JP3040232B2 - Mounting position control method for component mounter - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a mounting position control method in a component mounter for mounting an electronic component on a circuit board.

[0002]

2. Description of the Related Art In a component mounter, for example, an electronic component mounter for mounting an electronic component on a printed circuit board (hereinafter simply referred to as a substrate), an XY table on which the substrate is mounted is held by a suction of the electronic component. In general, it is moved to the head side and mounted.

FIGS. 8 and 9 show an example of this type of electronic component mounting machine. In this electronic component mounter, a substrate (not shown), which is a first member, is placed on an XY table 1, and is moved to a suction head 5 for sucking an electronic component, which is a second member. The suction heads 5 are arranged at equal intervals on the rotary table 4 as shown in FIG. 9, and after sucking the electronic components at the suction position, the rotary table 4 rotates and stops at the mounting position. The electronic component is mounted on the board on the table 1.

The XY table 1 has a rectangular shape and is attached to a movable portion of a guide mechanism (not shown). As shown in FIG. 8, the shafts of two pulse motors 10a and 10b, which are moving means 10, are connected to the movable portion, and the XY table 1 is movable in the X and Y directions.

On the upper surface of the XY table 1, a substrate guide 2 for holding a substrate is provided. The board guide 2 includes a fixed guide 2a and a movable guide 2b, each having a U-shaped cross section. The fixed guide 2a is fixed to one side of the XY table 1, and the movable guide 2b is placed on the other side. ing. The movable guide 2b moves forward and backward by the rotation of the ball screw, and sandwiches the substrate and the jig 3 with the fixed guide 2a. This jig 3
It is formed substantially the same as the substrate, and is used for position correction of each part after mounting the substrate and installing the electronic component mounter, and a measurement mark M is written in the center.

Further, an industrial camera 6 is mounted on the XY table 1 as recognition means for recognizing the mounted state of the substrate. The industrial camera 6 is connected to an image processing unit 7 that converts a captured image into coordinate data on pixels and outputs the digital data to the arithmetic unit 8. .

[0007] The arithmetic means 8 calculates the industrial XY table 1 from the coordinate data when the XY table 1 is arbitrarily moved and the coordinate data picked up by the industrial camera 6 and transmitted from the image processing means 7. The inclination on the coordinates of the camera 6 is calculated. Then, a correction amount for moving the XY table 1 to the mounting position is determined on the basis of the inclination angle based on the basic data to determine the amount of movement, and the NC data is provided to the control means 9.

The control means 9 sends a driving signal to the pulse motors 10a and 10b based on the data of the mounting target position for mounting the electronic component on the board and the NC data.
The control for moving the Y table 1 to the target position is performed. Thus, when the operation of the electronic component mounter is started, the mounting operation of the electronic component can be continuously performed.

In this type of electronic component mounting machine, when a relative displacement occurs between the industrial camera 6 and the XY table 1, the XY table 1 is moved to a predetermined mounting target position. In such a case, it is not possible to carry out proper mounting without errors, so it is necessary to perform correction after installation on the site.

In this position correction, the measurement mark M
The jig described above is used. When performing this correction work, first, a jig is held between guides of the XY table 1. Then, the jig 3 including the measurement mark M is put in the field of view of the industrial camera 6.

Next, the XY table 1 holding the jig 3 is moved by a certain distance in the X direction, and then by a certain distance in the Y direction. The inclination of the installation state of the industrial camera 6 with respect to the XY table 1 is determined from the coordinate data of the movement position at this time and the coordinate data of the measurement mark M appearing on the pixels of the image processing means 7 when the image is captured by the industrial camera 6. Ask for.

Subsequently, a calculation for correcting the inclination is performed to calculate a camera scale, that is, a conversion value for an appropriate position when the electronic component is mounted by actually moving the XY table 1 from the member supply unit to the mounting position. Ask.

Thereafter, data of a target position at which the electronic component is mounted on the board is given to the control means 9 to move the XY table 1. At this time, a position shift is detected from the coordinate data of the target position and the coordinates of the position where the XY table 1 has actually moved, and the shift amount is calculated. Then, a correction amount for correcting the positional deviation is calculated based on the calculated value and the camera scale.

When the NC data based on the calculation result is sent to the control means 9, the industrial camera 6 and the XY table 1 are sent.
Therefore, it is possible to perform appropriate positioning when mounting components on a substrate.

