JPS61208227A - Connection of integrated circuit element in ic card - Google Patents

Abstract

PURPOSE:To perform easy connection between an integrated circuit element and a substrate by connecting electrode parts of the integrated circuit element directly to those of the substrate without using conductors such as gold wires. CONSTITUTION:A member which is housed in an IC card is constituted by a substrate 3 and a bottom plate 4, on the surface of which wirings 1 and 2 or printed patterns are provided respectively, and an integrated circuit element 5. A cutout 6, in which the integrated circuit element 5 is accomodated, is provided in the substrate 3 and wirings 1a are formed on the inside walls of the cutout 6. On the other hand, electrode parts 7 which are connected to the wirings 2 on the bottom plate 4 are attached to the bottom of the integrated circuit element 5. The member is assembled with those components in such a manner that the integrated circuit element 5 is connected to the substrate 3. The IC card is formed by incorporating the substrate 3 accomodating the integrated circuit element 5 in this manner into the card body.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention provides an IC card that effectively connects an integrated circuit element to a board housed in the IC card when the integrated circuit element is incorporated into the board. The present invention relates to a method of wiring integrated circuit elements.

[Conventional technology]

Generally, an IC card is formed by incorporating an integrated circuit element into a substrate having a printed wiring pattern, and housing this substrate in a card body. Conventionally, the connection between the integrated circuit element and the substrate has been made by wire bonding. This wire bonding uses a thin gold wire, and both ends of the gold wire are bonded to the element side and the substrate side, respectively. Further, by sealing the element housing portion of this substrate with synthetic resin, the connection portion by the wire bonding is protected.

[Problem that the invention seeks to solve]

As mentioned above, in order to connect integrated circuit elements by wire bonding, it is necessary to connect them with extremely thin metal, but this connection work is not only extremely difficult and troublesome, but even if resin encapsulation is used, However, the wiring part could not be sufficiently protected, and the IC card could be bent or
There was a drawback in that the above-mentioned wire connections were damaged during torsion tests and during long-term use.

The present invention has been made in view of the above-mentioned points, and has an object to enable easy and efficient connection of an integrated circuit element to a substrate, and to provide the necessary strength to this connection part. The object of the present invention is to provide a method for connecting integrated circuit elements of an IC card.

[Means for solving problems]

In order to achieve the above-mentioned object, the method of the present invention involves drilling a through hole in the board thickness direction at a position connected to the wiring in a substrate having a printed wiring pattern on the surface, and a step of filling the substrate with a conductive material, a step of cutting out the substrate along the drilling position of the through hole to form a cutout in which the wiring of the conductive material is formed on the inner peripheral wall, and a step of forming a wiring pattern on the surface. a step of forming an element housing section defined by a cutout by attaching the provided bottom plate to the substrate with its wiring connected to the wiring of the inner peripheral wall; and forming an electrode section on the bottom surface. The method is characterized in that it comprises the steps of accommodating an integrated circuit element in the element accommodating part and connecting the electrode part to the wiring formed on the bottom plate.

〔Example〕

Embodiments of the present invention will be described in detail below with reference to the drawings.

First, as shown in FIG. 1, the components housed in the IC card include a substrate 3 and a bottom plate 4 on which wirings 1 and 2 are formed with printed wiring patterns on their surfaces, and an integrated circuit element. 5, a cutout 6 for accommodating the integrated circuit element 5 is formed in the substrate 3, and a wiring 1a is also formed on the inner peripheral wall of the cutout 6. On the other hand, an electrode portion 7 for connection to the wiring 2 on the bottom plate 4 is attached to the bottom surface of the integrated circuit element 5 . Then, by assembling these members, the integrated circuit element 5 is assembled in a state where it is connected to the board 3, and the board 3 with the integrated circuit element 5 installed in this way is housed in the card body, so that it can be used as an IC card. will be formed.

Therefore, a method of incorporating the above-mentioned integrated circuit element 5 into the substrate 3 and connecting it thereto will be explained.

First, as shown in FIG. 2, a wiring pattern is drawn on the surface of the board 3, on which the wiring 1 is provided, and a through hole 8, a so-called through hole, is formed at the end of the wiring 1 in the board thickness direction. Set up Then, the same conductive material used when drawing the wiring pattern is injected into the through hole 8.

