JPS61198950U - - Google Patents
Info
- Publication number
- JPS61198950U JPS61198950U JP1985081287U JP8128785U JPS61198950U JP S61198950 U JPS61198950 U JP S61198950U JP 1985081287 U JP1985081287 U JP 1985081287U JP 8128785 U JP8128785 U JP 8128785U JP S61198950 U JPS61198950 U JP S61198950U
- Authority
- JP
- Japan
- Prior art keywords
- conductive adhesive
- cream solder
- thick film
- opening
- printing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000853 adhesive Substances 0.000 claims description 3
- 230000001070 adhesive effect Effects 0.000 claims description 3
- 239000006071 cream Substances 0.000 claims description 3
- 229910000679 solder Inorganic materials 0.000 claims description 3
- 238000007747 plating Methods 0.000 claims description 2
- 239000002184 metal Substances 0.000 claims 1
- 239000007787 solid Substances 0.000 claims 1
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 6
- 239000000463 material Substances 0.000 description 5
- 229910052759 nickel Inorganic materials 0.000 description 3
- 239000002245 particle Substances 0.000 description 3
Landscapes
- Manufacturing Of Printed Wiring (AREA)
Description
第１図は、本考案の一実施例に係る１枚の材料
からなるマスクを示す断面図、第２図は、本考案
の他の実施例に係る２枚の材料を貼合せ、その開
口部にメツキを施したマスクを示す断面図、第３
図は、従来の薄板ニツケル板等材料に開口部を形
成した例を表わした断面図、第４図は、従来の薄
板のニツケル板等材料を２枚貼り合せ、開口部を
形成した例を表わした断面図、そして、第５図は
、従来のマスクの開口部内側の凹凸部にクリーム
半田の粒子や導電性接着剤の粒子がひつかかり目
詰まりを起こしている状態を表わした断面図であ
る。
１……薄いニツケル等の材料、２……開口部、
３……段差、４……凹凸、５……材料粒子、６…
…メツキ。
FIG. 1 is a sectional view showing a mask made of one material according to one embodiment of the present invention, and FIG. 2 is a cross-sectional view showing a mask made of one material according to another embodiment of the present invention, and FIG. 3rd cross-sectional view showing a mask with plating applied to the
The figure shows a cross-sectional view of an example in which an opening is formed in a conventional thin nickel plate, etc., and Figure 4 shows an example in which an opening is formed by bonding two conventional thin nickel plates or other materials together. FIG. 5 is a cross-sectional view showing a state in which cream solder particles and conductive adhesive particles are stuck to the uneven parts inside the opening of a conventional mask, causing clogging. . 1...material such as thin nickel, 2...opening,
3...Level difference, 4...Irregularities, 5...Material particles, 6...
...Metsuki.
Claims (1)
スト等を印刷するのに使用するソリツドメタル系
の印刷用マスクにおいて、クリーム半田や導電性
接着剤、厚膜印刷用ベースト等を基板の部品面へ
印刷する開口部にメツキを施したことを特徴とす
る印刷用マスク。 In solid metal printing masks used to print cream solder, conductive adhesive, thick film printing paste, etc., cream solder, conductive adhesive, thick film printing paste, etc. can be printed on the component side of the board. A printing mask characterized by plating on the opening.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985081287U JPS61198950U (en) | 1985-05-30 | 1985-05-30 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985081287U JPS61198950U (en) | 1985-05-30 | 1985-05-30 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS61198950U true JPS61198950U (en) | 1986-12-12 |
Family
ID=30627933
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1985081287U Pending JPS61198950U (en) | 1985-05-30 | 1985-05-30 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61198950U (en) |
-
1985
- 1985-05-30 JP JP1985081287U patent/JPS61198950U/ja active Pending
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