JPS6119995B2 - - Google Patents
Info
- Publication number
- JPS6119995B2 JPS6119995B2 JP14383476A JP14383476A JPS6119995B2 JP S6119995 B2 JPS6119995 B2 JP S6119995B2 JP 14383476 A JP14383476 A JP 14383476A JP 14383476 A JP14383476 A JP 14383476A JP S6119995 B2 JPS6119995 B2 JP S6119995B2
- Authority
- JP
- Japan
- Prior art keywords
- flexible
- integrated circuit
- semiconductor integrated
- liquid crystal
- display device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000004973 liquid crystal related substance Substances 0.000 claims description 19
- 239000004065 semiconductor Substances 0.000 claims description 13
- 239000002184 metal Substances 0.000 claims description 5
- 229910052751 metal Inorganic materials 0.000 claims description 5
- 125000006850 spacer group Chemical group 0.000 claims description 3
- 238000004804 winding Methods 0.000 claims description 3
- 239000011888 foil Substances 0.000 claims 1
- 239000002985 plastic film Substances 0.000 description 16
- 229920006255 plastic film Polymers 0.000 description 15
- 239000010409 thin film Substances 0.000 description 12
- 238000000034 method Methods 0.000 description 11
- 238000004519 manufacturing process Methods 0.000 description 10
- 239000011521 glass Substances 0.000 description 7
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 6
- 238000010586 diagram Methods 0.000 description 3
- 229920003023 plastic Polymers 0.000 description 2
- 239000004642 Polyimide Substances 0.000 description 1
- 229910006404 SnO 2 Inorganic materials 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010408 film Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 238000000059 patterning Methods 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920003055 poly(ester-imide) Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Landscapes
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
- Liquid Crystal (AREA)
- Liquid Crystal Display Device Control (AREA)
Description
【発明の詳細な説明】
本発明は表示体装置の製造方法に関するもので
ある。さらに本発明は、表示体パネル上に表示体
を駆動させる電子回路を実装した表示体装置の製
造方法に関するものである。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a method of manufacturing a display device. Furthermore, the present invention relates to a method of manufacturing a display device in which an electronic circuit for driving a display is mounted on a display panel.
本発明の目的は表示体装置の導型化、低コスト
化及び量産化可能な製造方法を提供することにあ
る。 SUMMARY OF THE INVENTION An object of the present invention is to provide a manufacturing method that allows display devices to be made more conductive, lower in cost, and mass-produced.
近年、液晶表示体装置は消費電力が低いことか
ら種々の装置に用いられているが、その構造は透
明薄膜電極を形成した２枚のガラス板の間に液晶
を封入するものである。しかし、ガラス板を用い
た液晶表示装置においては、ガラス板厚が厚いた
めに液晶表示体装置の薄型化が困難であるととも
に、ガラス板を扱うために量産化しにくいという
欠点があつた。最近第１図に示すようにガラス板
の代りに透明のプラスチツクフイルムを用いた液
晶表示体装置が考え出された。これはプラスチツ
クフイルム１上にSnO2あるいはIn2O3等の透明導
電薄膜電極パターン２を形成後、スペーサ３を介
して液晶４を封入したものである。このようにガ
ラス板の代りにプラスチツクフイルムを用いた場
合は、液晶表示体装置の薄型化が可能となるとと
もにプラスチツクフイルムを連続的にリールＡか
らリールＢに巻き取る工程において、透明導電薄
膜の形成及び電極のパターニングが可能となるた
めに量産化が著しく向上する。 In recent years, liquid crystal display devices have been used in various devices because of their low power consumption, and their structure is such that liquid crystal is sealed between two glass plates on which transparent thin film electrodes are formed. However, liquid crystal display devices using glass plates have disadvantages in that it is difficult to make the liquid crystal display device thinner because the glass plates are thick, and it is difficult to mass-produce the liquid crystal display device because the glass plates are used. Recently, a liquid crystal display device using a transparent plastic film instead of a glass plate has been devised, as shown in FIG. In this case, a transparent conductive thin film electrode pattern 2 made of SnO 2 or In 2 O 3 is formed on a plastic film 1, and then a liquid crystal 4 is sealed with a spacer 3 interposed therebetween. When a plastic film is used instead of a glass plate in this way, it is possible to make the liquid crystal display device thinner, and in the process of continuously winding the plastic film from reel A to reel B, a transparent conductive thin film is formed. And, since electrode patterning becomes possible, mass production is significantly improved.
