JPS61188056A - Positioning system between printed circuit board and machining device - Google Patents

Positioning system between printed circuit board and machining device

Info

Publication number
JPS61188056A
JPS61188056A JP60029018A JP2901885A JPS61188056A JP S61188056 A JPS61188056 A JP S61188056A JP 60029018 A JP60029018 A JP 60029018A JP 2901885 A JP2901885 A JP 2901885A JP S61188056 A JPS61188056 A JP S61188056A
Authority
JP
Japan
Prior art keywords
circuit board
printed circuit
positioning
camera
mark
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP60029018A
Other languages
Japanese (ja)
Inventor
Koji Yashiro
浩二 八代
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Home Electronics Ltd
NEC Corp
Original Assignee
NEC Home Electronics Ltd
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Home Electronics Ltd, Nippon Electric Co Ltd filed Critical NEC Home Electronics Ltd
Priority to JP60029018A priority Critical patent/JPS61188056A/en
Publication of JPS61188056A publication Critical patent/JPS61188056A/en
Pending legal-status Critical Current

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  • Supply And Installment Of Electrical Components (AREA)
  • Control Of Position Or Direction (AREA)
  • Machine Tool Sensing Apparatuses (AREA)

Abstract

PURPOSE:To make speedy positioning performable, by putting the specified-form flag, varying in both X and Y direction, on a printed circuit board, while finding the slippage with an image pickup device and compensating it. CONSTITUTION:A triangular flag B put on a printed circuit board is written to a picture memory consisting of a one bit picture element memory eisposed in matrix form at a visual field of a camera. And, a central processing unit finds a Y direction slippage value DELTAY from a distance Dpq between both edges p and q of the flag B on a horizontal line HL, another distance DPQ between P and Q at the time of being correctely positioned and weight H, among picture element data. And likewise, it finds an X direction slippage value DELTAX from a distance Drs between (r) and (s) on a vertical like VL, another distance DRS between R and S at a right position and base length W. On the basis of this slippage value, a relative position between the PCB and the camera is compensat ed, thus positioning takes place. Doing like this, speedy position is made perform able.

Description

【発明の詳細な説明】 発明の目的 産業上の利用分野 本発明は、種々の電子口・路の組立てに使用するプリン
ト基板を、加工装置との間で位置決めする位置決め方式
に関するものである。
DETAILED DESCRIPTION OF THE INVENTION Field of the Invention The present invention relates to a positioning system for positioning a printed circuit board used for assembling various electronic ports and paths with processing equipment.

従来の技術     □ プリント基板に対し配線層・や半田付は層の印刷、素子
の搭載など各種の加工を施す際に、まずこのプリント基
板を加工台上に搭載し、加工装置との間で正確な位置決
めを行うこ゛とが必要になる。
Conventional technology □ When performing various processing on a printed circuit board, such as printing wiring layers, soldering layers, mounting elements, etc., the printed circuit board is first mounted on a processing table, and then accurately connected to processing equipment. It is necessary to perform accurate positioning.

従来の位置決め方式は、所定箇所に位置決め用の標識を
付したプリント基板を加工台上に搭載し、加工装置側に
搭載した撮像装置とサーボ系を使用して、プリント基板
上の標識が撮像装置の視野内の中心部分に捕捉されるま
で、加工台と加工装置との相対位置をX、Y方向に追値
制御することにより行っていた。    ・ □ すなわち、第4図に例示するように、撮像装置の視野A
内にプリント基□板上の標識Bを捕捉し、これが視野へ
の中心部分に設定された破線部分Cと重なり合うように
、ハツチングを付した重なり部分の画素数を計数し?つ
これが増加する方向にX、Y両方向の追値制御を行って
いた。
In the conventional positioning method, a printed circuit board with positioning marks attached to predetermined locations is mounted on a processing table, and an imaging device and servo system mounted on the processing equipment are used to locate the markings on the printed circuit board into the imaging device. The relative position of the processing table and processing device is controlled in the X and Y directions until the processing table and the processing device are captured at the center of the field of view.・ □ In other words, as illustrated in Fig. 4, the field of view A of the imaging device
Capture the mark B on the printed circuit board within the image, and count the number of pixels in the hatched overlapping part so that it overlaps with the broken line part C set at the center of the field of view. Follow-up control in both the X and Y directions was performed in the direction in which this value increased.

考案が解決しようとする問題点 上記従来の追値制御方式では、帰還ループを含む関係上
、位置決めに時間がかかるという問題がある。
Problems to be Solved by the Invention The conventional value control method described above has a problem in that positioning takes time because it includes a feedback loop.

