218151A
- Authority
- JP
- Japan
- Prior art keywords
- chip
- chips
- gto
- cathode
- package
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H10W90/00—
Landscapes
- Thyristors (AREA)
- Power Conversion In General (AREA)
Priority Applications (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60058951A JPS61218151A (ja) | 1985-03-23 | 1985-03-23 | 半導体装置 |
| DE19863609458 DE3609458A1 (de) | 1985-03-23 | 1986-03-20 | Halbleitervorrichtung mit parallel geschalteten selbstabschalt-halbleiterbauelementen |
| US07/144,061 US4884126A (en) | 1985-03-23 | 1988-01-15 | Semiconductor device having parallel-connected, self turn-off type semiconductor elements |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60058951A JPS61218151A (ja) | 1985-03-23 | 1985-03-23 | 半導体装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS61218151A true JPS61218151A (ja) | 1986-09-27 |
| JPH0513383B2 JPH0513383B2 (enExample) | 1993-02-22 |
Family
ID=13099133
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP60058951A Granted JPS61218151A (ja) | 1985-03-23 | 1985-03-23 | 半導体装置 |
Country Status (3)
| Country | Link |
|---|---|
| US (1) | US4884126A (enExample) |
| JP (1) | JPS61218151A (enExample) |
| DE (1) | DE3609458A1 (enExample) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5793106A (en) * | 1995-02-28 | 1998-08-11 | Hitachi, Ltd. | Semiconductor device |
| JP2007266608A (ja) * | 2006-03-29 | 2007-10-11 | Infineon Technologies Ag | 半導体モジュール |
| JP2009158797A (ja) * | 2007-12-27 | 2009-07-16 | Denso Corp | 半導体モジュール |
Families Citing this family (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6393126A (ja) * | 1986-10-08 | 1988-04-23 | Fuji Electric Co Ltd | 半導体装置 |
| DE3643288A1 (de) * | 1986-12-18 | 1988-06-30 | Semikron Elektronik Gmbh | Halbleiterbaueinheit |
| US5243217A (en) * | 1990-11-03 | 1993-09-07 | Fuji Electric Co., Ltd. | Sealed semiconductor device with protruding portion |
| JPH065742A (ja) * | 1992-06-22 | 1994-01-14 | Mitsubishi Electric Corp | 半導体装置、その封止に用いられる樹脂および半導体装置の製造方法 |
| JP2956363B2 (ja) * | 1992-07-24 | 1999-10-04 | 富士電機株式会社 | パワー半導体装置 |
| DE29900370U1 (de) * | 1999-01-12 | 1999-04-08 | eupec Europäische Gesellschaft für Leistungshalbleiter mbH & Co. KG, 59581 Warstein | Leistungshalbleitermodul mit Deckel |
| EP1596436A1 (en) * | 2004-05-12 | 2005-11-16 | Seiko Epson Corporation | Electronic circuit and method for manufacturing an electronic circuit |
| US9345948B2 (en) | 2012-10-19 | 2016-05-24 | Todd Martin | System for providing a coach with live training data of an athlete as the athlete is training |
| US10388596B2 (en) * | 2014-11-20 | 2019-08-20 | Nsk Ltd. | Electronic part mounting heat-dissipating substrate |
Family Cites Families (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CH448213A (fr) * | 1966-03-16 | 1967-12-15 | Secheron Atel | Dispositif de contrôle à semi-conducteurs pour courant alternatif |
| US4193083A (en) * | 1977-01-07 | 1980-03-11 | Varian Associates, Inc. | Package for push-pull semiconductor devices |
| US4107728A (en) * | 1977-01-07 | 1978-08-15 | Varian Associates, Inc. | Package for push-pull semiconductor devices |
| JPS5386576A (en) * | 1977-01-10 | 1978-07-31 | Nec Corp | Package for semiconductor element |
| US4394530A (en) * | 1977-09-19 | 1983-07-19 | Kaufman Lance R | Power switching device having improved heat dissipation means |
| JPS5929143B2 (ja) * | 1978-01-07 | 1984-07-18 | 株式会社東芝 | 電力用半導体装置 |
| JPS5778173A (en) * | 1980-11-04 | 1982-05-15 | Hitachi Ltd | Semiconductor device and manufacture thereof |
| FR2506075A1 (fr) * | 1981-05-18 | 1982-11-19 | Radiotechnique Compelec | Procede d'assemblage d'un dispositif semi-conducteur et de son boitier de protection |
| DE3127456A1 (de) * | 1981-07-11 | 1983-02-03 | Brown, Boveri & Cie Ag, 6800 Mannheim | Stromrichteranordnung |
| DE3201296C2 (de) * | 1982-01-18 | 1986-06-12 | Institut elektrodinamiki Akademii Nauk Ukrainskoj SSR, Kiev | Transistoranordnung |
| EP0088924A3 (de) * | 1982-03-13 | 1985-10-23 | BROWN, BOVERI & CIE Aktiengesellschaft | Halbleiterbauelement in Modulbauweise |
| JPS5968958A (ja) * | 1982-10-12 | 1984-04-19 | Mitsubishi Electric Corp | ゲ−トタ−ンオフサイリスタ組立体 |
| DE3241509A1 (de) * | 1982-11-10 | 1984-05-10 | Brown, Boveri & Cie Ag, 6800 Mannheim | Leistungstransistor-modul |
-
1985
- 1985-03-23 JP JP60058951A patent/JPS61218151A/ja active Granted
-
1986
- 1986-03-20 DE DE19863609458 patent/DE3609458A1/de not_active Ceased
-
1988
- 1988-01-15 US US07/144,061 patent/US4884126A/en not_active Expired - Fee Related
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5793106A (en) * | 1995-02-28 | 1998-08-11 | Hitachi, Ltd. | Semiconductor device |
| JP2007266608A (ja) * | 2006-03-29 | 2007-10-11 | Infineon Technologies Ag | 半導体モジュール |
| JP2009158797A (ja) * | 2007-12-27 | 2009-07-16 | Denso Corp | 半導体モジュール |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0513383B2 (enExample) | 1993-02-22 |
| US4884126A (en) | 1989-11-28 |
| DE3609458A1 (de) | 1986-10-02 |
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