本発明は上述した様なプラスチツクフイルムを
用いた液晶表示体装置のプラスチツクフイルムの
延長面に液晶駆動用半導体集積回路を実装して、
表示体部と表示体駆動部を一体化した表示体装置
の製造方法に関するものであり、以下に詳しく説
明する。 The present invention provides a liquid crystal display device using a plastic film as described above, in which a semiconductor integrated circuit for driving a liquid crystal is mounted on an extended surface of the plastic film.
The present invention relates to a method for manufacturing a display device in which a display unit and a display drive unit are integrated, and will be described in detail below.
第２図は本発明によるところの表示体装置の製
造方法の一例を示す説明図である。図中の１〜４
は第１図中において説明した１〜４と同じであ
る。図中において示す様にどちらか一方のプラス
チツクフイルムの延長面にAlあるいはCu等の金
属薄膜を用いてリードパターン５を形成する。リ
ードパターンの一端は図中のａで示す部分におい
て適当な方法で液晶表示電極に用いた透明導電膜
パターン２と接続される。一方、他端は図中のｂ
で示す部分において液晶駆動用半導体集積回路６
の電極部７と接続する。図中で示したよう半導体
集積回路の接続方式は、一般的にはテープキヤリ
アボンデイング法と呼ばれているものである。本
発明の上記実施例では、図より明らかな如く同一
プラスチツクフイルム上に表示部と駆動部を設け
るために、全体としての表示体装置が小型になる
とともに非常に薄型となる。さらに、プラスチツ
クフイルムを任意に折り曲げることによつて、他
の電子部品との接続の自由度が大きくなり高密度
の空間実装が可能となる。 FIG. 2 is an explanatory diagram showing an example of a method for manufacturing a display device according to the present invention. 1 to 4 in the diagram
are the same as 1 to 4 explained in FIG. As shown in the figure, a lead pattern 5 is formed on the extended surface of one of the plastic films using a metal thin film such as Al or Cu. One end of the lead pattern is connected to a transparent conductive film pattern 2 used as a liquid crystal display electrode by an appropriate method at a portion indicated by a in the figure. On the other hand, the other end is b in the figure.
In the part indicated by , the semiconductor integrated circuit for driving liquid crystal 6
It is connected to the electrode section 7 of. As shown in the figure, the connection method for semiconductor integrated circuits is generally called the tape carrier bonding method. In the above embodiment of the present invention, since the display section and the driving section are provided on the same plastic film as is clear from the figures, the display device as a whole becomes small and extremely thin. Furthermore, by arbitrarily bending the plastic film, the degree of freedom in connection with other electronic components increases, allowing for high-density spatial packaging.
