JPS60117699A - Device for recognizing electronic part - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Application of the Invention] The present invention is directed to an electronic component mounting device for mounting an electronic component having a plurality of leads on a circuit board so that the electronic component is mounted at a predetermined position on the circuit board. The present invention relates to an electronic component recognition device that recognizes the positional deviation and inclination of an electronic component during transportation in order to correct the position and inclination of the electronic component.

[Background of the invention]

FIG. 1 is a side view showing an example of the above-mentioned electronic component mounting apparatus. In this figure, an electronic component 1 is accommodated on a tape 2 and transported, and is attached to a tip 4 of a mounting head 3 at a predetermined position A. , and are transported in the direction of the circuit board 5. The mounting head 3 stops at a predetermined position C during the transportation, and the recognition device 6 recognizes the electronic component 1 and detects the positional shift and inclination of the electronic component 1. Thereafter, the mounting head 3 moves to a predetermined position B, and the electronic component 1 is placed on the circuit board 5 supported on the XY table Z.

At that time, based on the information on the positional deviation and inclination of the electronic component 1 from the recognition device 6, the deviation from the normal position of the electronic component 1 is corrected by the XY table 7, and the inclination is also corrected at the top of the mounting head 3. Correct by rotating the motor 8.

By the way, electronic component 1 in such an electronic component mounting device
The recognition device 6 has conventionally been configured using a TV camera.

However, in this conventional recognition device using a TV camera, 2mm X'
It is effective for small electronic components of about 3 mm, but the second
This method is not suitable for recognizing large electronic components such as the LSI shown in FIG. 3 and FIG. 3, which are 15 mm square or larger and have many leads.

That is, in the conventional apparatus described above, when recognizing the entire image of such a large electronic component using a TV camera, the field of view must be widened, resulting in lower resolution and poorer recognition accuracy.

Furthermore, if an attempt is made to increase the number of image divisions in order to obtain high resolution, it will become very expensive. Furthermore, when enlarging and recognizing a part of an electronic component, it is necessary to recognize multiple parts of the electronic component, so it is necessary to install multiple TV cameras or provide a mechanism for moving the TV camera if the electronic component is not yet available. Instead, the equipment becomes large and complicated,
It had drawbacks such as being expensive.

[Purpose of the invention]

The present invention has been made to eliminate the drawbacks mentioned above, and is capable of recognizing electronic components with high accuracy in a sing-song device used in a mounting device for electronic components that is large and has a large number of leads. It is an object of the present invention to provide an electronic component recognition device that can be configured at low cost.

[Summary of the invention]

The present invention uses a line sensor whose detection range is approximately equal to the pitch of the leads of an electronic component as an optical recognition element for positional deviation and tilt of the electronic component, and detects the position of the electronic component and the line sensor during the transportation of the electronic component. By moving one of them, the electronic component is scanned at least two locations in the lead arrangement direction by the line sensor from a direction intersecting the lead arrangement direction, and the obtained image information is used to determine the positional deviation of the electronic component; It is designed to recognize the angle and slope.

[Embodiments of the invention]

Hereinafter, the present invention will be explained in detail with reference to FIGS. 4 to 13.

FIG. 4 is a side view showing the main parts of an embodiment of the electronic component recognition device according to the present invention together with the electronic components being transported.
is a stand placed in the same position as the recognition device 6 in FIG. A line sensor 10 is mounted and fixed on the upper surface of this table 9, and a cylindrical lens 11 is held above it by a holding means (not shown). This lens 11 is adapted to fit the electronic component 1 carried by the mounting head 3 in the direction of the arrow.

”□ The line sensor 10 has 2 lines as shown in FIG.
There are several. These two line sensors 10a, 1
0b is the arrangement direction (fifth direction) of the leads 1a of the electronic component 1, respectively.
They are arranged side by side with their lengths oriented in a direction that intersects the vertical direction (in the figure), and the detection range is selected to be approximately equal to the pitch E of the leads 1a of the electronic component 1.