[0015]

However, in the above-mentioned conventional mounting position control method, the inclination of the industrial camera 6 is corrected by the jig 3 on which the measurement mark M is written, and the camera scale is obtained. Therefore, it is necessary to prepare the jig 3, and the operation using the jig 3 is troublesome, and there is a disadvantage that the adjustment work at the time of installing the electronic component mounting machine takes a long time. .

An object of the present invention is to solve the above problems.

[0017]

According to the present invention, in order to achieve the above object, an XY table for mounting a first member, a mounting head for mounting a second member to the first member, Moving means for moving the XY table from the member supply unit to the member mounting position, recognizing means for recognizing the position of the XY table, coordinate data when the XY table is moved to an arbitrary position, and recognizing means. Calculating an inclination on the coordinates of the recognizing means with respect to the XY table from the obtained coordinate data, and calculating a correction amount according to the inclination; and the moving means based on the NC data from the calculating means. And sends a drive signal to the XY
In a mounting position control method in a component mounter, comprising: a control unit for performing control for moving a table from a member supply unit to a member mounting position, a mark for measurement is written on the XY table, and a first mark is provided on the first member. 2 from the coordinate data of the mounting target position where the second member is mounted, and the coordinate data of the mark recognized by the recognition means when the XY table is actually moved to the mounting target position. The amount of displacement of the moving position is calculated, and the amount of correction is calculated from the result of the calculation and the result of calculating the inclination of the recognition means on the XY table on the coordinates to determine the amount of movement of the XY table.

[0018]

According to the present invention, the XY table on which the measurement mark is written is moved to the target mounting position where the second member is mounted on the first member. The deviation amount of the actual movement position with respect to the mounting target position is calculated from the coordinate data of the mounting target position at this time and the coordinate data of the mark recognized by the recognition means when the XY table is actually moved.

Then, a correction amount is calculated from the calculation result and the calculation result of the inclination on the coordinates of the recognition means with respect to the XY table calculated in advance. When the movement amount is determined based on the correction amount and the XY table is moved to the member mounting position, the inclination of the recognition means with respect to the XY table is corrected, and the deviation of the actual movement position with respect to the mounting target position is corrected. The XY table can be moved to the final mounting target position for positioning.

As described above, the correction of the deviation of the actual movement position with respect to the mounting target position can be performed simply by writing a measurement mark on the XY table. Therefore, after the recognition means, the XY table and the movement means are installed, The work of determining the correction amount and the movement amount performed prior to the member mounting operation is simplified based on these relative positional relationships.

[0021]

An embodiment of the present invention will be described below with reference to the drawings.

FIG. 1 is a schematic configuration diagram of an electronic component mounter according to the present embodiment.

This electronic component mounter has substantially the same basic configuration as that of the conventional example shown in FIGS. 8 and 9, and the same portions are denoted by the same reference numerals and detailed description thereof will be omitted.

Conventionally, the mounting position control method in the electronic component mounting machine according to the present embodiment uses a board guide 2 on an XY table 1.
The jig 3 provided on the XY table 1 is not used, and a mark M for measurement is written on the upper surface of the XY table 1 to perform a correction operation after the electronic component mounting machine is installed.

First, a measurement mark M is directly written on the upper surface of the XY table 1 in advance as shown in FIG. 1 and FIG. 2 in order to perform a correction assuming a positional shift of each part constituting the electronic component mounting machine. This mark M may be at the center, but XY
In order to more accurately recognize the shake in the X and Y directions that occurs when the table 1 moves, it is preferable to write it in a corner.

Then, as shown in FIG. 3, the XY table 1 is moved from an arbitrary starting point (X0, Y0) by X1 in the X direction, and then moved by Y1 in the Y direction. Here, if the industrial camera 6 is installed so as to be inclined on the XY axis with respect to the XY table 1, the image is taken by the industrial camera 6 and image-processed by the image processing means 7 as shown in FIG. Of the measurement mark M on the pixel (x
2, y2) and the coordinates of the moving position of the XY table 1 (X1
, Y1) is different from the industrial camera 6
Has an inclination θc on the XY axes.

This inclination θc is obtained by the following equation.

[0028]

(Equation 1)

Next, the camera scale is calculated by correcting the inclination. This camera scale is an XY table 1
Is actually converted to mount the electronic component at an appropriate position, and the camera scale Sx in the X direction and the camera scale Sy in the Y direction are obtained by the following equations.

[0030]

(Equation 2)

Subsequently, correction is performed assuming a deviation between a target position at which the electronic component is mounted on the substrate and a position at which the XY table 1 actually moves.