第３図は第２図とともに本発明による表示体装
置の製造方法の一例を示す。第３図ａは本発明の
表示体装置の製造方法において用いるプラスチツ
クフイルムを示す。図中の１がプラスチツクフイ
ルムである。材質としてはポリエステル、ポリイ
ミド等何でもよい。図中の２は透明導電薄膜電
極、５は金属薄膜リード線であり図中のａの部分
で接続されている。８はプラステイツクテープに
あらかじめ明けられた穴である。金属薄膜リード
線は、該穴の周縁部から該穴の中心部へ向つて突
き出している。その後、第３図ｂに示す如く液晶
表示部と表示駆動回路部とを形成する。まず第３
図ａで示したプラスチツクフイルム上に、やはり
透明導電薄膜電極が形成されたプラスチツクフイ
ルムをスペーサー３を介して重ね合わせる。その
後、半導体集積回路６をリード線５にテープキヤ
リアポンデイングし、あるいは液晶を封入する。
このようにして電子回路を含むテープ状の表示体
装置が出来る訳であり、この連続したテープ状の
表示体装置を一旦リールに巻き取り、その後、別
工程でリールを巻き取られた表示体装置を解きな
がら電気特性チエツク後パンチングにて個々の表
示体装置に分割すればよい。 FIG. 3 together with FIG. 2 shows an example of a method for manufacturing a display device according to the present invention. FIG. 3a shows a plastic film used in the method for manufacturing a display device of the present invention. 1 in the figure is a plastic film. Any material such as polyester or polyimide may be used. 2 in the figure is a transparent conductive thin film electrode, and 5 is a metal thin film lead wire, which are connected at the part a in the figure. 8 is a hole pre-drilled in the plastic tape. The metal thin film lead wire protrudes from the periphery of the hole toward the center of the hole. Thereafter, a liquid crystal display section and a display drive circuit section are formed as shown in FIG. 3b. First, the third
A plastic film on which a transparent conductive thin film electrode is also formed is superimposed on the plastic film shown in FIG. Thereafter, the semiconductor integrated circuit 6 is bonded to the lead wire 5 using a tape carrier, or a liquid crystal is encapsulated therein.
In this way, a tape-shaped display device containing an electronic circuit is produced.This continuous tape-shaped display device is once wound onto a reel, and then the display device is wound up from the reel in a separate process. After checking the electrical characteristics while solving the problem, it is possible to divide the display device into individual display devices by punching.
本発明は以上説明した如く、透明導電薄膜電極
の形成されたフレキシブルシートを重ね合せて成
る液晶表示体装置において、フレキシブルシート
の延長面に半導体集積回路を実装したことを特徴
とする表示体装置の製造方法に関するものであ
り、次のような利点を有するものである。 As explained above, the present invention provides a liquid crystal display device formed by stacking flexible sheets on which transparent conductive thin film electrodes are formed, characterized in that a semiconductor integrated circuit is mounted on the extended surface of the flexible sheets. This relates to a manufacturing method and has the following advantages.
(1) 表示体装置の小型化、薄型化が可能となる。(1) The display device can be made smaller and thinner.
(2) シートあるいはテープを連続的に巻き取る工
程において、表示部あるいは駆動部が形成され
るため、量産性が常によくなる。(2) Since the display section or drive section is formed in the process of continuously winding up the sheet or tape, mass productivity is always improved.
尚、この際半導体集積回路チツプがフレキシ
ブルシートの穴内に突出する配線パターンに接
続され、また液晶表示部の上下基板ともフレキ
シブルテープで形成され柔軟性があるので、表
示体装置の巻き取りに際して、半導体集積回路
チツプの接続の剥離が液晶表示装置の破損とい
つた問題が無く、量産性に著しく寄与し得るも
のである。 At this time, the semiconductor integrated circuit chip is connected to the wiring pattern protruding into the hole of the flexible sheet, and since both the upper and lower substrates of the liquid crystal display are made of flexible tape and are flexible, the semiconductor integrated circuit chip is connected to the wiring pattern protruding into the hole of the flexible sheet. This eliminates the problem of damage to the liquid crystal display device caused by peeling off the connections of the integrated circuit chip, and can significantly contribute to mass productivity.
(3) 表示体装置のコストダウンが望まれる。(3) It is desirable to reduce the cost of display devices.
第１図はガラス板の代りにプラスチツクフイル
ムを用いて成る表示体装置の断面図、第２図、第
３図ａ，ｂは本発明による表示体装置の製造方法
の一例を説明する概観図。
１……プラスチツクフイルム、２……透明導電
薄膜電極、３……スペーサー、４……液晶、５…
…金属薄膜によるリード線、６……半導体集積回
路、７……半導体集積回路の電極、８……プラス
チツクフイルムに形成された穴、ａ……リード線
と透明導電薄膜との接続部分、ｂ……リード線と
半導体集積回路との接続部分。
FIG. 1 is a cross-sectional view of a display device using a plastic film instead of a glass plate, and FIGS. 2 and 3 a and 3b are schematic diagrams illustrating an example of the method for manufacturing the display device according to the present invention. 1...Plastic film, 2...Transparent conductive thin film electrode, 3...Spacer, 4...Liquid crystal, 5...