考案の構成 問題点を解決するための手段 上記従来技術の問題点を解決する本発明の位置決め方式
は、X、Y両方向に変化する所定形状の標識をプリント
基板上に付すと共に、撮像装置の視野内の標識がこの視
野内の所定箇所において有するX方向、Y方向の幅から
それぞれY方向、X方向のずれ量を算定し、算定したず
れ量だけプリント基板と撮像装置との相対位置をX、Y
置方向に補正することにより、追値制御によらない迅速
な位置決めを行うように構成されている。
Means for Solving the Problems in the Structure of the Invention The positioning method of the present invention, which solves the problems in the prior art described above, attaches a mark with a predetermined shape that changes in both the X and Y directions on the printed circuit board, and The amount of deviation in the Y direction and the X direction is calculated from the width in the Y
By correcting in the positioning direction, it is configured to perform quick positioning without relying on follow-up control.

以下、本発明の作用を実施例により詳細に説明する。Hereinafter, the effects of the present invention will be explained in detail with reference to Examples.

実施例 第1図は、本発明の一実施例が適用されるプリント基板
加工装置の構成を示すブロック図である。
Embodiment FIG. 1 is a block diagram showing the configuration of a printed circuit board processing apparatus to which an embodiment of the present invention is applied.

1は加工台であり、この上に、加工対象のプリント基板
2が図示しない適宜な自動搭載装置によって搭載される
。このプリント基板2に付されている標識は、図示しな
い各種の加工装置に搭載されているカメラ3で撮像され
る。カメラ3から出力された画像信号は、量子化回路4
で量子化されたのち、画面メモリ5内の所定アドレスの
領域に書込まれる。この際の書込みアドレスは、アドレ
スカウンタ7からセレクタ8を経て画面メモリ5に供給
される。
Reference numeral 1 denotes a processing table, on which a printed circuit board 2 to be processed is mounted by an appropriate automatic mounting device (not shown). The mark attached to the printed circuit board 2 is imaged by a camera 3 mounted on various processing devices (not shown). The image signal output from the camera 3 is transmitted to the quantization circuit 4
After being quantized in , it is written to an area at a predetermined address in the screen memory 5. The write address at this time is supplied from the address counter 7 to the screen memory 5 via the selector 8.

中央制御装置(CPU)6は、画面メモリ6から読出し
た量子化画像信号を処理することにより、プリント基板
2の位置ずれを検出し、このずれ量に基づき位置決めを
行う。
The central control unit (CPU) 6 detects the positional deviation of the printed circuit board 2 by processing the quantized image signal read from the screen memory 6, and performs positioning based on the amount of deviation.

プリント基板2は、加工台1上に植設された位置決めピ
ンなどの適宜な位置決め補助手段により、標mAがカメ
ラ3の視野内に捕捉される程度の精度で粗く位置決めさ
れつつ加工台1上に載置されている。
The printed circuit board 2 is placed on the processing table 1 while being roughly positioned with such precision that the mark mA is captured within the field of view of the camera 3 using appropriate positioning aids such as positioning pins planted on the processing table 1. It is placed.

第2図は、カメラ3の視野Aと、この視野内に捕捉され
た標識Bの関係を例示している。この標vaBは、X、
Y両方向に形状の変化を有する三角形状を呈している。
FIG. 2 illustrates the relationship between the field of view A of the camera 3 and the mark B captured within this field of view. This mark vaB is
It has a triangular shape that changes shape in both Y directions.

上記視野A内の標、識Bは、マトリクス状に配列された
1ビツトの画素メモリから成る画面メモリ5に、明(“
1°)、暗(“O”)の2値データとして書込まれる。
The sign B in the field of view A is displayed brightly (“
1°) and dark (“O”) binary data.

一方、第2図中の点線で示す三角・形Cは、プリント基
板2がカメラ3を搭載した加工装置に対して正しく位置
決めされた状態での視野内標識位置を示す。
On the other hand, a triangle/shape C indicated by a dotted line in FIG. 2 indicates the position of the marker within the field of view when the printed circuit board 2 is correctly positioned with respect to the processing device equipped with the camera 3.

