JPH0149797B2 - - Google Patents
Info
- Publication number
- JPH0149797B2 JPH0149797B2 JP3604785A JP3604785A JPH0149797B2 JP H0149797 B2 JPH0149797 B2 JP H0149797B2 JP 3604785 A JP3604785 A JP 3604785A JP 3604785 A JP3604785 A JP 3604785A JP H0149797 B2 JPH0149797 B2 JP H0149797B2
- Authority
- JP
- Japan
- Prior art keywords
- plating
- liquid
- plated
- flow
- liquid flow
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000007747 plating Methods 0.000 claims description 136
- 239000007788 liquid Substances 0.000 claims description 78
- 238000000034 method Methods 0.000 claims description 28
- 238000003756 stirring Methods 0.000 description 16
- 238000002347 injection Methods 0.000 description 13
- 239000007924 injection Substances 0.000 description 13
- 230000000052 comparative effect Effects 0.000 description 5
- 230000000694 effects Effects 0.000 description 5
- 239000000243 solution Substances 0.000 description 5
- 230000000873 masking effect Effects 0.000 description 3
- 239000004020 conductor Substances 0.000 description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 238000013019 agitation Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- LFAGQMCIGQNPJG-UHFFFAOYSA-N silver cyanide Chemical compound [Ag+].N#[C-] LFAGQMCIGQNPJG-UHFFFAOYSA-N 0.000 description 1
- 229940098221 silver cyanide Drugs 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
Landscapes
- Electroplating Methods And Accessories (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3604785A JPS61195996A (ja) | 1985-02-25 | 1985-02-25 | 液流式めつき方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3604785A JPS61195996A (ja) | 1985-02-25 | 1985-02-25 | 液流式めつき方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS61195996A JPS61195996A (ja) | 1986-08-30 |
| JPH0149797B2 true JPH0149797B2 (enrdf_load_stackoverflow) | 1989-10-26 |
Family
ID=12458795
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3604785A Granted JPS61195996A (ja) | 1985-02-25 | 1985-02-25 | 液流式めつき方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61195996A (enrdf_load_stackoverflow) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DK1230442T3 (da) * | 1999-11-09 | 2003-09-29 | Siemens Ag | Indretning til elektrolytisk behandling af pladeformede arbejdsemner, især printplader |
| JP6127726B2 (ja) * | 2013-02-27 | 2017-05-17 | 住友金属鉱山株式会社 | めっき装置 |
| CN112501664B (zh) * | 2020-11-24 | 2022-04-22 | 深圳明阳芯蕊半导体有限公司 | Pcb板电镀方法和pcb板电镀设备 |
-
1985
- 1985-02-25 JP JP3604785A patent/JPS61195996A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS61195996A (ja) | 1986-08-30 |
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