JPS61188473A - Production of conductor paste - Google Patents
Production of conductor pasteInfo
- Publication number
- JPS61188473A JPS61188473A JP2785085A JP2785085A JPS61188473A JP S61188473 A JPS61188473 A JP S61188473A JP 2785085 A JP2785085 A JP 2785085A JP 2785085 A JP2785085 A JP 2785085A JP S61188473 A JPS61188473 A JP S61188473A
- Authority
- JP
- Japan
- Prior art keywords
- powder
- palladium
- conductor paste
- silver
- inorganic oxide
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
- H05K1/092—Dispersed materials, e.g. conductive pastes or inks
Landscapes
- Paints Or Removers (AREA)
- Conductive Materials (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は、積層セラミックコンデンサや、積層セラミ、
り配線基板、積層セラミック電歪素子等の内部電極の形
成に用いる導体ペーストの製造方法に関するものである
。[Detailed Description of the Invention] [Industrial Application Field] The present invention is applicable to multilayer ceramic capacitors, multilayer ceramic capacitors,
The present invention relates to a method for manufacturing a conductive paste used for forming internal electrodes of wiring boards, laminated ceramic electrostrictive elements, etc.
従来、この種の導体ペーストは、主として銀粉末とパラ
ジウム粉末とガラス等の無機酸化物粉末およびビヒクル
とからな、シ、第5図に示すようにV型混合機等を用い
て銀粉末、パラジウム粉末および無機酸化物粉末を同時
に混合し、混合後ビ七クルを加えて三本ロールミル等で
混錬してペースト状にしていた。Conventionally, this type of conductor paste mainly consists of silver powder, palladium powder, inorganic oxide powder such as glass, and a vehicle. The powder and the inorganic oxide powder were mixed at the same time, and after mixing, a vehicle was added and kneaded using a three-roll mill or the like to form a paste.
上述した従来の導体ペーストは、銀粉末、パラジウム粉
末および無機酸化物粉末を同時に混合しておシ、その結
果、銀粉末とパラジウム粉末のおのおのの粒子間に無機
酸化物粉末が無秩序状態に存在する形態となシ、焼成時
に銀成分のみが単独に蒸発して銀とパラジウム、の合金
化が促進されないため導電率が低くな、シ・、、□導体
としての機能が発現しないはかシでなく、銀成分の蒸発
による空孔の発生が起こ〕、熱的、パ機・械的ストレス
に対して極めて弱い結果をもたらし:た。特に積層セラ
ミ4.・り電歪素子の場合、素子の・積層面に対して垂
直方向に機械的ストレスが常時過激な状態で加わるため
、内部電極とセラミ、クスの界面の接合力が非常に重要
となる。従来の導体ペーストを使用した場合、上述の理
由によシ繰り返し駆動中に内部電極とセラミックスの界
面にクラ、りが生じたシ破断したりして、長期実用時の
信頼性に非常に乏しかった。The conventional conductor paste described above is made by simultaneously mixing silver powder, palladium powder, and inorganic oxide powder, and as a result, the inorganic oxide powder exists in a disordered state between each particle of the silver powder and palladium powder. However, during firing, only the silver component evaporates independently and the alloying of silver and palladium is not promoted, resulting in low conductivity. , vacancies were generated due to evaporation of the silver component], resulting in extremely weak resistance to thermal, mechanical, and mechanical stress. Especially laminated ceramic 4. - In the case of electrostrictive elements, extreme mechanical stress is constantly applied in a direction perpendicular to the laminated surface of the element, so the bonding strength between the internal electrodes, ceramic, and glass interfaces is extremely important. When conventional conductive paste was used, due to the reasons mentioned above, cracks, gluing, and breakage occurred at the interface between the internal electrode and the ceramic during repeated driving, resulting in extremely poor reliability during long-term practical use. .
