JPS61186235U - - Google Patents

Info

Publication number
JPS61186235U
JPS61186235U JP6919485U JP6919485U JPS61186235U JP S61186235 U JPS61186235 U JP S61186235U JP 6919485 U JP6919485 U JP 6919485U JP 6919485 U JP6919485 U JP 6919485U JP S61186235 U JPS61186235 U JP S61186235U
Authority
JP
Japan
Prior art keywords
section
stage
collect
wafer
mount
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP6919485U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP6919485U priority Critical patent/JPS61186235U/ja
Publication of JPS61186235U publication Critical patent/JPS61186235U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Die Bonding (AREA)

Description

【図面の簡単な説明】[Brief explanation of drawings]

第１図は本考案のマウント装置の一実施例を示
すフオトカプラー用マウント装置の平面図、第２
図ａ，ｂ，ｃはマウント順序を表わす図である。 １……ＬＥＤウエハース、２……フオトトラン
ジスタウエハース、３……第１のＸ―Ｙステージ
、４……ＬＥＤペレツト吸着用コレツト、５……
フオトトランジスターペレツト吸着用コレツト、
６……コレツトホルダー部、７……マウントヘツ
ド部、８……第２のＸ―Ｙステージ、９……ペレ
ツト吸着部、１０……ローダー部。 FIG. 1 is a plan view of a photocoupler mounting device showing one embodiment of the mounting device of the present invention, and FIG.
Figures a, b, and c are diagrams showing the mounting order. 1... LED wafer, 2... Photo transistor wafer, 3... First XY stage, 4... LED pellet adsorption collector, 5...
Collection for adsorbing phototransistor pellets,
6... Collet holder section, 7... Mount head section, 8... Second XY stage, 9... Pellet adsorption section, 10... Loader section.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] ダイレクトマウント用の２種類のウエハースを
搭載した第１のＸ―Ｙステージと、前記２種類の
ウエハースを第１のＸ―Ｙステージ上のペレツト
吸着部に選択供給するウエハース供給部と、前記
２種類のウエハースに合つたコレツトを供給する
コレツトホルダー部と、ウエハースのペレツトを
コレツトにて吸着し、これをリードフレームのマ
ウント部にマウントするマウントヘツド部と、該
マウントヘツド部を、第１のＸ―Ｙステージ上の
ペレツト吸着部、リードフレームのマウント部、
コレツトホルダー部へ搬送する第２のＸ―Ｙステ
ージとを有することを特徴とするマウント装置。 a first XY stage carrying two types of wafers for direct mounting; a wafer supply section that selectively supplies the two types of wafers to a pellet adsorption section on the first XY stage; a collection holder section that supplies a collect suitable for the wafer; a mount head section that adsorbs wafer pellets with the collect and mounts them on the mount section of the lead frame; - Pellet suction part on Y stage, lead frame mount part,
A mounting device characterized by having a second XY stage for transporting a collect to a holder section.
JP6919485U 1985-05-10 1985-05-10 Pending JPS61186235U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP6919485U JPS61186235U (en) 1985-05-10 1985-05-10

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP6919485U JPS61186235U (en) 1985-05-10 1985-05-10

Publications (1)

Publication Number Publication Date
JPS61186235U true JPS61186235U (en) 1986-11-20

Family

ID=30604636

Family Applications (1)

Application Number Title Priority Date Filing Date
JP6919485U Pending JPS61186235U (en) 1985-05-10 1985-05-10

Country Status (1)

Country Link
JP (1) JPS61186235U (en)

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5128757A (en) * 1974-09-04 1976-03-11 Hitachi Ltd PERETSUTO BONDEINGUSOCHI
JPS59210647A (en) * 1983-05-14 1984-11-29 Matsushita Electric Ind Co Ltd Pellet bonding device

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5128757A (en) * 1974-09-04 1976-03-11 Hitachi Ltd PERETSUTO BONDEINGUSOCHI
JPS59210647A (en) * 1983-05-14 1984-11-29 Matsushita Electric Ind Co Ltd Pellet bonding device

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