JPH0259402B2 - - Google Patents
Info
- Publication number
- JPH0259402B2 JPH0259402B2 JP56173042A JP17304281A JPH0259402B2 JP H0259402 B2 JPH0259402 B2 JP H0259402B2 JP 56173042 A JP56173042 A JP 56173042A JP 17304281 A JP17304281 A JP 17304281A JP H0259402 B2 JPH0259402 B2 JP H0259402B2
- Authority
- JP
- Japan
- Prior art keywords
- lead
- component
- detector
- chuck
- row
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000001514 detection method Methods 0.000 claims description 14
- 230000003287 optical effect Effects 0.000 claims description 6
- 238000005259 measurement Methods 0.000 claims description 3
- 238000010586 diagram Methods 0.000 description 6
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical group [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 5
- 238000005452 bending Methods 0.000 description 3
- 238000007796 conventional method Methods 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 239000011295 pitch Substances 0.000 description 3
- 238000012545 processing Methods 0.000 description 3
- 238000003780 insertion Methods 0.000 description 2
- 230000037431 insertion Effects 0.000 description 2
- 238000012966 insertion method Methods 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01D—MEASURING NOT SPECIALLY ADAPTED FOR A SPECIFIC VARIABLE; ARRANGEMENTS FOR MEASURING TWO OR MORE VARIABLES NOT COVERED IN A SINGLE OTHER SUBCLASS; TARIFF METERING APPARATUS; MEASURING OR TESTING NOT OTHERWISE PROVIDED FOR
- G01D5/00—Mechanical means for transferring the output of a sensing member; Means for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for converting; Transducers not specially adapted for a specific variable
- G01D5/26—Mechanical means for transferring the output of a sensing member; Means for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for converting; Transducers not specially adapted for a specific variable characterised by optical transfer means, i.e. using infrared, visible, or ultraviolet light
- G01D5/32—Mechanical means for transferring the output of a sensing member; Means for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for converting; Transducers not specially adapted for a specific variable characterised by optical transfer means, i.e. using infrared, visible, or ultraviolet light with attenuation or whole or partial obturation of beams of light
- G01D5/34—Mechanical means for transferring the output of a sensing member; Means for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for converting; Transducers not specially adapted for a specific variable characterised by optical transfer means, i.e. using infrared, visible, or ultraviolet light with attenuation or whole or partial obturation of beams of light the beams of light being detected by photocells
- G01D5/342—Mechanical means for transferring the output of a sensing member; Means for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for converting; Transducers not specially adapted for a specific variable characterised by optical transfer means, i.e. using infrared, visible, or ultraviolet light with attenuation or whole or partial obturation of beams of light the beams of light being detected by photocells the sensed object being the obturating part
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Length Measuring Devices By Optical Means (AREA)
- Length Measuring Devices With Unspecified Measuring Means (AREA)
- Supply And Installment Of Electrical Components (AREA)
Description
【発明の詳細な説明】
本発明は、電子部品の基板への挿入時等におい
て必要となる部品のリード位置を検出するリード
位置検出装置に関するものである。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a lead position detection device for detecting the lead position of a component required when inserting an electronic component into a board.
第１図に、リードを持つ部品と基板の例を示
す。電子部品１，２，３のリード部４，４′，
４″を基板５の穴６に挿入し、基板５の裏面でリ
ード部４，４′，４″を曲げることにより電子部品
１，２，３を基板５に仮固定し、後に（図略）裏
面を半田付けして基板組立が完了する。 FIG. 1 shows an example of a component with leads and a board. Lead parts 4, 4' of electronic components 1, 2, 3,
4'' into the hole 6 of the board 5, and by bending the lead parts 4, 4', 4" on the back side of the board 5, the electronic components 1, 2, 3 are temporarily fixed to the board 5, and later (not shown). Solder the back side and complete the board assembly.
