JPS61272984A - Electrostrictive effect element - Google Patents

Electrostrictive effect element

Info

Publication number
JPS61272984A
JPS61272984A JP60114505A JP11450585A JPS61272984A JP S61272984 A JPS61272984 A JP S61272984A JP 60114505 A JP60114505 A JP 60114505A JP 11450585 A JP11450585 A JP 11450585A JP S61272984 A JPS61272984 A JP S61272984A
Authority
JP
Japan
Prior art keywords
layer
solder
internal electrode
electrostrictive
effect element
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP60114505A
Other languages
Japanese (ja)
Inventor
Takeshi Nishizawa
西澤 猛
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp filed Critical NEC Corp
Priority to JP60114505A priority Critical patent/JPS61272984A/en
Publication of JPS61272984A publication Critical patent/JPS61272984A/en
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10NELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00Piezoelectric or electrostrictive devices
    • H10N30/80Constructional details
    • H10N30/87Electrodes or interconnections, e.g. leads or terminals
    • H10N30/875Further connection or lead arrangements, e.g. flexible wiring boards, terminal pins
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10NELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00Piezoelectric or electrostrictive devices
    • H10N30/01Manufacture or treatment
    • H10N30/06Forming electrodes or interconnections, e.g. leads or terminals
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10NELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00Piezoelectric or electrostrictive devices
    • H10N30/50Piezoelectric or electrostrictive devices having a stacked or multilayer structure

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Transducers For Ultrasonic Waves (AREA)

Abstract

PURPOSE:To solder a lead wire by a small quantity of a solder by laminating and disposing electrostrictive material layers while being held by internal electrode layers, extending an external electrode, which is connected electrically at every other layer with internal electrodes by conductors, onto a protective layer and connecting the external electrode to a lead terminal. CONSTITUTION:An electrostrictive effect element consists of electrostrictive material layers 1 made of ceramics composed of titanate zinc zirconate in 0.1m thickness, internal electrode layers 2 using a silver-palladium alloy in 5mum thickness and insulating protective films 3, which insulate the end surfaces of the internal electrode layers 2 at every one layer and are composed of a glass film in 15mum thickness. External electrodes 4 to which silver paste is applied are mounted outside the electrostrictive effect element, and connected electrically to lead wires 5 such as polyurethane coated copper wires having a 0.23fmm diameter by solder 6 such as eutectic solder. Solder 6 connecting the external electrodes 4 and the lead wires 5 is connected to the external electrodes 4 formed extended onto a protective layer 7 shaped to an outermost layer as a piezoelectrically inactive dummy layer.

Description

【発明の詳細な説明】 〔産業上の利用分野〕 本発明はメカトロニクス機器に用いる電歪効果素子に関
し、特に積層型の電歪効果素子の端子の取シ出し構造に
関する。
DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to an electrostrictive effect element used in mechatronic equipment, and more particularly to a terminal extraction structure of a laminated electrostrictive effect element.

〔従来の技術〕[Conventional technology]

従来、積層型の電歪効果素子は第3図に示す構造を採っ
ている。第3図において1は複合ペロブスカイト構造を
有するチタン酸ジルコニウム酸鉛からなるセラミックの
電歪材層であり、2は銀−パラジウム合金を用いた内部
電極層である。
Conventionally, a stacked electrostrictive effect element has a structure shown in FIG. In FIG. 3, 1 is a ceramic electrostrictive material layer made of lead zirconate titanate having a composite perovskite structure, and 2 is an internal electrode layer using a silver-palladium alloy.

3は内部電極層2の端面を一層おきに絶縁するために被
着されている絶縁保護膜でちる。4は内部電極層2を一
層おきに電気的接続するために被着した外部電極である
Reference numeral 3 denotes an insulating protective film coated to insulate the end faces of the internal electrode layers 2 every other layer. Reference numeral 4 designates external electrodes deposited to electrically connect every other internal electrode layer 2.

通常、電歪効果素子に電気信号を加えるためには、外部
電極4にリード線5を半田6を介して半田付けで取り付
けている。
Normally, in order to apply an electric signal to the electrostrictive element, a lead wire 5 is attached to the external electrode 4 via a solder 6.

〔発明が解決、しようとする問題点〕[Problems that the invention attempts to solve]

この半田付は時の半田量は出来るだけ少量がよい。その
理由は半田量が多いと電歪効果素子動作時の伸び縮みの
ときに半田6と外部電極4との間に応力が働き動作時の
信頼性が低下する。
It is best to use as little solder as possible during this soldering process. The reason for this is that if the amount of solder is large, stress will be generated between the solder 6 and the external electrode 4 when the electrostrictive element expands and contracts during operation, reducing reliability during operation.

