JPS61181175A - Reflected beam type optical coupling semiconductor device - Google Patents

Abstract

PURPOSE:To prevent an overflow on a resin seal, and to obviate a malfunction by upward projecting a partition wall from the top surface of the outer wall of a package case and forming a projecting edge for stopping a resin projecting to both element section sides at the nose of a projecting section. CONSTITUTION:A partition wall 2 in a packate case is projected upward from the top surface of the outer wall of the package case. Since grooves are formed on both sides in the projecting section 12, projecting edges 13 projecting to both sides are shaped at the nose of the projecting section 12. Since the partition wall 12 and the projecting edges 13 are shaped, there is the projecting section 12 and the projecting edges 13 function as a resin stop even when a sealin resin in quantity, in which an overflow is generated in a conventional position detector on a resin sealing, is injected in the manufacture of the little device, thus completely separating resin seal layers 7, 8 in both element sections, then resulting in no formation of continuous resin seal layers while crossing the projecting section 12. Accordingly, defective leakage as seen in conventional devices is reduced remarkably, thus preventing a malfunction, then improving the yield on manufacture.

Description

[Detailed description of the invention] [Technical field of invention] The present invention relates to improvements in reflective light type optically coupled semiconductor devices.

[Technical background of the invention]

Reflected light type optically coupled semiconductor devices have a sensor function and are used in a variety of applications such as photoelectric switches, logic circuit connections, position detection, and timing detection.

FIG. 2 is a cross-sectional view showing a general structure of a conventional reflection type optically coupled semiconductor device used as a position detector. In the same area, 1 is an envelope case made of insulating material such as ceramic. Two recesses are provided in the envelope case 1, one for the light emitting element and the other for the light receiving element, and the two recesses are separated by a partition wall 2. A metal mount part 3.4 is provided on the bottom of each of these recesses, and a light emitting element pellet 5 and a light receiving element pellet 6 are placed on each mount part.
are mounted respectively. A resin sealing layer 7.8 made of transparent epoxy resin is formed in both of the recesses to seal the light emitting element section and the light receiving element section. The mount portion 3.degree.4 is extended outside the envelope case 1 as a lead, and the light emitting element pellet 5 and the light receiving element pellet 6 are wire bonded (not shown).

In the optically coupled semiconductor device described above, the light emitted from the light emitting element pellet 5 is reflected by an object, and the light receiving element pellet 6 detects this reflected light, thereby functioning as a position detector.

By the way, the above-mentioned conventional reflective light type optically coupled semiconductor device has a third
As shown in Figure (A), a lead frame equipped with an envelope case 1 is used and manufactured in the following manner. In the figure, 9 is a lead pattern and 10 is a tie bar.

First, the light emitting element 5 and the light receiving element 6 are mounted on the mount parts 3 and 4 of each element part, respectively, and wire bonding is performed between each element and a bonding part provided opposite the mount part. 11 in the figure is a bonding wire. Subsequently, a transparent epoxy resin is poured into the light emitting element recess and the light receiving element recess of the envelope case and hardened to seal each element. Next, tie bar 10...
After cutting out and separating each lead pattern 9...
Lead forming is performed by bending the separated individual leads 9 in a predetermined direction to obtain a desired optically coupled semiconductor device.

[Problems with background technology]

In the conventional reflective light type optically coupled semiconductor device described above, since the resin sealing layer 7.8 functions as a lens, it is required that the light emitting side and the light receiving side have the same shape. For this reason, when resin sealing, it is necessary to pour the same amount of resin to the pixel element part. Also, if the amount of resin is too small, the directivity will deteriorate, so when pouring the resin, the resin of the pixel element part There was a problem that the resin sealing layers overflowed each other and a continuous resin sealing layer was formed.

If the resin sealing layer 7 of the light-emitting element part and the resin sealing layer 8 of the light-receiving element part become continuous in this way, the light-emitting element pellet 3
A phenomenon occurs in which light is refracted through the resin sealing layer and leaks to the light-receiving element, causing malfunctions and deteriorating product characteristics.

[Purpose of the invention]

The present invention has been made in view of the above circumstances, and has a structure that can be manufactured by preventing overflow during resin sealing, and therefore has an excellent reflective light type optical coupling that does not cause malfunctions. The present invention aims to provide a type semiconductor device.

[Summary of the invention]

A reflected light type optically coupled semiconductor device according to the present invention includes an envelope case made of an insulating material and having a recess for a light emitting element and a recess for a light receiving element separated by a partition wall, and a recess for the light emitting element and a recess for the light receiving element. an element mount part and a bonding terminal provided on the bottom surface of each of the recesses; a light emitting element pellet mounted on the element mount part in the light emitting element recess and wire-bonded to the bonding terminal; A light-receiving element pellet mounted on the element mount part in the light-receiving element recess and wire-bonded to the bonding terminal, and a light-receiving element pellet filled in the light-emitting element recess to seal the light-emitting element part. a transparent resin layer; a transparent resin layer filled in the light-receiving element recess to seal the light-receiving element;
and leads extending from each of the element mount portion and the bonding terminal to the outside of the envelope case,
The partition wall is made to protrude upward from the top surface of the outer wall of the envelope case, and the protruding portion is provided with a resin-fastening protrusion protruding toward both element portions at the tips thereof.