この組立作業において、電子部品１，２，３は
第２図、第３図に示した方法で挿入される。第２
図の場合は、部品３のリード４″はチヤツク７に
よりチヤツクされると共に、そのリード４″の位
置をガイドされて基板５の穴６に挿入ロツド１８
により挿入される。一方第３図ａ，ｂ，ｃの場合
は電子部品３は本体部８をチヤツク７′によつて
保持され、基板５の穴６に挿入される。この時チ
ヤツク７′に対するリード４″の先端位置及びピツ
チは本体部８とチヤツク７とのズレ、リード４″
の曲がり等のためばらついており、このまま挿入
することは不可能である。そのため第３図ａに示
す様にチヤツク７に保持した状態でカツタ９，１
０によりリード先端を切断し、次いで第３図ｂに
示すようにこのリード先端位置をプリズム１１，
１２を介してTVカメラ１３，１４により検出
し、このリード先端位置情報に基づき基板５を移
動し、第３図ｃに示すようにまずリード４″−ａ
次いでさらに基板５の位置を修正後、リード４″
−ｂを挿入する。 In this assembly operation, electronic components 1, 2, and 3 are inserted in the manner shown in FIGS. 2 and 3. Second
In the case of the figure, the lead 4'' of the component 3 is chucked by the chuck 7, and the position of the lead 4'' is guided and inserted into the hole 6 of the board 5 by the rod 18.
Inserted by On the other hand, in the case of FIGS. 3a, b, and c, the electronic component 3 is inserted into the hole 6 of the board 5 with the main body 8 held by the chuck 7'. At this time, the tip position and pitch of the lead 4'' with respect to the chuck 7' are determined by the misalignment between the main body 8 and the chuck 7, and the lead 4''
It is not possible to insert it as is because it is uneven due to bending etc. Therefore, as shown in Fig. 3a, the cutters 9 and 1 are held in the chuck 7.
0 to cut the lead tip, and then, as shown in FIG.
12 with the TV cameras 13 and 14, and based on this lead tip position information, the board 5 is moved, and as shown in FIG.
Next, after further correcting the position of the board 5, the lead 4''
Insert -b.
しかし、これら第２図、及び第３図に示した方
法は第４図ａ，ｂ，ｃに示すような部品１５，１
６，１７等には適用できない。第２図の方式の場
合、第５図ａに示す様に部品１５の下面にチヤツ
ク７′が回り込んでいるため、挿入後チヤツク
７′が逃げるには破線で示した如く大きな逃げ領
域が必要で周囲に既に挿入済の部品（図示せず）
に当つてしまう。また第５図ｂの様な場合は電子
部品１６の３又は４スミをチヤツクしないと部品
１６が傾き挿入不可となる。また、リード形状も
円柱、角柱、薄板等の如く各種ありこれらをすべ
てガイドすることは困難である。 However, the methods shown in FIGS. 2 and 3 are not suitable for parts 15, 1 as shown in FIG.
It cannot be applied to 6, 17 etc. In the case of the method shown in Fig. 2, since the chuck 7' wraps around the bottom surface of the component 15 as shown in Fig. 5a, a large escape area is required as shown by the broken line in order for the chuck 7' to escape after insertion. Components already inserted around the (not shown)
It hits me. Further, in the case as shown in FIG. 5b, unless the third or fourth corner of the electronic component 16 is checked, the component 16 will be tilted and cannot be inserted. Furthermore, there are various lead shapes such as cylinders, square columns, thin plates, etc., and it is difficult to guide all of them.
第３図ａ，ｂ，ｃの場合、第２図の場合と異な
り、ガイドする必要はない。しかし、部品１５，
１６，１７はリード本数が多くかつその位置、ピ
ツチ等は多種多様である。このためリード先端を
切断することは困難である。従つて、リード先端
の認識は部品のリードをそのままTVカメラでと
らえ画像処理することとなるが、これは先端形
状、色、リードの曲がり等によつて取込まれる画
像データが異なりリード先端の中心を必要な精度
で算出することは不可能である。従つて、第３図
ａ，ｂ，ｃに示す方式では部品１５，１６，１７
等の挿入はできない。 In the cases of FIGS. 3a, b, and c, unlike the case of FIG. 2, there is no need for guiding. However, part 15,
Numbers 16 and 17 have a large number of leads, and their positions, pitches, etc. are diverse. Therefore, it is difficult to cut the lead tip. Therefore, to recognize the lead tip, the lead of the component is captured as is with a TV camera and image processing is performed. However, the image data captured differs depending on the tip shape, color, bending of the lead, etc. It is impossible to calculate with the required accuracy. Therefore, in the system shown in FIGS. 3a, b, and c, parts 15, 16, 17
etc. cannot be inserted.