少量の半田でリード線を半田付は接続するためには、リ
ード線の線径を小さくしなければならない。したがって
線径が小さくなるとリード線が切れやすく゛なるなどの
取扱上の欠点が生じる。
In order to solder and connect lead wires with a small amount of solder, the wire diameter of the lead wires must be made small. Therefore, as the wire diameter becomes smaller, there are disadvantages in handling such as the lead wire being more likely to break.

〔問題点を解決するための手段〕[Means for solving problems]

本発明の目的はかかる従来欠点を除去した電歪効果素子
を提供することにある。
An object of the present invention is to provide an electrostrictive effect element that eliminates such conventional drawbacks.

本発明の電歪効果素子は電歪材層が内部電極層にはさま
れて積層配設され、かつ上下2層の内部m極層に接した
電歪材からなる保護層を有する積層体の側面に露出する
内部電極層の端面が部分的に絶縁性保護膜でamされ、
さらに導電体によって内部電極l−と1層おきに電気的
に接続する外部電極が保護層上に延長され、保護層上に
延長形成された外部電極上でリード端子が電気的に接続
されたことを特徴とする。
The electrostrictive effect element of the present invention is a laminate in which an electrostrictive material layer is sandwiched between internal electrode layers and has a protective layer made of an electrostrictive material in contact with two internal m-pole layers, upper and lower. The end face of the internal electrode layer exposed on the side surface is partially covered with an insulating protective film,
Further, external electrodes electrically connected to internal electrodes l- every other layer by conductors are extended onto the protective layer, and lead terminals are electrically connected on the external electrodes extended and formed on the protective layer. It is characterized by

〔実施例〕〔Example〕

以下、本発明について図面を参照して説明する。 Hereinafter, the present invention will be explained with reference to the drawings.

第1図は本発明の一実施例の電歪効果素子の斜視図であ
る。
FIG. 1 is a perspective view of an electrostrictive element according to an embodiment of the present invention.

図中、1は厚さ0.1 mのチタン酸ジルコニウム酸鉛
からなるセラミ、りの電歪材層、2は厚さ5μmの銀−
パラジウム合金を用いた内部電極層、3は内部電極層2
の端面を一層おきに絶縁させた厚さ15μmのガラス皮
膜の絶縁保護膜、4は銀ペースト被着させた外部電極、
5は直径0.2層mのポリウレタン被棟銅線などのリー
ド線、6は外部電極4とリード線5を電気的接続する共
晶半田などの半田である。この外部電極4−とリード線
5とを接続する半田6は、圧電的に不活性なダミ一層と
して最外層に設けた保護層7上に延長して形成された外
部電極4に接続させている。 。
In the figure, 1 is an electrostrictive material layer made of ceramic lead zirconate titanate with a thickness of 0.1 m, and 2 is a silver layer with a thickness of 5 μm.
Internal electrode layer using palladium alloy, 3 is internal electrode layer 2
4 is an insulating protective film made of a glass film with a thickness of 15 μm, insulating the end face of every other layer, 4 is an external electrode coated with silver paste,
5 is a lead wire such as a polyurethane-coated copper wire having a diameter of 0.2 m, and 6 is a solder such as eutectic solder for electrically connecting the external electrode 4 and the lead wire 5. The solder 6 that connects the external electrode 4- and the lead wire 5 is connected to the external electrode 4, which is extended and formed on a protective layer 7 provided as the outermost layer as a piezoelectrically inert dummy layer. . .

次に本実施例を製造工程順に説明する。Next, this embodiment will be explained in order of manufacturing steps.

先ずチタン酸鉛などからなるセラミックの仮焼粉末を準
備し、少量のポリブチラール樹脂などの有慨バインダー
および7タル酸ジオクチルなどの可塑剤と共にエチルセ
ロソルブなどの有機溶媒中に分散させ、泥漿をつくる。
First, a ceramic calcined powder made of lead titanate or the like is prepared and dispersed in an organic solvent such as ethyl cellosolve with a small amount of a binder such as polybutyral resin and a plasticizer such as dioctyl heptalate to form a slurry. .

との泥漿をドクターブレードを用いたスリップキャステ
ィング法により厚さ100μmのポリエステルフィルム
上に流動塗布し、厚さ70μmの電歪材となるグリーン
シートを被着形成する。
The slurry was fluidly applied onto a 100 μm thick polyester film by a slip casting method using a doctor blade to form a 70 μm thick green sheet serving as an electrostrictive material.

次にポリエステルフィルムからグリーンシートを剥離し
た後、銀−パラジクムペーストなどの導体ペース)fス
クリーン印刷によシ所定の形状に内部電極層2′ft形
成する。
Next, after peeling off the green sheet from the polyester film, an internal electrode layer 2'ft is formed in a predetermined shape by screen printing with a conductor paste such as silver-palladium paste.