Next, by cutting out the substrate 3 at a position that divides the through hole 8 into two, a cutout 6 in which the wiring 1a is formed is formed on the inner peripheral wall. In this cutout 6, an integrated circuit element 5 is placed.
Since the integrated circuit element 5 is to be housed therein, it is preferable to form the integrated circuit element 5 in a size slightly larger than the external shape of the integrated circuit element 5.

Thereafter, the arrangement which is in mutual connection with this surface and the inner circumferential wall of the cutout 6 is formed! 1.1a formed on the substrate 3 is attached to the bottom plate 4. At the time of this attachment, the arrangement provided on the surface of the bottom plate 4! 2 and the wiring 1a of the three substrates.

For this purpose, for example, by making at least one of the ends of the wirings 1a and 2 at the connection part wide, or by applying a conductive paste, the connection between the two can be made smoothly. . As a result, as shown in FIG. 3, an element housing portion 9 is formed by the cutout portion 6 of the substrate 3 and the bottom plate 4.

Furthermore, the integrated circuit element 5 is housed in the element housing part 9 formed in this way, and its electrode part 7 is connected to the wiring 2, but this connection is made by, for example, using a solder ball on the wiring 2 side or the electrode part 7 side. is mounted, the integrated circuit element 5 is mounted via the solder balls, and the electrode portion 7 of the integrated circuit element 5 and the substrate 3 are melted by inserting the integrated circuit element 5 into a furnace and melting the solder balls.
The wiring 2 on the side is connected via the soldering part 10.

The substrate 3 incorporating the integrated circuit element 5 as described above is
The IC card is used by being installed in a board storage recess in the card body of the IC card. Since the wiring in the integrated circuit element 5 does not use gold wire or the like, but is directly connected by soldering, the strength of the wiring is extremely good, and it is suitable for IC cards. Even if a relatively large bending force or twisting force is applied, there is no risk of damage to the connected portion. If the bottom plate 4 is made of a material with high strength, the integrated circuit elements can be stored in the element storage part 9 in a stable state and better protected, and for this reason the base vi3 is lightweight. It can be formed using the minimum required number of materials, that is, slightly thicker than the thickness of the integrated circuit element 5, and the overall weight and thickness can be reduced.

In the above embodiment, the electrode portion 7 of the integrated circuit element 5 and the wiring wA2 of the bottom plate 4 are connected by soldering, but a conductive paste may be used instead. Further, since the wiring connection method of the present invention can impart sufficient strength to the wiring part, it is not necessarily necessary to perform resin sealing, but in order to protect the integrated circuit element 5 from moisture, resin sealing etc. You may do so.

〔Effect of the invention〕

As explained above, according to the present invention, since the electrode portion of the integrated circuit element is directly connected to the substrate side without using wiring such as gold wire, wiring between them can be easily made. Furthermore, the wired portions thus connected have sufficient mechanical strength, and even if a relatively large bending force, twisting force, etc. are applied to the RC card, there is no risk of damage to the wired portions. In addition, the wiring formed on the surface of the board and the wiring formed on the bottom plate were formed by drilling a through hole in the thickness direction of the board, filling the through hole with a conductive material, and then cutting out the relevant part. Therefore, a wiring pattern on this inner peripheral wall can be easily provided.

[Brief explanation of drawings]

FIG. 1 is an exploded perspective view of members assembled by the method of the present invention, FIG. 2 is a perspective view illustrating cutting out processing of a board,
FIG. 3 is a cross-sectional view showing the assembled state of the integrated circuit element. DESCRIPTION OF SYMBOLS 1, la, 2... Wiring, 3... Substrate, 4... Bottom plate, 5... Integrated circuit element, 7... Electrode part, 8... Through hole, 9... Element storage Department.゛effect, I°・:'1','1゛72e:

Claims (1)

[Claims] A step of drilling a through hole penetrating in the thickness direction of the board at a position connected to the wiring in a board having a printed wiring pattern on its surface, and filling the through hole with a conductive material; A step of forming a cutout portion in which the wiring made of the conductive material is formed on the inner peripheral wall by cutting out along the drilling position of the through hole, and a bottom plate having a wiring pattern provided on the surface,
forming an element storage area defined by a cutout by pasting the wiring on the substrate in a state where the wiring is connected to the wiring on the inner peripheral wall; A method for connecting an integrated circuit element in an IC card, comprising the steps of storing the integrated circuit element in a storage part and connecting the electrode part to wiring formed on the bottom plate.