At this time, the control unit 9 is provided with NC data with the electronic component supply position as a starting point and the mounting position as a target position, and the XY table 1 is moved.

Then, as shown in FIG. 5, the starting point (X0,
The coordinates (X3, Y3) of the target position a with respect to Y0) and the coordinates (X3 ', Y3) of the actual moving position b of the measurement mark M.
') And the position shift occurs. When the position deviation is centered on the target position a on the pixel shown in FIG. 6 when the industrial camera 6 captures an image and performs image processing, the coordinates of the movement position b of the measurement mark M are (x3, y3).
), And has an inclination θc.

The coordinates for correcting this are (x3 ', y3') on the pixel shown in FIG. 7, and this correction calculation is obtained by the following equation.

[0035]

(Equation 3)

Thereafter, the coordinates (X3 ', Y3') of the actual moving position with respect to the starting point (X0, Y0) are calculated by using the coordinates (X3, Y3) of the target position a, the camera scale (Sx, Sy) and the calculation result. It is calculated by the following formula based on

[0037]

(Equation 4)

The result of this calculation is the coordinates of the target position a (X3
, Y3) and the coordinates (X3 ', Y3) of the actual moving position b.
') Indicates that they match, so this N
When the C data is used, the XY table 1 can be moved to an appropriate position for positioning.

Therefore, the correction of the mounting position performed after the mounting of the electronic component mounting machine can be performed by simply writing the mark M directly on a part of the XY table 1, thereby simplifying the operation and shortening the time. become.

The measurement mark M is stored in the XY table 1
However, it is needless to say that it may be described on the other corner or on the guide 2.

[0041]

As described above, according to the present invention, when the displacement of the actual moving position with respect to the mounting target position is corrected, X
Since it is only necessary to write a measurement mark on the Y table, after the recognition means, the XY table, the moving means, etc. are installed, the correction work performed prior to the mounting of the members based on their relative positional relationship is simple. Become. In addition, the conventional measuring tools used when installing the component mounter are no longer necessary,
The effect is that the working time is greatly reduced.

[Brief description of the drawings]

FIG. 1 is a schematic configuration diagram of an electronic component mounter according to an embodiment of the present invention.

FIG. 2 is a plan view of an electronic component mounter and a mounting head.

FIG. 3 shows coordinates when the XY table is moved.

FIG. 4 shows coordinates indicating an inclination of a recognition unit with respect to an XY table.

FIG. 5 is an explanatory diagram showing a relationship between an actual movement position and a mounting target position.

FIG. 6 shows coordinates before the inclination of the recognition means is corrected.

FIG. 7 shows coordinates indicating a mounting target position after correction.

FIG. 8 is a schematic configuration diagram of a conventional electronic component mounting machine.

FIG. 9 is a plan view of a conventional electronic component mounter and a mounting head.

[Explanation of symbols]

 Reference Signs List 1 XY table 5 Recognition means 6 Recognition means 8 Calculation means 9 Control means 10 Moving means M Mark for measurement

──────────────────────────────────────────────────続 き Continuation of the front page (72) Inventor Susumu Takaichi 1006 Kazuma Kadoma, Kazuma, Osaka Prefecture Matsushita Electric Industrial Co., Ltd. (56) References JP-A-5-198997 (JP, A) JP-A-3 -3399 (JP, A) (58) Field surveyed (Int. Cl. ⁷ , DB name) H05K 13/04

Claims (1)

(57) [Claims] An XY table on which a first member is placed;
A mounting head for mounting a second member to the first member;
Moving means for moving the XY table from the member supply unit to the member mounting position, recognizing means for recognizing the position of the XY table, coordinate data when the XY table is moved to an arbitrary position, and recognizing means. Calculating an inclination on the coordinates of the recognizing means with respect to the XY table from the obtained coordinate data, and calculating a correction amount according to the inclination; and the moving means based on the NC data from the calculating means. Control means for sending a drive signal to the XY table to move the XY table from the member supply unit to the member mounting position, wherein a measurement mark is written on the XY table. , The first
From the coordinate data of the mounting target position at which the second member is mounted on the member and the coordinate data of the mark recognized by the recognition means when the XY table is actually moved to the mounting target position. Calculating the shift amount of the actual movement position with respect to the position, calculating the correction amount from the calculation result and the calculation result of the inclination on the coordinates of the recognition means with respect to the XY table, and determining the movement amount of the XY table. A mounting position control method for a component mounter, which is a feature.