CPU6は、画面メモリ5に書込まれている画素データ
のうち、第2図に示すように画面の中心を通る水平線H
L上に存在するものだけを連続的に読出し、この水平線
HL上に存在する標iBの両エツジ(標識と背景との境
界)pとqとの距離D□、すなわち水平線Hし方向の標
識Bの幅を検出する。このエツジ間距離は、第2図に示
すように、プリント基板が正しく位置決めされた状態で
は点PとQとの距離DP、に等しい値となる。従って、
標識Bの底辺が水平棒HLに平行である場合、このプリ
ント基板2上の標1lIiB(この場合加工台1)のY
方向へのずれ量ΔYは、以下のようになる。
Of the pixel data written in the screen memory 5, the CPU 6 selects a horizontal line H passing through the center of the screen as shown in FIG.
Continuously read out only those existing on the horizontal line HL, and calculate the distance D□ between both edges (boundary between the sign and the background) p and q of the mark iB existing on the horizontal line HL, that is, the direction of the mark B along the horizontal line H. Find the width of. As shown in FIG. 2, this edge-to-edge distance has a value equal to the distance DP between points P and Q when the printed circuit board is correctly positioned. Therefore,
When the base of mark B is parallel to horizontal bar HL, Y of mark 1lIiB on this printed circuit board 2 (in this case, processing table 1)
The amount of deviation ΔY in the direction is as follows.

ΔY−(1/2)H(に(D、、/D?。)〕ただし、
Hは標識Bを形成する三角形の高さである。
ΔY-(1/2)H(ni(D,,/D?.)] However,
H is the height of the triangle forming mark B.

次にCPU6は、画面メモリ5に書込まれている画素デ
ータのうち、第2図に示すように画面の中心を通る垂直
線VL上に存在するものだけを連続的に読出し、この垂
直線VL上に存在する標識Bの両エツジrとSとの距離
D□を検出する。このエツジ間距離は、第2図に示すよ
うに、プリント基板が正しく位置決めされた状態では点
RとSとの距離I)+tsに等しい値になる。従って、
この標識B(加工台1)のX方向へのずれ量ΔXは、次
のようになる。
Next, the CPU 6 continuously reads out only the pixel data written in the screen memory 5 that exists on the vertical line VL passing through the center of the screen as shown in FIG. The distance D□ between both edges r and S of the label B present above is detected. As shown in FIG. 2, this edge-to-edge distance has a value equal to the distance I)+ts between points R and S when the printed circuit board is correctly positioned. Therefore,
The amount of deviation ΔX of the mark B (processing table 1) in the X direction is as follows.

ΔX=  (1/2)W  (1−(Drs/Dos)
)ただし、Wは標mBを形成する三角形の底辺の長さで
ある。
ΔX= (1/2)W (1-(Drs/Dos)
) However, W is the length of the base of the triangle forming the mark mB.

CPU6は、上述のようにして位置ずれ!ΔXとΔYを
算定すると、A/D変換回路を介してX。
The CPU 6 is misaligned as described above! When ΔX and ΔY are calculated, X is converted through the A/D conversion circuit.

Y位置センサsx、syからの位置信号を確認しつつ、
モーター駆動回路9を介してX、 Y送り用モーターM
X、MYを回転させることにより、検出した位置ずれ量
ΔXとΔYだけ加工台1をX。
While checking the position signals from the Y position sensors sx and sy,
X and Y feed motor M via motor drive circuit 9
By rotating X and MY, the processing table 1 is moved to X by the detected positional deviation amount ΔX and ΔY.

Y方向に送り、位置決めを行う。Feed in the Y direction and position.

第3図は、CPU6内外の適宜な箇所に設置されるエツ
ジ検出回路の構成の一例を示す回路図である。
FIG. 3 is a circuit diagram showing an example of the configuration of an edge detection circuit installed at appropriate locations inside and outside the CPU 6.

画面メモリ6から連続的に読出された水平線HI7上の
画素列は、シフトレジスタ11に供給される。このシフ
トレジスタll内をシフトされてゆく各ビットは、アン
ドゲート12と13に供給される。画像データが、標識
部分で1″であり、背景部分で10”であるように量子
化されているものとすれば、アンドゲート12は、先行
の3ビツトが全て11”で後続の3ビツトが全て0”に
なったことから標識の始端エツジを検出する。
The pixel columns on the horizontal line HI7 successively read out from the screen memory 6 are supplied to the shift register 11. Each bit being shifted within this shift register 11 is supplied to AND gates 12 and 13. Assuming that the image data is quantized such that the marker part is 1" and the background part is 10", the AND gate 12 will quantize the leading 3 bits to be all 11" and the trailing 3 bits to be 1". The starting edge of the marker is detected since all the values are 0''.

一方、アンドゲート13は、先行の3ビツトが全て“O
”で後続の3ビツトが全て11°になったことから標識
の終端エツジを検出する。
On the other hand, the AND gate 13 has all three leading bits “O”.
”, the trailing 3 bits are all 11°, so the terminal edge of the label is detected.