このグリーンシートを所望の枚数だけ積み重ね、熱プレ
スで上下から圧着して電歪材の積層体を形成する。
A desired number of green sheets are stacked and pressed together from above and below using a hot press to form a laminate of electrostrictive material.

このグリーンシートの積層時に内部電極層2を形成した
グリーンシートの上、下にそれぞれ20〜30枚の内部
電極層の形成されていないグリーンシートを積み重ねて
ダミ一層としての保護層を形成する。
When stacking the green sheets, 20 to 30 green sheets on which no internal electrode layer is formed are stacked above and below the green sheet on which the internal electrode layer 2 is formed, respectively, to form a protective layer as a dummy layer.

次にこの積層体に含まれる有機バインダーを高温で分解
して蒸発除去させてから上昇スピード5℃/分で温度1
120℃ まで上昇させ、温度1120℃で2時間保持
して焼結を行う。
Next, the organic binder contained in this laminate is decomposed at high temperature and removed by evaporation, and then the temperature is increased to 1°C at a rising speed of 5°C/min.
The temperature is increased to 120°C and held at 1120°C for 2 hours to perform sintering.

焼結させた積層体を内周刃切断機で所望の厚みに切断し
て第2図(a)に示すようなスライス板を作製する。ス
ライス板の切断面には内部電極層2の端部が露出してい
るので、一層おきに電気的接続を取るために、逆に内部
電極層2の端部を一層おきに電気泳動法によりガラスか
らなる絶縁保護膜3を被着形成する。
The sintered laminate is cut into a desired thickness using an internal blade cutter to produce a sliced plate as shown in FIG. 2(a). Since the ends of the internal electrode layers 2 are exposed on the cut surface of the slice plate, in order to make electrical connections every other layer, the ends of the internal electrode layers 2 are glass-covered every other layer by electrophoresis. An insulating protective film 3 consisting of the following is deposited and formed.

次に第2図(b)に示すようにダミ一層としての保護層
7にまで銀ペーストをスクリーン印刷などによシ外部電
極4を延長して形成する。このように保護層7上に形成
された外部電極4上に半田付けによシ直径0..5 r
rtnφのリード線5を接続して電歪効果素子を作製す
る。
Next, as shown in FIG. 2(b), silver paste is formed by screen printing or the like to extend the external electrode 4 up to the protective layer 7 as a dummy layer. A wire with a diameter of 0.0 mm is soldered onto the external electrode 4 formed on the protective layer 7 in this manner. .. 5 r
The lead wire 5 of rtnφ is connected to fabricate an electrostrictive effect element.

〔発明の効果〕〔Effect of the invention〕

以上−説明したように本発明の電歪効果素子のリード線
が直径0.5 mm以上の太さのものを利用できるので
取扱い上、切断することなくリード線の信頼性が向上す
る効果がある。
As explained above, since the lead wire of the electrostrictive effect element of the present invention can be used with a diameter of 0.5 mm or more, the reliability of the lead wire can be improved without cutting it in handling. .

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は本発明の電歪効果素子の斜視図、第2図(a)
 、 (b)は本発明の電歪効果素子の製造過程で作製
されるスライス板の斜視図、第3図は従来の電歪効果素
子の斜視図である。 4−(外#S電檀ジ 81図 筋 3 図
Fig. 1 is a perspective view of the electrostrictive effect element of the present invention, Fig. 2(a)
, (b) is a perspective view of a slice plate produced in the manufacturing process of the electrostrictive effect element of the present invention, and FIG. 3 is a perspective view of a conventional electrostrictive effect element. 4-(Outside #S Dendanji 81 Figure 3 Figure

Claims (1)

【特許請求の範囲】[Claims]  電歪材層が内部電極層にはさまれて積層配設され、か
つ上下二層の該内部電極層に接した電歪材からなる保護
層を有する積層体の側面に露出する内部電極層の端面が
部分的に絶縁性保護膜で被覆され、さらに導電体によっ
て前記内部電極層と一層おきに電気的に接続する外部電
極が、前記保護層上に延長され、前記保護層上に延長形
成された外部電極上でリード端子と電気的に接続された
ことを特徴とする電歪効果素子。
The internal electrode layer exposed on the side surface of the laminate has an electrostrictive material layer sandwiched between internal electrode layers and a protective layer made of an electrostrictive material in contact with the upper and lower internal electrode layers. External electrodes whose end surfaces are partially covered with an insulating protective film and which are electrically connected to the internal electrode layer every other layer by conductors are extended on the protective layer and formed to extend on the protective layer. An electrostrictive effect element characterized in that it is electrically connected to a lead terminal on an external electrode.
JP60114505A 1985-05-28 1985-05-28 Electrostrictive effect element Pending JPS61272984A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP60114505A JPS61272984A (en) 1985-05-28 1985-05-28 Electrostrictive effect element