As described above, in the present invention, since the partition wall of the envelope case is made high and the projecting edge for resin fixing is provided, overflow of the sealing resin occurs when the light emitting element part and the light receiving element part are sealed with resin. Therefore, it is possible to prevent the resin sealing layer in the pixel element portion from being continuous, and therefore, it is possible to obtain good characteristics that do not cause malfunctions.

[Embodiments of the invention]

FIG. 1(A) is a perspective view of a lead frame used for manufacturing a position detector according to an embodiment of the present invention, and FIG. 1(B)
FIG. 2 is a partially cutaway front view of a position detector manufactured using this lead frame. In these figures, the same parts as in FIGS. 2 and 3 are given the same reference numerals.

That is, 1 is an envelope case, 2 is a partition wall, 3.4 is an element mounting part, 5 is a light emitting element pellet, 6 is a light receiving element pellet, and 7 and 8 are resin sealing layers.

As is clear from a comparison between FIG. 1(A) and FIG. 3(A), the lead frame in FIG. 1(A) is different from the partition wall 2 in the envelope case in the case of FIG. It is higher than the outer wall of the envelope case and protrudes above the top surface of the outer wall of the envelope case. Grooves are formed on both sides of the protruding part 12, and as a result, a protruding edge 13 is formed at the tip of the protruding part 12, which protrudes on both sides. The structure other than this protrusion 12 is substantially the same as the lead frame shown in FIG. 3(A).

Furthermore, the process of manufacturing the position detector shown in FIG. 1(B) using the lead frame shown in FIG. 1(A) is also shown in FIG.
This is exactly the same as the conventional method explained in B). Therefore,
As is clear from FIG. 1(B), the position detector according to this embodiment is similar to the conventional position detector shown in FIG. It has exactly the same structure as the container.

As mentioned above, this example uses partitions! ! 12 and the protruding edge 13, the following effects can be obtained.

That is, even when the molding resin is injected in an amount that would cause an overflow in a conventional position sensor, the presence of the protruding portion 12 and the protruding edge 13 can be prevented by the resin sealing. Figure 1 (
As shown in B), the resin sealing layer 7.8 of the pixel element portion is completely separated, and no continuous resin sealing layer is formed beyond the protrusion 12. Therefore, according to the position detector of the above-described embodiment, it is possible to significantly reduce leakage defects as in the prior art, prevent malfunctions, and improve manufacturing yield.

In the above embodiment, grooves are formed on both sides of the protruding portion 12 to provide the protruding edges 13, but the means for forming the protruding edges 13 is not limited to this.

Further, the scope of application of the present invention is not limited to position detectors, but can be similarly applied to other reflective light type optically coupled semiconductor devices such as photoelectric switches and timing detectors.

〔Effect of the invention〕

As detailed above, the reflective light type optically coupled semiconductor device of the present invention has a structure that can prevent overflow during resin encapsulation, and therefore has remarkable effects such as excellent characteristics that do not cause malfunctions. It is something to play.

[Brief explanation of drawings]

FIG. 1(A) is a perspective view of a lead frame used for manufacturing a position detector according to an embodiment of the present invention, and FIG. 1(B)
2 is a partially cutaway front view showing a position detector according to an embodiment of the present invention, FIG. 2 is a sectional view showing a conventional position detector, and FIGS. FIG. 2 is an explanatory diagram of a method and a lead frame used in the method. 1... Envelope case, 2... Partition wall, 3.4...
・Element mount part, 5... Light emitting element, 6... Light receiving element, 7° 8... Resin sealing layer, 9... Lead pattern, 10... Tie bar, 11... Bonding wire, 12... Projection, 13... Projection. Applicant's agent Patent attorney Takehiko Suzue

Claims (1)

[Claims] An envelope case made of an insulating material and having a recess for a light emitting element and a recess for a light receiving element separated by a partition wall, and an element mount section provided on the bottom surface of each of the recess for the light emitting element and the recess for the light receiving element. and a bonding terminal,
a light-emitting element pellet mounted on the element mount part in the light-emitting element recess and wire-bonded to the bonding terminal; and a light-emitting element pellet mounted on the element mount part in the light-receiving element recess and bonded to the A light-receiving element pellet wire-bonded to a terminal, a transparent resin layer filled in the light-emitting element recess to seal the light-emitting element, and a light-receiving element filled in the light-receiving element recess. a transparent resin layer for sealing the outer wall of the enclosure case, and leads extending from the element mounting section and the bonding terminal to the outside of the enclosure case, and What is claimed is: 1. A reflective light type optically coupled semiconductor device, characterized in that a projecting edge for resin fixing is provided at the tip of the projecting portion, the projecting portion projecting further upward and toward both element portions.