アンドゲート12から出力される標識始端エツジ検出信
号によって、シフトレジスタ11のシフト速度に等しい
速度のクロック信号を計数する計数回路(図示せず)が
起動される。この計数回路の計数値は、アンドゲート1
3から出力される標識終端エツジ検出信号によってラン
チ回路に保持される。保持された計数値は、画素数を単
位とするエツジ間隔(標識の幅)を表示する。
A counting circuit (not shown) that counts clock signals having a speed equal to the shift speed of the shift register 11 is activated by the label start edge detection signal outputted from the AND gate 12. The count value of this counting circuit is AND gate 1
3 is held in the launch circuit by the label end edge detection signal outputted from 3. The retained count indicates the edge spacing (width of the marker) in pixels.

以上、加工台2上に植設した位置決めピンにより標識を
カメラ3の視野内に捕捉する構成を例示したが、このよ
うな位置決めビンによる位置決め精度とカメラ視野の広
狭との兼ね合いから視野内に標識を捕捉できない場合等
には、本発明方式による最終的な位置決め段階の前に帰
還と粗送りを含む適宜な粗調段階を設けてもよい。
Above, we have exemplified the configuration in which the marker is captured within the field of view of the camera 3 using the positioning pin installed on the processing table 2. However, due to the balance between the positioning accuracy of such a positioning pin and the width and narrowness of the camera's field of view, it is difficult to capture the marker within the field of view. If the position cannot be captured, an appropriate coarse adjustment stage including return and coarse feed may be provided before the final positioning stage according to the method of the present invention.

また・カメラ3と加工台1との相対位置を固定したまま
、画面メモリ5内に読込まれている標識を水平、垂直走
査してそのエツジ間隔を算出する構成を例示したが、カ
メラ3と加工台lのいずれかを水平、垂直方向にそれぞ
れ1回だけ移動させることにより、標識のX、Y方向エ
ツジ間隔を算出する構成としてもよい、この構成では、
カメラ3は必ずしも2次元センサである必要はなく・−
次元センサや1画素分のセンサを使用してもよい。
In addition, while the relative position between the camera 3 and the processing table 1 is fixed, the label read in the screen memory 5 is scanned horizontally and vertically to calculate the edge interval. The configuration may be such that the edge spacing in the X and Y directions of the sign is calculated by moving one of the platforms 1 in the horizontal and vertical directions only once. In this configuration,
Camera 3 does not necessarily have to be a two-dimensional sensor.
A dimensional sensor or a sensor for one pixel may be used.

また、カメラ3を搭載した加工装置側を固定し、プリン
ト基板2を搭載した加工台1を移動させる構成を例示し
たが、これとは逆に加工台1を固定しておきカメラ3を
搭載している加工装置側を移動させる構成としてもよい
In addition, although we have shown an example of a configuration in which the processing device on which the camera 3 is mounted is fixed and the processing table 1 on which the printed circuit board 2 is mounted is moved, conversely, the processing device side on which the camera 3 is mounted is fixed and the camera 3 is mounted. It is also possible to have a configuration in which the processing equipment side that is being moved is moved.

また、三角形の標識を例示したが、X、Y量方向に形状
変化を有するものであれば、円形、楕円形等適宜な他の
形状であってもよい。
Moreover, although a triangular sign is illustrated, any other suitable shape such as a circle or an ellipse may be used as long as the sign changes in shape in the X and Y directions.

発明の効果 以上詳細に説明したように、本発明の位置決め方式は、
X、Y両方向に変化する所定形状の標識をプリント基板
上に付すと共に、撮像装置の視野内の標識がこの視野内
の所定箇所において有するX方向、Y方向の幅からそれ
ぞれY方向、X方向のずれ量を算定し、算定したずれ量
だけプリント基板と撮像装置との相対位置をX、Y置方
向に補正することにより位置決めを行う構成であるから
、追値制御による従来方式に比べて迅速な位置決めを行
うことができる。
Effects of the Invention As explained in detail above, the positioning method of the present invention has the following effects:
A mark with a predetermined shape that changes in both the X and Y directions is attached on the printed circuit board, and the width in the Y direction and the Since the positioning is performed by calculating the amount of deviation and correcting the relative position of the printed circuit board and the imaging device in the X and Y directions by the calculated amount of deviation, it is faster than the conventional method using follow-up control. Positioning can be performed.