本発明はかかる従来欠点を解消するためになされたもの
であル先ず銀粉末とパラジウム粉末とを混合し、これら
の二次粒子を形成した後、無機酸化物粉末を添加して、
上記の二次粒子間に無機酸化物粉末を分散させ、しかる
後、ビヒクルを加えて混錬しペースト状に形成する工程
を含むことを特徴としている。The present invention has been made in order to eliminate such conventional drawbacks. First, silver powder and palladium powder are mixed to form secondary particles of these particles, and then an inorganic oxide powder is added.
It is characterized in that it includes a step of dispersing inorganic oxide powder between the secondary particles, and then adding a vehicle and kneading it to form a paste.
すなわち、本発明の狙いは、従来ペーストが銀粉末、パ
ラジウム粉末および無機酸化物粉末を同時に混合するの
に対して、予じめ銀粉末とパラジウム粉末を混合して銀
とパラジウムの二次粒子を形成しているため焼成時に無
機酸化物粉末による銀・パラジウムの合金化阻害はなく
なシ、したがって銀成分の蒸発が防止される点にある。That is, the aim of the present invention is to mix silver powder and palladium powder in advance to form secondary particles of silver and palladium, whereas conventional pastes mix silver powder, palladium powder, and inorganic oxide powder at the same time. Because of this, there is no inhibition of alloying of silver and palladium by the inorganic oxide powder during firing, and therefore evaporation of the silver component is prevented.
このため、前述した導電率や熱的・機械的ストレスに対
しても向上する効果をもたらし、従来欠点を除去できる
ようになった。Therefore, the above-mentioned electrical conductivity and thermal/mechanical stress can be improved, and the conventional drawbacks can be eliminated.
以下、本発明について図面を参照して説明する。 Hereinafter, the present invention will be explained with reference to the drawings.
第1図は、本発明の導体ペーストの製造工程を示すブロ
ック図である。FIG. 1 is a block diagram showing the manufacturing process of the conductive paste of the present invention.
本発明では先ず銀粉末とパラジウム粉末とをV型混合機
内で10時間混合し、微粉化された銀とパラジウムの二
次粒子を形成し、次に同じこのV型混合機内に無機酸化
物の粉末を添加して1.5時間混合し銀・パラジウムの
二次粒子間に無機酸化物粉末を分散させ、これにビヒク
ルを加えて三本ロールミルで混錬してペースト状の導電
ペーストを製造する。In the present invention, silver powder and palladium powder are first mixed in a V-type mixer for 10 hours to form finely divided secondary particles of silver and palladium, and then inorganic oxide powder is mixed in the same V-type mixer. is added and mixed for 1.5 hours to disperse the inorganic oxide powder between the silver/palladium secondary particles, and a vehicle is added thereto and kneaded in a three-roll mill to produce a paste-like conductive paste.
次に本発明の実施例による導体ペーストを製品へ適用し
た例について説明する。Next, an example in which a conductive paste according to an embodiment of the present invention is applied to a product will be described.
第2図は本発明による導体ペーストを内部電極として使
用した積層セラミ、り電歪素子の製造工S歯である。FIG. 2 shows a manufacturing process for a laminated ceramic electrostrictive element using the conductive paste according to the present invention as an internal electrode.
