JPS63178600A - Electronic parts feeder/tester - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION Field of the Invention The present invention relates to an electronic component supply inspection device that fully inspects whether electronic components are correctly supplied when electronic components are automatically mounted on a printed circuit board.

Conventional technology When electronic components are automatically mounted onto a printed circuit board using an electronic component mounting machine, etc., the electronic components are first attracted to the suction nozzle in the mounting head, and then the electronic components are mechanically positioned and then placed on the printed circuit board. Attach to. Malfunctions during automatic mounting include electronic components not being mounted, electronic components being mounted on a surface other than the surface with electrodes that are in close contact with the printed circuit board and standing on the printed circuit board, and electronic components not being placed in the correct position. There are patterns in which the electronic components are rotated relative to their correct positions, and these defects are caused by poor mechanical positioning of the electronic components.

Therefore, in order to improve the mounting accuracy of electronic components, it is necessary to conduct a complete inspection to see if the electronic components are correctly positioned while being sucked into the suction nozzle before mounting, and to avoid mounting electronic components that are incorrectly positioned. Must be.

The electronic component supply and inspection apparatus will be described below with reference to the drawings. FIG. 5 shows an example of a conventional electronic component supply inspection device. In FIG. 6, 20 is a light projecting section of the original fiber sensor.

21 is a light receiving section of the optical fiber sensor. By lowering the suction nozzle 22, the electronic component suctioned by the suction nozzle 22 moves between the light projecting section 2o and the light receiving section 21, which face each other. FIG. 6 is an enlarged view of the tips of the light emitting part 2o and the light receiving part 21, and the light emitting optical fiber 23 and the light receiving optical fiber 24 are arranged in a direction perpendicular to the electronic component suctioned by the suction nozzle 22. The number of original fibers is the same. Each party fiber is connected to the same number of optical fibers as former fiber sensors that can determine whether the party is joining the party or being blacked out.

The operation of the conventional electronic component supply apparatus configured as described above will be described below. As the suction nozzle 22 descends, the electronic component suctioned by the suction nozzle 22 moves between the light projecting section 20 and the light receiving section 21 that face each other, and the electronic component attracts the light projecting section 2.
The light rays emitted from the o-side are completely blocked, but if no electronic component is attracted to the suction nozzle 22, the light is not blocked.

Since several light receiving optical fibers 24 are arranged in the light receiving section 21, the thickness of the electronic component sucked by the suction nozzle 22 can be measured depending on the number of light receiving optical fibers 24 that are blocked. If the number of light-receiving optical fibers 24 that are shielded by a correctly sucked electronic component is measured in advance as the true value, if the number of light-receiving optical fibers 24 that are shielded by the measured light-receiving optical fibers 24 is greater than the true value, the electronic component will stand and the number of light-shields will be zero. If so, it is possible to determine whether there is an electronic component or not, and to inspect the supply of electronic components.

Problems to be Solved by the Invention In such a conventional configuration, the mounting pitch of the light-receiving optical fiber 24 shown in FIG. Regarding electronic parts,
There was a problem in that supply inspection could only be performed for defective items such as no electronic component and electronic component standing, and supply inspection could not be performed for defective items such as electronic component misalignment and electronic component rotation.

In view of the above-mentioned problems, the present invention provides an electronic component supply inspection device that can accurately inspect all of the above-mentioned defective items for many types of electronic components.

Means for Solving the Problems In order to solve the above-mentioned problems, the present invention provides an electronic component supply inspection device of the present invention, which irradiates electronic components sucked by a suction nozzle with a beam of light having a width in the horizontal direction. An X-axis light projector, a Y-axis light projector that also has an @ in the horizontal direction and emits light from a direction perpendicular to the light beam of the X-axis light projector, and a Y-axis light projector that has a width in the direction perpendicular to the electronic components. a Z-axis light projector that emits a light beam;
The X
It is composed of an axial light projector, a Y-axis light projector, and a Z-axis light projector.

Function The present invention uses the above-described configuration to measure the length of an electronic component sucked by a suction nozzle from three directions, so that it can be used for many types of electronic components, not only those without electronic components or standing electronic components as in the past. With regard to defective items such as electronic component misalignment and electronic component rotation, it is possible to perform electronic component supply inspection with high accuracy.

EXAMPLE Hereinafter, an example of the present invention will be described with reference to the drawings. FIG. 1 shows the basic configuration of an electronic component supply inspection apparatus in an embodiment of the present invention.

In FIG. 1, reference numeral 1 denotes an X-axis light projector that irradiates electronic components with a beam having a width in the horizontal direction. Reference numeral 2 denotes a Y-axis light projector that irradiates electronic components with a light beam having a width in the horizontal direction and having an angle of 3o0 with respect to the light beam of the X-axis light projector 1. The light beam from the Y-axis light projector 2 is reflected by the two mirrors 74 to 7b and illuminates the electronic component from a direction perpendicular to the light beam from the X-axis light projector 1. 3
is a Z-axis light projector that irradiates electronic components with a beam having a width in the vertical direction. An X-bearing base portion 4. is disposed in the opposite direction to each of these light projecting units 1 to 3 via electronic components, and has a width that allows all of the light beams from each of the light projecting units 1 to 3 to be detected. Y bearing base 5
．． There is a Z bearing base portion 6. Each of these light projecting units 1 to 3. Each light receiving section 4-6. Mirrors γa to 7b are connected to bases 8a to 8b and supports 9
It is incorporated using 2L to 9c. Next,
．． Y-wheel light projector 2. A configuration diagram of the Z-axis light installation section 3 is shown in FIG. In FIG. 2, 1o is a light source. 11a to 11b are lenses. A light source 10 and lenses 11a to 11b are attached to a case 12. A slit 13 is formed in the case 12 so that light can be irradiated thereon. The X-ring projector 1 and the Y-ring projector 2 have exactly the same structure, and the two-axis installation part 3 has the same structure as the X-ring projector 1, but the beam of light emitted is small. No, small lens 111L~1
1b is used. The X-ring light projecting section 1 and the Y-ring projecting section 2 (300) are overlapped in two stages at all angles, and furthermore, the light rays emitted from the Y-wheel projecting section 2 are reflected by the mirrors a to ab,
The reason why the X-axis light installation section is configured to be perpendicular to the 10-element line is to make the overall size of the inspection device smaller.