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP60114505A JPS61272984A (en) 1985-05-28 1985-05-28 Electrostrictive effect element

Publications (1)

Publication Number Publication Date
JPS61272984A true JPS61272984A (en) 1986-12-03

Family

ID=14639432

Family Applications (1)

Application Number Title Priority Date Filing Date
JP60114505A Pending JPS61272984A (en) 1985-05-28 1985-05-28 Electrostrictive effect element

Country Status (1)

Country Link
JP (1) JPS61272984A (en)

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0247540A2 (en) * 1986-05-22 1987-12-02 Nec Corporation Electrostriction effect element
JPS63151087A (en) * 1986-12-16 1988-06-23 Ngk Spark Plug Co Ltd Multilayer piezoelectric device
JPS6457662U (en) * 1987-10-01 1989-04-10
JPH02164085A (en) * 1988-12-19 1990-06-25 Nec Corp Electrostriction effect element
JPH06188471A (en) * 1992-12-22 1994-07-08 Nec Corp Voltage actuator
WO2000052769A1 (en) * 1999-03-04 2000-09-08 Robert Bosch Gmbh Piezoelectric actuator
WO2000079607A1 (en) * 1999-06-19 2000-12-28 Robert Bosch Gmbh Piezoelectric actuator with improved electrode connections
US7111927B2 (en) 2000-06-12 2006-09-26 Seiko Epson Corporation Piezoelectric vibrator unit
WO2012080381A1 (en) * 2010-12-17 2012-06-21 Robert Bosch Gmbh Piezoelectric actuator

Cited By (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0247540A2 (en) * 1986-05-22 1987-12-02 Nec Corporation Electrostriction effect element
JPS63151087A (en) * 1986-12-16 1988-06-23 Ngk Spark Plug Co Ltd Multilayer piezoelectric device
JPS6457662U (en) * 1987-10-01 1989-04-10
JPH02164085A (en) * 1988-12-19 1990-06-25 Nec Corp Electrostriction effect element
JPH06188471A (en) * 1992-12-22 1994-07-08 Nec Corp Voltage actuator
WO2000052769A1 (en) * 1999-03-04 2000-09-08 Robert Bosch Gmbh Piezoelectric actuator
WO2000079607A1 (en) * 1999-06-19 2000-12-28 Robert Bosch Gmbh Piezoelectric actuator with improved electrode connections
US6411018B1 (en) 1999-06-19 2002-06-25 Robert Bosch Gmbh Piezoelectric actuator with improved electrode connections
JP2003502869A (en) * 1999-06-19 2003-01-21 ローベルト ボツシユ ゲゼルシヤフト ミツト ベシユレンクテル ハフツング Piezo actuator
CZ301223B6 (en) * 1999-06-19 2009-12-16 Robert Bosch Gmbh Piezoelectric actuator
US7111927B2 (en) 2000-06-12 2006-09-26 Seiko Epson Corporation Piezoelectric vibrator unit
WO2012080381A1 (en) * 2010-12-17 2012-06-21 Robert Bosch Gmbh Piezoelectric actuator

Similar Documents

Publication Publication Date Title
JPS62274681A (en) Electrostrictive effect element
JPS61272984A (en) Electrostrictive effect element
JPH0360471A (en) Production of laminated ceramics
JP2000340448A (en) Laminated ceramic capacitor
JPS63153870A (en) Electrostrictive effect element
JPS62262472A (en) Electrostrictive effect element
JPH04199755A (en) Laminated thermoelectric element
JPS59115579A (en) Electrostrictive effect element and manufacture thereof
JP2000252537A (en) Laminated piezoelectric ceramic
JPS61174681A (en) Manufacture of laminated piezoelectric device
JPH0256822B2 (en)
JPH0534122Y2 (en)
JPH0666484B2 (en) Electrostrictive effect element
JP5205689B2 (en) Multilayer piezoelectric element
JPH0366822B2 (en)
JPS6392068A (en) Green sheet lamination type piezoelectric lamination body
JPH058691Y2 (en)
JPH01184968A (en) Manufacture of laminar piezoelectric element
JPH04243173A (en) Electrostrictive effect element
JPS60154581A (en) Laminated piezoelectric body and manufacture thereof
JPH02137280A (en) Electrostriction effect element and its manufacture
JP4373904B2 (en) Multilayer piezoelectric element
JPH04274377A (en) Laminated piezoelectric actuator
JPH0745971Y2 (en) Electrostrictive effect element
JPH0472684A (en) Electrostrictive effect element