JPH04243173A - Electrostrictive effect element - Google Patents

Electrostrictive effect element

Info

Publication number
JPH04243173A
JPH04243173A JP356891A JP356891A JPH04243173A JP H04243173 A JPH04243173 A JP H04243173A JP 356891 A JP356891 A JP 356891A JP 356891 A JP356891 A JP 356891A JP H04243173 A JPH04243173 A JP H04243173A
Authority
JP
Japan
Prior art keywords
electrodes
end faces
printed
lower end
sintered body
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP356891A
Inventor
Kenichi Omatsu
Original Assignee
Nec Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nec Corp filed Critical Nec Corp
Priority to JP356891A priority Critical patent/JPH04243173A/en
Publication of JPH04243173A publication Critical patent/JPH04243173A/en
Application status is Pending legal-status Critical

Links

Abstract

PURPOSE: To improve yield of element manufacturing steps and to improve reliability of the element by so forming outer electrodes formed on both upper and lower end faces of a multilayered sintered body as to be smaller than profiles of both upper and lower end faces of the sintered body.
CONSTITUTION: 30 electrostrictive sheets 1 on which inner electrodes 2 are not printed, 120 electrostrictive sheets on which the electrodes are printed, and further 30 electrostrictive sheets 1 on which the electrodes are not printed, are sequentially stacked, thermally pressed to be integrated, and sintered. After the sintered body is sliced in a rectangular state, glass insulators 3a, 3b are alternately formed on the electrodes 2 every other layers. The surface is covered with high temperature baking type paste, dried, and then baked to form outer electrodes 4a, 4b. Further, both the upper and lower end faces are also so covered with the same paste in an independent pattern inside from the profile of the end face of an element so as not to dispose the cut part on the pattern at the time of cutting, dried, and then baked to form outer electrodes 5a, 5b of the end faces.
COPYRIGHT: (C)1992,JPO&Japio
JP356891A 1991-01-17 1991-01-17 Electrostrictive effect element Pending JPH04243173A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP356891A JPH04243173A (en) 1991-01-17 1991-01-17 Electrostrictive effect element

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP356891A JPH04243173A (en) 1991-01-17 1991-01-17 Electrostrictive effect element

Publications (1)

Publication Number Publication Date
JPH04243173A true JPH04243173A (en) 1992-08-31

Family

ID=11561044

Family Applications (1)

Application Number Title Priority Date Filing Date
JP356891A Pending JPH04243173A (en) 1991-01-17 1991-01-17 Electrostrictive effect element

Country Status (1)

Country Link
JP (1) JPH04243173A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6475831B2 (en) 1998-08-21 2002-11-05 Micron Technology, Inc. Methods for a low profile multi-IC chip package connector
US6906408B2 (en) 2000-07-12 2005-06-14 Micron Technology, Inc. Assemblies and packages including die-to-die connections
WO2010141299A1 (en) * 2009-06-04 2010-12-09 Cts Corporation Piezoelectric stack actuator assembly

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6475831B2 (en) 1998-08-21 2002-11-05 Micron Technology, Inc. Methods for a low profile multi-IC chip package connector
US6486546B2 (en) * 1998-08-21 2002-11-26 Micron Technology, Inc. Low profile multi-IC chip package connector
US6686655B2 (en) 1998-08-21 2004-02-03 Micron Technology, Inc. Low profile multi-IC chip package connector
US6773955B2 (en) 1998-08-21 2004-08-10 Micron Technology, Inc. Low profile multi-IC chip package connector
US6906408B2 (en) 2000-07-12 2005-06-14 Micron Technology, Inc. Assemblies and packages including die-to-die connections
US6984544B2 (en) 2000-07-12 2006-01-10 Micron Technology, Inc. Die to die connection method and assemblies and packages including dice so connected
WO2010141299A1 (en) * 2009-06-04 2010-12-09 Cts Corporation Piezoelectric stack actuator assembly

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