The operation of the electronic component supply inspection apparatus configured as described above will be described below. As the suction nozzle descends, the electronic component suctioned by the conventional suction nozzle moves to an inspection position where the light beams irradiated from all the light projectors 1 to 3 intersect. The light rays emitted from each of the light projecting sections 1 to 3 are partially blocked by the electronic components, and then enter the respective light receiving sections 4 to 6. Each of the light receiving sections 4 to 6 uses a light receiving element that can detect the position and length of light shielding, and the data output from the light receiving element is processed by a computer or the like. Next, a method for determining each defective item will be explained. First, HxX axis light receiving section 4 without electronic components
Since the portion of the Y-axis light receiving section 5 that is shielded from light becomes zero, inspection is possible. Next, the electronic component can be inspected (since the light-shielded portion of the 4z-axis light receiving section 6 is large). Next, the method for inspecting the electronic component position shift is shown in Fig. 3. 14 & is when the electronic component is in the correct position 14t) is a case where the position of the electronic component is shifted. In that case, the light-shielding portions of the X-axis light receiving section 4 and the Y-axis light receiving section 6 are 16a to 1 in the case of the electronic component 141L.
6b, in the case of electronic component 14b, it is 168 to 16b,
The position of the light-shielding part is different, so it can be inspected. Also, even if the electronic components are misaligned only on the X axis or only on the Y axis,
Since the axis light receiving section 4 and the Y axis light receiving section 5 are independent, inspection is possible. Next, a method for inspecting the rotation of electronic components is shown in FIG. 1
A is a case where the suction angle of the electronic component is correct. The first case is when the suction angle of the electronic component is incorrect.

In that case, the light-shielding portions of the X-axis light receiving section 4 and Y-axis light receiving section 5 are as follows:
In the case of electronic component 17a (7) u 18 fL ~ 18 b
.

In the case of the electronic component 17b, there are 191 to 19b, which can be inspected because the lengths of the light shielding portions are different.

Effects of the Invention As described above, the present invention has a simple structure that can be applied to a wide variety of electronic components with different shapes, and can be used to deal with not only defects such as no electronic components and standing electronic components, but also defects such as misalignment of electronic components and rotation of electronic components. It enables highly accurate supply inspection, greatly improves the mounting accuracy when mounting electronic components on printed circuit boards, and has the effect of realizing high-density mounting of printed circuit boards, and its industrial efficiency is second to none. be.

[Brief explanation of the drawing]

FIG. 1 is a perspective view of an electronic component supply and inspection apparatus according to an embodiment of the present invention. FIG. 2 is a sectional view of each light projecting section in one embodiment of the present invention. FIG. 3 is a principle diagram showing a method for inspecting positional deviation of electronic components in an embodiment of the present invention. FIG. 4 is a principle diagram showing a method for inspecting rotation of electronic components in an embodiment of the present invention. FIG. 6 is a perspective view of a conventional electronic component supply and inspection device. FIG. 6 is a perspective view of a light emitting/receiving section of a conventional electronic component supply/inspection device. 1...X-axis installation part, 2...Y-axis installation part, 3...Z-axis light projecting part, 4...X-axis light receiving part , 6...Y-axis light receiving part, e...Z-bearing base part, 71-7b...mirror, 8a-8b...
・・Base, 9a to 9C・・・Post, 1o・・
...Light source, 11a-11b・Mountain...Lens, 12・
...Case, 13 ...Slit, 142
L~14b...Electronic parts, 16a~15t),
164~1θb... Light shielding part, 171L~1terb... Electronic component, 18a~1 ab, 19
1L~191)... Light shielding part. Name of agent: Patent attorney Toshio Nakao and 1 other person No. 1
Figure 2 Figure 3

Claims (1)

[Claims] An X beam that irradiates the electronic components sucked by the mounting head with a beam of light having a width in the horizontal direction on one transport trajectory of the mounting head that picks up and transports the electronic components supplied by the component supply section at the lower end. It has the same width in the horizontal direction as the axial light emitter,
and a Y-axis light projector that irradiates a light beam from a direction perpendicular to the light beam of the X-axis light projector, a Z-axis light projector that irradiates a beam of light with a width in the perpendicular direction to electronic components, and each of these light projectors. An electronic component supply inspection consisting of an X-axis light receiving section, a Y-axis light receiving section, and a Z-axis light receiving section, which are arranged in opposite directions across the light emitting section and the electronic component, and have a width to detect all the light beams from each light emitting section. Device.