本発明の目的は、上記従来技術の欠点をなく
し、多種形状かつ多リードの電子部品について
も、リード先端位置を検出し、その位置情報に基
づき挿入を可能とするリード線位置検出装置を提
供するにある。 An object of the present invention is to eliminate the drawbacks of the above-mentioned prior art, and to provide a lead wire position detection device that detects the lead tip position of electronic components with various shapes and multiple leads, and enables insertion based on the position information. It is in.
本発明は、２つのリード列を持つ部品の各リー
ド列の個々のリードの有無を検出できるように、
リード先端の成す面に対して傾きを持つた面内に
光軸を持ち、かつ前記部品のリード列と所定の角
度で互いに交叉する位置に配置された２組のデイ
テクタを、それぞれ互いの光軸の成す面が平行に
ならないように各リード列に対応して配置すると
共に、前記部品を保持し、前記リード列が前記デ
イテクタの検出可能な位置を通過するように前記
部品と前記デイテクタとを相対的に移動せしめる
移動手段と、前記移動手段の位置を計測する計測
手段と、前記デイテクタがリードの有無を検出し
たときの前記移動手段の位置データから前記移動
手段と各リードの相対位置を算出する算出手段と
を備えるようにしたものである。 The present invention is capable of detecting the presence or absence of individual leads in each lead row of a component having two lead rows.
Two sets of detectors each have their optical axes in a plane inclined with respect to the plane formed by the lead tips, and are arranged at positions that intersect with the lead row of the component at a predetermined angle. are arranged in correspondence with each lead row so that their surfaces are not parallel, and the component is held relative to the detector so that the lead row passes through a detectable position of the detector. a moving means for moving a target, a measuring means for measuring a position of the moving means, and a relative position of the moving means and each lead is calculated from position data of the moving means when the detector detects the presence or absence of a lead. The calculation means is also provided.
また、前記移動手段は、リード長さの異なる
種々の部品に対して、リードの測定希望位置に合
わせて、測定できるように、前記部品と前記デイ
テクタとの相対的な移動方向と直角な方向にも前
記部品と前記デイテクタとを相対的に移動せしめ
る手段を有する構成としたものである。 Further, the moving means moves in a direction perpendicular to a relative moving direction between the component and the detector so that various components having different lead lengths can be measured in accordance with the desired measurement position of the lead. The detector is also configured to include means for relatively moving the component and the detector.
以下本発明を図に示す実施例にもとづいて具体
的に説明する。即ち本発明は第３図の方法を発展
させ、電子部品の本体部をチヤツクし、リード線
位置を認識する方式とした。 The present invention will be specifically described below based on embodiments shown in the drawings. That is, the present invention develops the method shown in FIG. 3 to check the main body of the electronic component and recognize the position of the lead wire.
