JPS5366167A - Positioning method - Google Patents

Positioning method

Info

Publication number
JPS5366167A
JPS5366167A JP14123676A JP14123676A JPS5366167A JP S5366167 A JPS5366167 A JP S5366167A JP 14123676 A JP14123676 A JP 14123676A JP 14123676 A JP14123676 A JP 14123676A JP S5366167 A JPS5366167 A JP S5366167A
Authority
JP
Japan
Prior art keywords
positioning method
coordinate
rotation center
sample
point
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP14123676A
Other languages
English (en)
Other versions
JPS6120134B2 (ja
Inventor
Shunei Uematsu
Shunichiro Fujioka
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP14123676A priority Critical patent/JPS5366167A/ja
Publication of JPS5366167A publication Critical patent/JPS5366167A/ja
Publication of JPS6120134B2 publication Critical patent/JPS6120134B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/7825—Means for applying energy, e.g. heating means
    • H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/78301—Capillary
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)
  • Control Of Position Or Direction (AREA)
JP14123676A 1976-11-26 1976-11-26 Positioning method Granted JPS5366167A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP14123676A JPS5366167A (en) 1976-11-26 1976-11-26 Positioning method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP14123676A JPS5366167A (en) 1976-11-26 1976-11-26 Positioning method

Related Child Applications (3)

Application Number Title Priority Date Filing Date
JP58172943A Division JPS59103350A (ja) 1983-09-21 1983-09-21 ワイヤボンデイング装置
JP58172944A Division JPS59103351A (ja) 1983-09-21 1983-09-21 超音波ワイヤ・ボンデイング方法
JP62026242A Division JPS62271441A (ja) 1987-02-09 1987-02-09 位置ずれ補正方法

Publications (2)

Publication Number Publication Date
JPS5366167A true JPS5366167A (en) 1978-06-13
JPS6120134B2 JPS6120134B2 (ja) 1986-05-21

Family

ID=15287263

Family Applications (1)

Application Number Title Priority Date Filing Date
JP14123676A Granted JPS5366167A (en) 1976-11-26 1976-11-26 Positioning method

Country Status (1)

Country Link
JP (1) JPS5366167A (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4762267A (en) * 1986-09-29 1988-08-09 Kabushiki Kaisha Toshiba Wire bonding method

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH035340U (ja) * 1989-05-31 1991-01-18

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4762267A (en) * 1986-09-29 1988-08-09 Kabushiki Kaisha Toshiba Wire bonding method

Also Published As

Publication number Publication date
JPS6120134B2 (ja) 1986-05-21

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