Next, detection (recognition) of positional deviation and inclination of the electronic component 1 by the apparatus of the present invention having the above-described configuration will be described.

Now, as the electronic component 1 is being transported, it will cross the line sensors 10a and 10b above the table 9. Figure 6 shows the electronic component 1 starting to pass over the line sensor 10a. By passing, the line sensors 10a and 1ob first detect the lead 1a portion on the left side of the electronic component 10 in the figure, then the main body portion, and then the right side portion 13 in the figure, that is, in a direction that intersects with the arrangement direction of the leads 1a. It will be scanned from. At this time, by binarizing the image signals detected by the line sensors 10a and 10b using an appropriate threshold value and associating them with white and black, the number of white and black changes as the electronic component 1 passes, and the electronic Part 1 can be detected as a black image.

FIG. 7 is a graph showing the relationship between the position of the electronic component 1 and the number of black dots detected by the line sensor 10, where (a) is the detection result of the line sensor 10b, and (b) is the line sensor 1
It shows the detection result of 0a.

In the figure, between J and K and between L and M are line sensors ioa.
, 1ab are all black pixels.

FIG. 8 is a plan view showing the state of the line sensors 1oa, 1ob and the electronic component 1 passing above them at this time, and the hatched part in the figure is the line sensor 10a.

10b shows the detection scanning area. And, J, L, M in Fig. 7 are J' T K in Fig. 8,
This corresponds to each point L' and M'1.

In FIGS. 7 and 8, by taking the average of the midpoints of points J and , and the midpoint of points M, the center position of the electronic component 1 is 0, and the paper position deviation amount can be obtained.

Further, the amount of inclination Δθ can be determined by measuring in advance the mounting positions of the line sensors 10a and 10b, especially their mutual distance.

In addition, in the above embodiment, the present invention is not limited to the case where the electronic component 1 having leads 1a on two opposing sides of a quadrilateral as shown in FIG. 6 is the recognition target. For example, as shown in FIG. 2, it is also possible to target an electronic component 1 having leads 1a on all four sides of a quadrilateral.

FIG. 9 is a plan view showing the tube section of the configuration example of the apparatus of the present invention in this case together with the electronic components being transported. Here, the fifth
As is clear from the comparison with the figure, line sensor 10C, 1
0d has been added to platform 9.

Although not shown, a cylindrical lens is also added.

The installation position of the table 9 is the same as in the above-mentioned embodiment, but here, as shown in FIG. 10, in which the same or corresponding parts as in FIG.
2b, and is movable by a ball screw 13 in a direction l. Further, a motor (not shown) with a position detector is connected to the ball screw 16.

Note that the detection range of the line sensor IOC, 10d is also selected to be approximately equal to the pitch E of the leads 1a of the electronic component 1;
10d is the vertical direction K in FIG. 9 [because it is used to scan the child component 1, the direction that intersects with the arrangement direction of the upper and lower leads 1a (horizontal direction in the figure) of the electronic component 1 in FIG. are juxtaposed with their lengths oriented.

Next, detection (recognition) of positional deviation and inclination of the electronic component 1 according to the above-described configuration example will be described.

In FIG. 9, when the electronic component 1 is being transported, it crosses the line sensors 1oa and iDbf above the table 9.

FIG. 11 shows a state in which the electronic component 1 begins to pass over the line sensor 10a, and this passage causes the line y
C:/f 10a, 10b id, the electronic component 1 is scanned from a direction intersecting the arrangement direction of the leads 1a on the left and right sides (vertical direction in the figure). At this time, the image signals detected by the line sensors 10a and 10b are binarized using an appropriate threshold value and are associated with black and white, so that the number of white and black changes as the electronic component 1 passes, and the electronic component 1 can be detected as a black image.

FIG. 12 is a graph showing the relationship between the position of the electronic component 1 and the number of black dots detected by the line sensor 10a. In the area between A and M in the figure, all pixels of the line sensor 10a are black. It is an area.