第2図に示すように先ず酸化鉛、酸化ニッケル、酸化チ
タン、酸化ニオブ、酸化ジルコニウム等からなる無機酸
化物粉末の混合扮に有機バインダーと有機溶媒を混ぜた
ものをスリブ・フキヤスティング成膜法によジグリーン
シートを形成する。次に本発明による導体ペーストを使
用して、グリーンシート上に内部電極をスクリーン印刷
法によシ形成する。この導体ペーストの組成は電歪素子
の焼成温度条件に合わせて銀粉末70wt1Lパラジウ
ム粉末30wt%にグリーンシードと同組成の無機酸化
物粉末を銀−パラジウム混□合粉に対して15wt$添
加したものからなっている。次にこの内部電極を印刷し
たグリーンシート全所定の形状にパンチングし、所定の
枚数を積層し熱プレス機等で熱圧着して積層体を得る。As shown in Figure 2, first, a mixture of inorganic oxide powders consisting of lead oxide, nickel oxide, titanium oxide, niobium oxide, zirconium oxide, etc., mixed with an organic binder and an organic solvent is used to form a film using the slab casting method. Form a green sheet. Next, internal electrodes are formed on the green sheet by screen printing using the conductor paste according to the present invention. The composition of this conductor paste is 70 wt% of silver powder, 30 wt% of 1L palladium powder, and 15 wt$ of inorganic oxide powder with the same composition as green seeds added to the silver-palladium mixed powder, in accordance with the firing temperature conditions of the electrostrictive element. It consists of Next, all of the green sheets printed with the internal electrodes are punched into a predetermined shape, and a predetermined number of sheets are laminated and bonded under heat using a hot press or the like to obtain a laminate.
更にこの積層体をピーク温度が約1100℃で2時間保
持する条件のもとて焼成し、焼成の完了したものを所定
の形状に切断し第3図に示すように積層セラミック電歪
素子1を得る。本実施例では、縦3mm、横2m、厚さ
9nmの形状とした。なお、□符号2は内部電極形成層
である。Further, this laminate was fired under conditions where the peak temperature was maintained at approximately 1100° C. for 2 hours, and the fired product was cut into a predetermined shape to form a multilayer ceramic electrostrictive element 1 as shown in FIG. obtain. In this example, the shape was 3 mm long, 2 m wide, and 9 nm thick. Note that □ symbol 2 is an internal electrode forming layer.
第4図は、本発明による導体ペーストと従来方法による
導体ペーストを内部電極として使用したセラミック電歪
素子の引張シ試験の結果を示す図である。引張シ方向は
第4図の符号3に示す矢印の方向である。これは内部電
極印刷面に対して垂直方向である。第4図から分れるよ
うに本発明による導体ペーストを内部゛電極として使用
することによシ引張シ強度は平均値で約3倍向上した。FIG. 4 is a diagram showing the results of a tensile test of ceramic electrostrictive elements using the conductor paste according to the present invention and the conductor paste according to the conventional method as internal electrodes. The tensile direction is the direction indicated by the arrow 3 in FIG. This is perpendicular to the internal electrode printing surface. As can be seen from FIG. 4, by using the conductor paste according to the present invention as an internal electrode, the tensile strength was improved by about three times on average.
また破断モードは、従来品のすべてが内部電極部で破断
するのに対して本発明品ではそれが約50%であった。In addition, as for the fracture mode, all of the conventional products were fractured at the internal electrode portion, whereas the fracture mode of the present invention product was approximately 50%.
これは本発明による導体ペーストでは、焼成後確実に銀
とパラジウムが合金化し内部電極自身の機械的強度およ
びセラミック電歪素子のセラミック材との接合性が向上
したことによるものである。This is because, in the conductive paste according to the present invention, silver and palladium are reliably alloyed after firing, and the mechanical strength of the internal electrode itself and the bondability with the ceramic material of the ceramic electrostrictive element are improved.
