JPS6120361A - 半導体装置用リ−ドフレ−ムの製造方法 - Google Patents

半導体装置用リ−ドフレ−ムの製造方法

Info

Publication number
JPS6120361A
JPS6120361A JP14200084A JP14200084A JPS6120361A JP S6120361 A JPS6120361 A JP S6120361A JP 14200084 A JP14200084 A JP 14200084A JP 14200084 A JP14200084 A JP 14200084A JP S6120361 A JPS6120361 A JP S6120361A
Authority
JP
Japan
Prior art keywords
lead frame
metal mold
press
press metal
band
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP14200084A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0457106B2 (enExample
Inventor
Toshizo Kawaguchi
川口　敏三
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shinko Electric Industries Co Ltd
Original Assignee
Shinko Electric Industries Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinko Electric Industries Co Ltd filed Critical Shinko Electric Industries Co Ltd
Priority to JP14200084A priority Critical patent/JPS6120361A/ja
Publication of JPS6120361A publication Critical patent/JPS6120361A/ja
Publication of JPH0457106B2 publication Critical patent/JPH0457106B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07
    • H01L21/4814—Conductive parts
    • H01L21/4821—Flat leads, e.g. lead frames with or without insulating supports
    • H01L21/4842—Mechanical treatment, e.g. punching, cutting, deforming, cold welding

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Lead Frames For Integrated Circuits (AREA)
JP14200084A 1984-07-09 1984-07-09 半導体装置用リ−ドフレ−ムの製造方法 Granted JPS6120361A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP14200084A JPS6120361A (ja) 1984-07-09 1984-07-09 半導体装置用リ−ドフレ−ムの製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP14200084A JPS6120361A (ja) 1984-07-09 1984-07-09 半導体装置用リ−ドフレ−ムの製造方法

Publications (2)

Publication Number Publication Date
JPS6120361A true JPS6120361A (ja) 1986-01-29
JPH0457106B2 JPH0457106B2 (enExample) 1992-09-10

Family

ID=15305053

Family Applications (1)

Application Number Title Priority Date Filing Date
JP14200084A Granted JPS6120361A (ja) 1984-07-09 1984-07-09 半導体装置用リ−ドフレ−ムの製造方法

Country Status (1)

Country Link
JP (1) JPS6120361A (enExample)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63229844A (ja) * 1987-03-19 1988-09-26 Nec Corp 半導体装置の製造方法
US5295296A (en) * 1990-02-06 1994-03-22 Citizen Watch Co., Ltd. Method and apparatus for working a clad material

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS522752A (en) * 1975-06-24 1977-01-10 Fueroo Kogyo Kk Static capacity type level gauge provided with digital switch

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS522752A (en) * 1975-06-24 1977-01-10 Fueroo Kogyo Kk Static capacity type level gauge provided with digital switch

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63229844A (ja) * 1987-03-19 1988-09-26 Nec Corp 半導体装置の製造方法
US5295296A (en) * 1990-02-06 1994-03-22 Citizen Watch Co., Ltd. Method and apparatus for working a clad material

Also Published As

Publication number Publication date
JPH0457106B2 (enExample) 1992-09-10

Similar Documents

Publication Publication Date Title
US3032463A (en) Method for making punched label stock
JP2012213792A (ja) 板状ワークの成形方法および成形体
JPS6120361A (ja) 半導体装置用リ−ドフレ−ムの製造方法
DE3751500T2 (de) Apparat zum Anbringen von Streifen auf Gehäusebleche.
JPH0126800B2 (enExample)
JP2001277058A (ja) レーザ加工とプレス加工を含む複合板金加工方法
JPH0115283B2 (enExample)
JPH031115B2 (enExample)
EP1143459A2 (en) Method of successively manufacturing slender square conductive wires
JPS60152324A (ja) シエ−ビング加工方法
JPH07275963A (ja) 加工材のプレス成形方法
JP2540545B2 (ja) 突起形成波形板状触媒
US3226274A (en) Method of manufacturing electrodes of variable condenser
JP3266159B2 (ja) 電解コンデンサ用電極端子の製造方法
JPS60227456A (ja) 半導体装置用リ−ドフレ−ム
JPS6110262A (ja) 半導体リ−ドフレ−ム製造装置
JPS6143525A (ja) ライニング材一体成形品の製法
JPS62156846A (ja) 帯状接着テ−プに一定間隔おきに金属箔片を接合する方法
CN117124395A (zh) 一种电磁屏蔽材料卷料模切工艺
SU804098A1 (ru) Штамп дл встречного раскро пОлОСОВОгО и лЕНТОчНОгО МАТЕРиАлА
JPH01249279A (ja) クラッド材の製造方法
JPH031116B2 (enExample)
JPS62169352A (ja) 帯状金属シ−トに一定間隔おきに異種金属部分クラツド層を設ける方法
JPS6059851B2 (ja) 被覆金属板製造方法
JPS58163128A (ja) Ｃ−ｃｒｔ電子銃のグリツドの製造方法