JPS6120134B2 - - Google Patents

Info

Publication number
JPS6120134B2
JPS6120134B2 JP51141236A JP14123676A JPS6120134B2 JP S6120134 B2 JPS6120134 B2 JP S6120134B2 JP 51141236 A JP51141236 A JP 51141236A JP 14123676 A JP14123676 A JP 14123676A JP S6120134 B2 JPS6120134 B2 JP S6120134B2
Authority
JP
Japan
Prior art keywords
sample
center
drive motor
column
wedge
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP51141236A
Other languages
English (en)
Japanese (ja)
Other versions
JPS5366167A (en
Inventor
Shunei Uematsu
Shunichiro Fujioka
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP14123676A priority Critical patent/JPS5366167A/ja
Publication of JPS5366167A publication Critical patent/JPS5366167A/ja
Publication of JPS6120134B2 publication Critical patent/JPS6120134B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10W72/0711—
    • H10W72/07141—

Landscapes

  • Wire Bonding (AREA)
  • Control Of Position Or Direction (AREA)
JP14123676A 1976-11-26 1976-11-26 Positioning method Granted JPS5366167A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP14123676A JPS5366167A (en) 1976-11-26 1976-11-26 Positioning method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP14123676A JPS5366167A (en) 1976-11-26 1976-11-26 Positioning method

Related Child Applications (3)

Application Number Title Priority Date Filing Date
JP58172943A Division JPS59103350A (ja) 1983-09-21 1983-09-21 ワイヤボンデイング装置
JP58172944A Division JPS59103351A (ja) 1983-09-21 1983-09-21 超音波ワイヤ・ボンデイング方法
JP62026242A Division JPS62271441A (ja) 1987-02-09 1987-02-09 位置ずれ補正方法

Publications (2)

Publication Number Publication Date
JPS5366167A JPS5366167A (en) 1978-06-13
JPS6120134B2 true JPS6120134B2 (enExample) 1986-05-21

Family

ID=15287263

Family Applications (1)

Application Number Title Priority Date Filing Date
JP14123676A Granted JPS5366167A (en) 1976-11-26 1976-11-26 Positioning method

Country Status (1)

Country Link
JP (1) JPS5366167A (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH035340U (enExample) * 1989-05-31 1991-01-18

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6384130A (ja) * 1986-09-29 1988-04-14 Toshiba Corp ワイヤボンディング方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH035340U (enExample) * 1989-05-31 1991-01-18

Also Published As

Publication number Publication date
JPS5366167A (en) 1978-06-13

Similar Documents

Publication Publication Date Title
JP3163221B2 (ja) プローブ装置
US6868176B2 (en) Image processing method and device
US6917699B2 (en) Image processing method, an image processing device and a bonding apparatus
US3941985A (en) Apparatus for carrying out bonding at programmed positions of a circuit element and at corrected positions of leads therefor
JP2913565B2 (ja) ワイヤループ曲がり検査方法及びその装置
JPS6120134B2 (enExample)
JP2002504759A (ja) 箔上に配置された電子回路の位置決め装置
JP2570585B2 (ja) プローブ装置
JPH067561B2 (ja) 半導体ウエハチツプの位置合わせ方法
JPS6120136B2 (enExample)
US5561386A (en) Chip tester with improvements in handling efficiency and measurement precision
JPS62271441A (ja) 位置ずれ補正方法
JPS6231825B2 (enExample)
JPS59103351A (ja) 超音波ワイヤ・ボンデイング方法
JPH0265150A (ja) プローブカードの自動位置合せ方法
JPH0283183A (ja) 多関節型ロボットの位置設定方法
JP2630692B2 (ja) ワイヤボンディング方法
JPH0436111Y2 (enExample)
JPS6026298B2 (ja) ボンデイング装置
JPH0567059B2 (enExample)
JP2931381B2 (ja) 加工検査方法
JP3817021B2 (ja) ワイヤボンディング装置のボンディングレベル設定方法
JP2979917B2 (ja) Ｉｃチップの位置決め方法
JPH02250343A (ja) テープボンディングの位置決め方法
JPS60239602A (ja) タツチセンサの触針先端中心と主軸中心とのずれ補正方法