第5図は、従来の導体ペースト製造工程図、第1図は、
本発明による導体ペーストの製造工程図、第2図は本発
明による導体ペーストを内部電極として使用したセラミ
、り電歪素子の製造工程図、第3図、第2図で製造した
セラミック電歪素子の斜視図、第4図は、本発明及び従
来の導体ベースを用いたセラミック電歪素子の引張試験
による引張強度を示す図である。
1・・・・・・セラミック電歪素子、2・・・・・・内
部電極形成層、3・・・・・・引張試験方向。
茅 5 回Figure 5 is a conventional conductor paste manufacturing process diagram, Figure 1 is:
A manufacturing process diagram of the conductive paste according to the present invention, FIG. 2 is a manufacturing process diagram of a ceramic electrostrictive element using the conductive paste according to the present invention as an internal electrode, FIG. 3, and a ceramic electrostrictive element manufactured according to FIG. FIG. 4 is a diagram showing the tensile strength in a tensile test of ceramic electrostrictive elements using conductor bases of the present invention and a conventional conductor base. 1... Ceramic electrostrictive element, 2... Internal electrode formation layer, 3... Tensile test direction. Kaya 5 times
Claims (1)
混合粉末を形成する工程と、前記混合粉末に無機酸化物
粉末を添加して二次粒子間に無機酸化物粉末を分散して
混合させた後ビヒクルを加えて混錬しペースト状に形成
する工程とを含むことを特徴とする導体ペーストの製造
方法。A step of mixing silver powder and palladium powder to form a mixed powder consisting of secondary particles, and adding an inorganic oxide powder to the mixed powder to disperse and mix the inorganic oxide powder between the secondary particles. 1. A method for producing a conductive paste, the method comprising: adding a vehicle and kneading the paste to form a paste.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2785085A JPS61188473A (en) | 1985-02-15 | 1985-02-15 | Production of conductor paste |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2785085A JPS61188473A (en) | 1985-02-15 | 1985-02-15 | Production of conductor paste |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS61188473A true JPS61188473A (en) | 1986-08-22 |
Family
ID=12232392
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2785085A Pending JPS61188473A (en) | 1985-02-15 | 1985-02-15 | Production of conductor paste |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS61188473A (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5281389A (en) * | 1992-08-03 | 1994-01-25 | Motorola, Inc. | Palladium paste and process for forming palladium film onto a ceramic substrate utilizing the paste |
WO2006103847A1 (en) * | 2005-03-28 | 2006-10-05 | Ngk Insulators, Ltd. | Conductor paste and electronic component |
-
1985
- 1985-02-15 JP JP2785085A patent/JPS61188473A/en active Pending
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5281389A (en) * | 1992-08-03 | 1994-01-25 | Motorola, Inc. | Palladium paste and process for forming palladium film onto a ceramic substrate utilizing the paste |
WO2006103847A1 (en) * | 2005-03-28 | 2006-10-05 | Ngk Insulators, Ltd. | Conductor paste and electronic component |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP3532926B2 (en) | Resistance wiring board and method of manufacturing the same | |
JP2014101271A (en) | Piezoelectric ceramic multilayer element | |
JP3422233B2 (en) | Conductive paste for via hole and method for manufacturing multilayer ceramic substrate using the same | |
US7531947B2 (en) | Stacked piezoelectric element and production method thereof | |
US7083745B2 (en) | Production method for laminate type dielectric device and electrode paste material | |
JP3045531B2 (en) | Stacked displacement element | |
JPH0569319B2 (en) | ||
JPS61188473A (en) | Production of conductor paste | |
JP2004241590A (en) | Laminated piezoelectric element | |
JPH07263272A (en) | Manufacture of laminated electronic component | |
JPH0348415A (en) | Paste composition and manufacture of laminated ceramic capacitor | |
JPH05128910A (en) | Conductor paste | |
JPH01166599A (en) | Manufacture of laminated ceramic substrate | |
JP3240873B2 (en) | Low temperature fired ceramic dielectric and low temperature fired ceramic multilayer circuit board | |
JPH11157945A (en) | Production of ceramic electronic part and green sheet for dummy used therefor | |
JPS6092697A (en) | Composite laminated ceramic part | |
JP3369312B2 (en) | Multilayer piezoelectric element and method of manufacturing the same | |
JPS6092692A (en) | Composite circuit with varistor and method of producing same | |
JPS6089995A (en) | Composite laminated ceramic part | |
JPH05315720A (en) | Conductor material for class or glass ceramic board | |
JPH06227852A (en) | Electrically conductive composition | |
JPH04243173A (en) | Electrostrictive effect element | |
JPH0290551A (en) | Manufacture of ceramic package | |
JPH0982560A (en) | Multilayer ceramic capacitor | |
JPH04329209A (en) | Electrically conductive paste |