FIG. 13 shows the line sensors 10a, 1 at this time.
This is a plan view showing the state of ob and the electronic component 1 passing above it.
b shows the detection scanning area. And Figure 12 Glue 9
M corresponds to each point L'1M' in FIG. Similarly, a point can be placed at J' in FIG. 15 using the image signal from the line sensor 10b, and these J', K',
Positional deviation in the direction (X direction) intersecting the arrangement direction of the leads 1a on the left and right sides of the electronic component 1 can be detected from each point L' and M'.

Further, the amount of inclination Δθ can be determined by measuring the mounting positions of the line sensors 10a and 10b, especially the mutual distance therebetween, in advance.

Detection of positional deviation in the direction (y direction) that intersects the arrangement direction of the upper and lower parts 1a of the electronic component 1 is performed by detecting the position G (
(see FIG. 9), the table 9 is moved in the downward direction of the arrow in FIG. 9, and positional deviation detection in the X direction is performed using the line sensors IQC and 1OA in the same manner as described above.

Note that the scanning of the electronic component 1 in the y direction in this case is as follows:
If the table 9 is used as an XY table and the line sensors 10a and 10b are moved in the x and y directions with the electronic component 1 stopped, this can be done using only the line sensors 10a and 10b, and the line sensor 10C210d can be omitted. Is possible.

〔Effect of the invention〕

As described above, the present invention uses a line sensor whose detection range is approximately equal to the pitch of the leads of the electronic component as an optical recognition element for the positional deviation and inclination of the electronic component. By moving either the electronic component or the line sensor, the electronic component is scanned by the line sensor at least two locations in the lead array direction from a direction intersecting the lead array direction, and the electronic component is scanned by the line sensor. Since the system uses image information to recognize the positional deviation and tilt of the electronic component, it is possible to recognize large electronic components with many leads with high precision and with a cheaper configuration compared to conventional equipment. effective.

[Brief explanation of the drawing]

FIG. 1 is a side view showing an example of an electronic component mounting device, FIGS. 2 and 3 are perspective views each showing a configuration example of a large electronic component, and FIG. 4 is an embodiment of an electronic component recognition device according to the present invention. FIG. 5 is a side view showing the main parts of the example together with electronic components, and FIG. 5 is a plan view showing the arrangement of the line sensor in FIG. 4.
The figures are for explaining the recognition operation of electronic components by the apparatus of the present invention shown in FIG. 4, and FIG. 9
A side view showing an example in which the apparatus of the present invention shown in FIG. It is. 1...Electronic component, 1a...Lead, 3...Mounting head, 5...Circuit board, 6...Si of electronic component ! ! Identification device, 9...
...stand, 10.10a-10d...line sensor, 11
...Cylindrical lens. Representative Patent Attorney Akio Takahashi Figure 4 弗 50 7I! Section 21 3 Figure No. 1 Figure No. /l Figure 72 Figure 1 → 1 Tasho L Circle

Claims (1)

[Claims] An electronic component mounting device that attaches an electronic component having a plurality of leads to a mounting head, sequentially transports the electronic component, and places the electronic component at a predetermined position on a circuit board.
Electronics that optically recognizes the positional deviation and inclination of the electronic component during transportation in order to correct the position and inclination of the electronic component so that the electronic component is accurately placed at a predetermined position on the circuit board. In a component recognition device, a line sensor whose detection range is approximately equal to the pitch of the leads of the electronic component is used as an optical recognition element for positional deviation and tilt of the electronic component, and the electronic component is detected while the electronic component is being transported. and by moving one of the line sensors, the electronic component is scanned by the line sensor at least two locations in the lead arrangement direction from a direction intersecting the lead arrangement direction, and based on the image information obtained, An electronic component recognition device characterized in that the electronic component recognition device recognizes a positional shift and an inclination of the electronic component.