JPS61182059U - - Google Patents
Info
- Publication number
- JPS61182059U JPS61182059U JP6488485U JP6488485U JPS61182059U JP S61182059 U JPS61182059 U JP S61182059U JP 6488485 U JP6488485 U JP 6488485U JP 6488485 U JP6488485 U JP 6488485U JP S61182059 U JPS61182059 U JP S61182059U
- Authority
- JP
- Japan
- Prior art keywords
- base member
- circuit board
- flexible circuit
- overhang
- joined
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000005452 bending Methods 0.000 claims description 4
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 230000003466 anti-cipated effect Effects 0.000 description 1
Description
第１図は、本考案に係る可撓性回路基板の折曲
げ構造の一実施例を概念的に示す展開平面図、第
２図は、前記折曲げ構造によつて所要部分を接合
した状態を示す平面図、第３図及び第４図は、そ
れぞれ、従来の可撓性回路基板の折曲げ構造を示
す第１図及び第２図と同様な展開平面図及び平面
図である。
５：接着剤、６：折曲げ想定線、４：可撓性回
路基板、４Ｂ：張出部。
FIG. 1 is a developed plan view conceptually showing an embodiment of the bending structure of a flexible circuit board according to the present invention, and FIG. 2 shows a state in which the required parts are joined by the bending structure. The plan view shown, FIG. 3, and FIG. 4 are a developed plan view and a plan view similar to FIG. 1 and FIG. 2, respectively, showing the folding structure of a conventional flexible circuit board. 5: Adhesive, 6: Anticipated bending line, 4: Flexible circuit board, 4B: Overhang.
Claims (1)
パターンを形成した可撓性回路基板に於いて、前
記ベース部材の一部に張出部を設け、該張出部に
おいて折曲げ接合するよう構成したことを特徴と
する可撓性回路基板の折曲げ構造。 In a flexible circuit board in which a required circuit pattern is formed on at least one surface of a base member, a part of the base member is provided with an overhang, and the base member is configured to be bent and joined at the overhang. A bending structure of a flexible circuit board featuring:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985064884U JPH0429583Y2 (en) | 1985-04-30 | 1985-04-30 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985064884U JPH0429583Y2 (en) | 1985-04-30 | 1985-04-30 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS61182059U true JPS61182059U (en) | 1986-11-13 |
| JPH0429583Y2 JPH0429583Y2 (en) | 1992-07-17 |
Family
ID=30596379
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1985064884U Expired JPH0429583Y2 (en) | 1985-04-30 | 1985-04-30 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0429583Y2 (en) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61182060U (en) * | 1985-04-30 | 1986-11-13 |
-
1985
- 1985-04-30 JP JP1985064884U patent/JPH0429583Y2/ja not_active Expired
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61182060U (en) * | 1985-04-30 | 1986-11-13 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0429583Y2 (en) | 1992-07-17 |