第６図に具体例の１つを示す。第６図ａにおい
て、電子部品１９はＸ方向に移動する。この電子
部品１９を透過形のデイテクタ２０，２０′，２
１，２１′によつて両側から検出している。ここ
で各デイテクタは投光器と受光器から構成され、
１方が投光器で他方が受光器である。デイテクタ
は、２組に分けられる。即ち２０，２０′が左側
リード検出用で２１，２１′が右側リード検出用
である。右側リードで考えれば、部品１９がＸ方
向に進んでくるとまずａ点においてデイテクタ２
０に検出信号が入る。次いでｂ点においてデイテ
クタ２０′の光軸を通過し、デイテクタ２０′に検
出信号が入る。この間の電子部品１９のＸ方向移
動距離が分かればこの距離と光軸の角度からＹ座
標はｂ／２となる。同様に右側のリード列が順
次ａ，ｂ点を通過する信号とその時の部品１９の
Ｘ方向移動距離からすべてのリードのＹ座標が部
品１９を保持しているチヤツク２２を基準として
求められる。同様に各リードがａ点を通過する時
のチヤツク位置データから各リードのピツチも算
出できる。この時、左右のリードは、第６図ｂの
如くリード先端によつて構成される面に対してθ
だけ傾いているので互いに相手の検出光路をさえ
ぎることはない。このようにして、多リードの部
品についても位置の認識が可能となる。またこの
検出方法はリードの形状や端面の切り方等には全
く無関係に検出できる。従つて第３図の従来方式
の欠点を補ない、リードをガイドすることなく
種々の部品を基板に挿入できる。また、リードの
長さが各種あつてもあらかじめチヤツクする電子
部品とそのリード長さが分つていればチヤツクの
上下位置を調整後デイテクタ部を通過させればほ
ぼリード先端の部分を検出できる。このようにし
て各リードのチヤツクに対する位置は求められ
る。 FIG. 6 shows one specific example. In FIG. 6a, the electronic component 19 moves in the X direction. This electronic component 19 is connected to transmission type detectors 20, 20', 2
1 and 21' for detection from both sides. Here, each detector consists of an emitter and a receiver,
One is a light emitter and the other is a light receiver. The detectors are divided into two groups. That is, 20 and 20' are for detecting the left lead, and 21 and 21' are for detecting the right lead. Considering the right lead, when component 19 advances in the X direction, detector 2 first moves at point a.
A detection signal is input to 0. Next, the light passes through the optical axis of the detector 20' at point b, and a detection signal enters the detector 20'. If the moving distance of the electronic component 19 in the X direction during this time is known, the Y coordinate will be b/2 from this distance and the angle of the optical axis. Similarly, the Y coordinates of all the leads are determined with respect to the chuck 22 holding the component 19 based on the signal that the lead row on the right side passes points a and b sequentially and the moving distance of the component 19 in the X direction at that time. Similarly, the pitch of each lead can also be calculated from chuck position data when each lead passes through point a. At this time, the left and right leads are θ relative to the plane formed by the lead tips as shown in Figure 6b.
Since they are tilted by 100 degrees, they do not block each other's detection optical path. In this way, it is possible to recognize the position of components with multiple leads. Further, this detection method can detect the lead completely regardless of the shape of the lead or the way the end face is cut. Therefore, the drawbacks of the conventional method shown in FIG. 3 can be compensated for, and various parts can be inserted into the board without guiding the leads. Furthermore, even if the length of the lead is various, if the electronic component to be chucked and its lead length are known in advance, then the tip of the lead can be almost detected by adjusting the vertical position of the chuck and passing it through the detector section. In this way, the position of each lead relative to the chuck is determined.
第７図はチヤツクの駆動方式を示す。 FIG. 7 shows the chuck drive system.
チヤツク２２はフレーム２３内に上下摺動可能
な構造に保持されており、モータ２４により上下
に摺動される。上下方向の位置はエンコーダ２５
により測定される。フレーム２３は走行プレート
２６に取付けられており走行プレート２６上には
４スミに、ガイドブロツク２７が固定されガイド
シヤフト２８に沿つて摺動可能な構造で保持され
ている。さらに、走行プレート２６にはワイヤ２
９が固定されておりプーリ３０を介してモータ３
１によつて、ガイドシヤフト２８上を摺動させら
れる。モータ３１にはエンコーダ３２が取付けら
れており、これによりチヤツク２２のＸ方向位置
を検出することができる。第８図は検出系のブロ
ツク図を示し３３はエンコーダ３２の出力に基づ
きチヤツク２２のＸ方向位置を演算する回路であ
る。CPU３４は、前記チヤツク２２の位置デー
タとデイテクタ２０，２０′，２１，２１′よりの
信号からチヤツクに対するリード位置を演算する
ものである。以上の構成を取ることによりチヤツ
クに対するリードの位置を測定することができ
る。従つてこのデータに基づきプリント基板位置
を修正し、挿入すれば、電子部品１５，１６，１
７等も挿入可能である。 The chuck 22 is held within a frame 23 in a structure capable of vertically sliding, and is slid vertically by a motor 24. The vertical position is encoder 25
It is measured by The frame 23 is attached to a traveling plate 26, and guide blocks 27 are fixed at four corners on the traveling plate 26 and are held in a structure capable of sliding along a guide shaft 28. Furthermore, the running plate 26 has a wire 2
9 is fixed and the motor 3 is connected via the pulley 30.
