JPS6119712B2 - - Google Patents

Info

Publication number
JPS6119712B2
JPS6119712B2 JP56040074A JP4007481A JPS6119712B2 JP S6119712 B2 JPS6119712 B2 JP S6119712B2 JP 56040074 A JP56040074 A JP 56040074A JP 4007481 A JP4007481 A JP 4007481A JP S6119712 B2 JPS6119712 B2 JP S6119712B2
Authority
JP
Japan
Prior art keywords
copper powder
silane coupling
coupling agent
temperature
oxidation
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP56040074A
Other languages
English (en)
Japanese (ja)
Other versions
JPS57155386A (en
Inventor
Tooru Kasatsugu
Toshiaki Ikeda
Koji Tani
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Murata Manufacturing Co Ltd
Original Assignee
Murata Manufacturing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Murata Manufacturing Co Ltd filed Critical Murata Manufacturing Co Ltd
Priority to JP56040074A priority Critical patent/JPS57155386A/ja
Publication of JPS57155386A publication Critical patent/JPS57155386A/ja
Publication of JPS6119712B2 publication Critical patent/JPS6119712B2/ja
Granted legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C2222/00—Aspects relating to chemical surface treatment of metallic material by reaction of the surface with a reactive medium
    • C23C2222/20—Use of solutions containing silanes

Landscapes

  • Preventing Corrosion Or Incrustation Of Metals (AREA)
  • Powder Metallurgy (AREA)
  • Chemical Treatment Of Metals (AREA)
JP56040074A 1981-03-18 1981-03-18 Preventing method for oxidation of copper powder Granted JPS57155386A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP56040074A JPS57155386A (en) 1981-03-18 1981-03-18 Preventing method for oxidation of copper powder

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP56040074A JPS57155386A (en) 1981-03-18 1981-03-18 Preventing method for oxidation of copper powder

Publications (2)

Publication Number Publication Date
JPS57155386A JPS57155386A (en) 1982-09-25
JPS6119712B2 true JPS6119712B2 (en:Method) 1986-05-19

Family

ID=12570770

Family Applications (1)

Application Number Title Priority Date Filing Date
JP56040074A Granted JPS57155386A (en) 1981-03-18 1981-03-18 Preventing method for oxidation of copper powder

Country Status (1)

Country Link
JP (1) JPS57155386A (en:Method)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003064344A (ja) * 2001-08-30 2003-03-05 Hitachi Chem Co Ltd 回路接続用接着剤及びそれを用いた回路接続構造体

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2676810B2 (ja) * 1988-08-31 1997-11-17 株式会社島津製作所 熱伝導度検出器
JP2578273B2 (ja) * 1991-08-22 1997-02-05 第一工業製薬株式会社 多層電極基板の製造方法
JP5358776B2 (ja) * 2010-11-18 2013-12-04 株式会社本螺子製作所 金属表面保護剤、金属表面保護剤の製造方法および金属表面処理方法
JP6324253B2 (ja) * 2014-07-30 2018-05-16 Ｊｘ金属株式会社 導電性ペースト及びその製造方法
JP6515829B2 (ja) * 2015-03-16 2019-05-22 住友金属鉱山株式会社 銅粉末及びその製造方法
US11872647B2 (en) 2018-12-27 2024-01-16 Jx Metals Corporation Production method of additive manufactured object using pure copper powder having Si coating
CN111836692B (zh) 2018-12-27 2022-10-25 捷客斯金属株式会社 具有Si覆膜的纯铜粉及其制造方法
JP7121173B1 (ja) * 2021-07-19 2022-08-17 大陽日酸株式会社 複合銅ナノ粒子及び複合銅ナノ粒子の製造方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003064344A (ja) * 2001-08-30 2003-03-05 Hitachi Chem Co Ltd 回路接続用接着剤及びそれを用いた回路接続構造体

Also Published As

Publication number Publication date
JPS57155386A (en) 1982-09-25

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