【図面の簡単な説明】[Brief explanation of drawings]

第1図は本発明の一実施例の位置決め方式が適用される
加工装置の構成を示すブロック図、第2図は撮像装置の
視野とこれに捕捉された標識との関係を例示する概念図
、第3図はエツジ検出回路の構成の一例を示す回路図、
第4図は従来の位置決め方式におけるカメラの視野とこ
れに捕捉された標識との関係を例示する概念図である。 l・・加工台、2・・プリント基板、3・・撮像装置、
4・・量子化回路、5・・画面メモリ、6・・CPU、
10・・モーター駆動回路、MX・・X送り用モーター
、MY・・Y送り用モータ−、A・・撮像装置の視野、
B・・撮像装置の視野内に捕捉された標識、C・・位置
決め後の視野的標識位置、HL・・視野の中心を通る水
平線、VL・・視野の中心を通る垂直線6 特許出願人 日本電気ホームエレクトロニクス株式会社
FIG. 1 is a block diagram showing the configuration of a processing device to which a positioning method according to an embodiment of the present invention is applied; FIG. 2 is a conceptual diagram illustrating the relationship between the field of view of an imaging device and a mark captured by it; FIG. 3 is a circuit diagram showing an example of the configuration of an edge detection circuit;
FIG. 4 is a conceptual diagram illustrating the relationship between the field of view of a camera and the mark captured by the camera in a conventional positioning method. l...processing table, 2...printed circuit board, 3...imaging device,
4...Quantization circuit, 5...Screen memory, 6...CPU,
10...Motor drive circuit, MX...X feed motor, MY...Y feed motor, A...field of view of imaging device,
B... Mark captured within the field of view of the imaging device, C... Mark position in the field of view after positioning, HL... Horizontal line passing through the center of the field of view, VL... Vertical line 6 passing through the center of the field of view Patent applicant Japan Denki Home Electronics Co., Ltd.

Claims (1)

【特許請求の範囲】 プリント基板上の所定箇所に位置決め用の標識を形成す
ると共に、この標識を撮像装置の視野内の所定箇所に捕
捉する位置までプリント基板と撮像装置との相対位置を
X、Y方向に調整することによりプリント基板と加工装
置間の位置決めを行うプリント基板の位置決め方式にお
いて、 前記標識は、X、Y両方向に変化する所定の形状を有し
、 撮像装置の視野内の標識がこの視野内の所定箇所におい
て有するX方向、Y方向の幅からそれぞれY方向、X方
向のずれ量を算定し、この算定したずれ量だけプリント
基板と撮像装置との相対位置をX、Y量方向に補正する
ことにより位置決めを行うことを特徴とするプリント基
板の位置決め方式。
[Claims] A positioning mark is formed at a predetermined location on the printed circuit board, and the relative position of the printed circuit board and the imaging device is adjusted by In a printed circuit board positioning method in which the printed circuit board and the processing device are positioned by adjustment in the Y direction, the mark has a predetermined shape that changes in both the X and Y directions, and the mark within the field of view of the imaging device is The amount of deviation in the Y direction and the X direction is calculated from the width in the A printed circuit board positioning method characterized by positioning by correcting.
JP60029018A 1985-02-16 1985-02-16 Positioning system between printed circuit board and machining device Pending JPS61188056A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP60029018A JPS61188056A (en) 1985-02-16 1985-02-16 Positioning system between printed circuit board and machining device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP60029018A JPS61188056A (en) 1985-02-16 1985-02-16 Positioning system between printed circuit board and machining device

Publications (1)

Publication Number Publication Date
JPS61188056A true JPS61188056A (en) 1986-08-21

Family

ID=12264669

Family Applications (1)

Application Number Title Priority Date Filing Date
JP60029018A Pending JPS61188056A (en) 1985-02-16 1985-02-16 Positioning system between printed circuit board and machining device

Country Status (1)

Country Link
JP (1) JPS61188056A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63300843A (en) * 1987-05-30 1988-12-08 Sony Corp Coordinate correction for visual recognition device
JPH01121152A (en) * 1987-10-31 1989-05-12 Yamagata Kashio Kk Position recognizing method for printed board
EP1065917A2 (en) * 1999-06-29 2001-01-03 Sony Corporation Calibrating method for part mounting apparatus
NL1017009C2 (en) * 2000-12-29 2002-07-02 Amsterdam Gem Dienst Afvalverw Method and device for cleaning waste water.

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63300843A (en) * 1987-05-30 1988-12-08 Sony Corp Coordinate correction for visual recognition device
JPH01121152A (en) * 1987-10-31 1989-05-12 Yamagata Kashio Kk Position recognizing method for printed board
EP1065917A2 (en) * 1999-06-29 2001-01-03 Sony Corporation Calibrating method for part mounting apparatus
EP1065917A3 (en) * 1999-06-29 2002-01-02 Sony Corporation Calibrating method for part mounting apparatus
NL1017009C2 (en) * 2000-12-29 2002-07-02 Amsterdam Gem Dienst Afvalverw Method and device for cleaning waste water.

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