1 on the guide shaft 28. An encoder 32 is attached to the motor 31, so that the position of the chuck 22 in the X direction can be detected. FIG. 8 is a block diagram of the detection system, and 33 is a circuit for calculating the position of the chuck 22 in the X direction based on the output of the encoder 32. The CPU 34 calculates the read position for the chuck from the position data of the chuck 22 and the signals from the detectors 20, 20', 21, 21'. By adopting the above configuration, the position of the lead relative to the chuck can be measured. Therefore, by correcting the printed circuit board position based on this data and inserting it, the electronic components 15, 16, 1
7 etc. can also be inserted.
以上説明したように本発明によれば、リード形
状、本数、光の反射率等に無関係に電子部品のリ
ードの位置をチヤツクに対して測定でき、この情
報に基づき基板に電子部品を挿入することができ
る効果を奏する。更に本発明によれば、TVカメ
ラや画像メモリ等を必要とせず、単なるデイテク
タで良く、価格的にも大巾に低減することができ
る。更に本発明によれば画像処理が不要であるた
め、処理ソフト開発費が安くかつ高速処理できる
等の効果を奏する。 As explained above, according to the present invention, the position of the electronic component lead can be measured with respect to the chuck regardless of the lead shape, number, light reflectance, etc., and the electronic component can be inserted into the board based on this information. It produces the effect that can be achieved. Further, according to the present invention, there is no need for a TV camera, an image memory, etc., and a simple detector is sufficient, making it possible to significantly reduce the cost. Further, according to the present invention, since image processing is not required, the development cost of processing software is low and high-speed processing is possible.
第１図は従来自動挿入されている部品及び基板
の例を示した図、第２図は従来の挿入方法の一例
を示す図、第３図ａ，ｂ，ｃは従来の挿入方法の
他の一例を示す図、第４図ａ，ｂ，ｃは従来の方
法で自動挿入不可能な部品の例を示す図、第５図
ａ，ｂは従来の方法で、第４図ａ，ｂ，ｃに示す
部品を自動挿入しようとした場合の問題点を説明
するための図、第６図は本発明のリード線の検出
装置の原理を示す図、第７図は本発明のリード線
の検出装置のチヤツクの駆動装置の実施例を示す
図、第８図は本発明のリード線の検出装置のチヤ
ツク位置検出演算装置の一実施例を示すブロツク
図である。
１９……電子部品、２０，２０′，２１，２
１′……デイテクタ、２２……チヤツク、２３…
…フレーム、２４……モータ、２５……エンコー
ダ、２６……走行プレート、３２……エンコー
ダ、３３……チヤツク位置演算回路、３４……
CPU。
Fig. 1 shows an example of parts and boards that are conventionally automatically inserted, Fig. 2 shows an example of the conventional insertion method, and Fig. 3 a, b, and c show other conventional insertion methods. Figures 4a, b, and c are diagrams showing examples of parts that cannot be automatically inserted using the conventional method. Figures 5a and b are diagrams showing examples of parts that cannot be automatically inserted using the conventional method. 6 is a diagram showing the principle of the lead wire detection device of the present invention, and FIG. 7 is a diagram illustrating the lead wire detection device of the present invention. FIG. 8 is a block diagram showing an embodiment of the chuck position detection calculation device of the lead wire detection device of the present invention. 19...Electronic parts, 20, 20', 21, 2
1'...Detector, 22...Chick, 23...
...Frame, 24...Motor, 25...Encoder, 26...Traveling plate, 32...Encoder, 33...Chuck position calculation circuit, 34...
CPU.