... Lead wire made of metal thin film, 6... Semiconductor integrated circuit, 7... Electrode of semiconductor integrated circuit, 8... Hole formed in plastic film, a... Connection portion between lead wire and transparent conductive thin film, b... ...Connection part between lead wire and semiconductor integrated circuit.
Claims (1)
集積回路チツプが配置される複数個の穴を設ける
とともに、前記第１のフレキシブルシートの上面
に表示駆動用の透明電極と前記透明電極に一端が
接続され他端が前記穴内に突出する金属箔膜によ
る配線パターンとを複数組配置し、前記透明電極
に対向する透明電極が設けられた第２のフレキシ
ブルシートを前記第１のフレキシブルシートにス
ペーサーを介して貼合せるとともに、前記２枚の
フレキシブルテープの間隙に液晶を注入し、且つ
前記第２のフレキシブルシートから離れた位置に
ありしかも前記穴内に突出した前記配線パターン
の一部に半導体集積回路チツプの電極部を直接接
続固定させ、その後前記第１のフレキシブルテー
プと第２のフレキシブルテープをリールに巻き取
る第１の工程と、前記巻き取られた第１と第２の
フレキシブルテープを解きながら前記液晶表示部
と半導体集積回路を１組とする表示装置に分割す
る第２の工程とを有することを特徴とする表示体
装置の製造方法。1. A continuous first flexible sheet is provided with a plurality of holes in which semiconductor integrated circuit chips are placed, and a transparent electrode for display driving is provided on the upper surface of the first flexible sheet, and one end is connected to the transparent electrode. A plurality of sets of wiring patterns made of a metal foil film whose ends protrude into the holes are arranged, and a second flexible sheet provided with a transparent electrode facing the transparent electrode is attached to the first flexible sheet via a spacer. At the same time, a liquid crystal is injected into the gap between the two flexible tapes, and an electrode portion of the semiconductor integrated circuit chip is placed on a part of the wiring pattern that is located away from the second flexible sheet and protrudes into the hole. a first step of directly connecting and fixing the first flexible tape and the second flexible tape, and then winding the first flexible tape and the second flexible tape onto a reel; and a second step of dividing the semiconductor integrated circuit into a set of display devices.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14383476A JPS5368099A (en) | 1976-11-29 | 1976-11-29 | Display unit |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14383476A JPS5368099A (en) | 1976-11-29 | 1976-11-29 | Display unit |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5368099A JPS5368099A (en) | 1978-06-17 |
| JPS6119995B2 true JPS6119995B2 (en) | 1986-05-20 |
Family
ID=15348017
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP14383476A Granted JPS5368099A (en) | 1976-11-29 | 1976-11-29 | Display unit |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5368099A (en) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS57168286A (en) * | 1981-04-03 | 1982-10-16 | Ricoh Kk | Liquid crystal display device |
| JPS57201287A (en) * | 1981-06-05 | 1982-12-09 | Ricoh Kk | Liquid crystal display unit |
| JPH079138Y2 (en) * | 1987-03-10 | 1995-03-06 | セイコー電子工業株式会社 | Structure of wiring pattern of LCD panel |
| JPH04233514A (en) * | 1990-12-28 | 1992-08-21 | Sharp Corp | Active matrix substrate |
| WO2001026876A1 (en) | 1999-10-08 | 2001-04-19 | Sumitomo Bakelite Company Limited | Process for production of polymer sheet and optical polymer sheet |
-
1976
- 1976-11-29 JP JP14383476A patent/JPS5368099A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5368099A (en) | 1978-06-17 |
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