JPS61195996A - 液流式めつき方法 - Google Patents

液流式めつき方法

Info

Publication number
JPS61195996A
JPS61195996A JP3604785A JP3604785A JPS61195996A JP S61195996 A JPS61195996 A JP S61195996A JP 3604785 A JP3604785 A JP 3604785A JP 3604785 A JP3604785 A JP 3604785A JP S61195996 A JPS61195996 A JP S61195996A
Authority
JP
Japan
Prior art keywords
plating
flow
liquid
plated
liquid flow
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP3604785A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0149797B2 (enrdf_load_stackoverflow
Inventor
Koichi Kayane
茅根　浩一
Hiromichi Yoshida
博通 吉田
Shigeo Hagitani
萩谷　重夫
Norio Okabe
則夫 岡部
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Cable Ltd
Original Assignee
Hitachi Cable Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Cable Ltd filed Critical Hitachi Cable Ltd
Priority to JP3604785A priority Critical patent/JPS61195996A/ja
Publication of JPS61195996A publication Critical patent/JPS61195996A/ja
Publication of JPH0149797B2 publication Critical patent/JPH0149797B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Electroplating Methods And Accessories (AREA)
JP3604785A 1985-02-25 1985-02-25 液流式めつき方法 Granted JPS61195996A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP3604785A JPS61195996A (ja) 1985-02-25 1985-02-25 液流式めつき方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP3604785A JPS61195996A (ja) 1985-02-25 1985-02-25 液流式めつき方法

Publications (2)

Publication Number Publication Date
JPS61195996A true JPS61195996A (ja) 1986-08-30
JPH0149797B2 JPH0149797B2 (enrdf_load_stackoverflow) 1989-10-26

Family

ID=12458795

Family Applications (1)

Application Number Title Priority Date Filing Date
JP3604785A Granted JPS61195996A (ja) 1985-02-25 1985-02-25 液流式めつき方法

Country Status (1)

Country Link
JP (1) JPS61195996A (enrdf_load_stackoverflow)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2001034881A3 (de) * 1999-11-09 2001-11-29 Siemens Ag Vorrichtung zur elektrolytischen behandlung von plattenförmigen werkstücken, insbesondere von leiterplatten
JP2014194064A (ja) * 2013-02-27 2014-10-09 Sumitomo Metal Mining Co Ltd めっき装置
CN112501664A (zh) * 2020-11-24 2021-03-16 深圳明阳芯蕊半导体有限公司 Pcb板电镀方法和pcb板电镀设备

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2001034881A3 (de) * 1999-11-09 2001-11-29 Siemens Ag Vorrichtung zur elektrolytischen behandlung von plattenförmigen werkstücken, insbesondere von leiterplatten
JP2014194064A (ja) * 2013-02-27 2014-10-09 Sumitomo Metal Mining Co Ltd めっき装置
CN112501664A (zh) * 2020-11-24 2021-03-16 深圳明阳芯蕊半导体有限公司 Pcb板电镀方法和pcb板电镀设备

Also Published As

Publication number Publication date
JPH0149797B2 (enrdf_load_stackoverflow) 1989-10-26

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