Claims (1)
列の先端を含み、かつ第２のリード列と交わらな
い第１の平面上に、投光器と受光器とで対をな
し、光軸が互いに平行にならないように配置され
た２対のデイテクタと、 前記第２のリード列の先端を含み、かつ前記第
１の平面と交叉し、かつ前記第１のリード列と交
わらない第２の平面上に、投光器と受光器で対を
なし、光軸が互いに平行にならないように配置さ
れた２対のデイテクタと、 前記部品を保持し、前記デイテクタが前記リー
ド列を検出できるよう前記２列のリードと平行な
方向に前記部品と前記デイテクタとを相対的に移
動させる移動手段と、 前記部品を保持した位置を計測する計測手段
と、 前記部品を保持した位置を基準として前記デイ
テクタがリードを検出したときの位置データから
前記保持した位置と前記各リードの相対位置を算
出する算出手段を有することを特徴とするリード
位置検出装置。 ２ 前記移動手段は、リード長さの異なる種々の
部品に対して、リードの測定希望位置に合わせ
て、測定できるように、前記部品と前記デイテク
タとの相対的な移動方向と直角な方向にも前記部
品と前記デイテクタとを相対的に移動せしめる手
段を有することを特徴とする特許請求の範囲第１
項記載のリード位置検出装置。[Claims] 1. A light emitter and a light receiver are arranged in pairs on a first plane that includes the tips of the first lead row of a component having two lead rows and does not intersect with the second lead row. None, two pairs of detectors arranged so that their optical axes are not parallel to each other, and a detector that includes the tips of the second lead row, intersects the first plane, and intersects the first lead row. two pairs of detectors arranged such that the emitter and the receiver form a pair and their optical axes are not parallel to each other on a second plane that holds the component and allows the detector to detect the lead array; moving means for relatively moving the component and the detector in a direction parallel to the two rows of leads; measuring means for measuring the position where the component is held; A lead position detection device characterized by comprising a calculation means for calculating a relative position between the held position and each of the leads from position data when a detector detects the lead. 2. The moving means also moves in a direction perpendicular to the relative movement direction of the component and the detector so that measurements can be performed on various components having different lead lengths according to the desired measurement position of the lead. Claim 1, further comprising means for relatively moving the component and the detector.
The lead position detection device described in Section 1.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP56173042A JPS5875014A (en) | 1981-10-30 | 1981-10-30 | Detector for lead position |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP56173042A JPS5875014A (en) | 1981-10-30 | 1981-10-30 | Detector for lead position |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5875014A JPS5875014A (en) | 1983-05-06 |
| JPH0259402B2 true JPH0259402B2 (en) | 1990-12-12 |
Family
ID=15953123
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP56173042A Granted JPS5875014A (en) | 1981-10-30 | 1981-10-30 | Detector for lead position |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5875014A (en) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62143448A (en) * | 1985-12-18 | 1987-06-26 | Hitachi Tokyo Electron Co Ltd | Lead flatness inspecting device |
| JPH0746759B2 (en) * | 1986-01-25 | 1995-05-17 | 日本電気ホームエレクトロニクス株式会社 | How to automatically attach irregular lead parts to printed boards |
| JPS62245906A (en) * | 1986-04-18 | 1987-10-27 | Mitsubishi Electric Corp | Recognizing device for electronic parts |
| JPH08238333A (en) * | 1995-03-06 | 1996-09-17 | Yoshimasa Sakai | Muscular strength trainer |
| JP6019410B2 (en) | 2013-11-13 | 2016-11-02 | パナソニックＩｐマネジメント株式会社 | Electronic component mounting apparatus and electronic component mounting method |
| JP6019409B2 (en) * | 2013-11-13 | 2016-11-02 | パナソニックＩｐマネジメント株式会社 | Electronic component mounting apparatus and electronic component mounting method |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS52151041A (en) * | 1976-06-10 | 1977-12-15 | Matsushita Electric Ind Co Ltd | Vehicle width detection system |
-
1981
- 1981-10-30 JP JP56173042A patent/JPS5875014A/en active Granted
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS52151041A (en) * | 1976-06-10 | 1977-12-15 | Matsushita Electric Ind Co Ltd | Vehicle width detection system |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5875014A (en) | 1983-05-06 |
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