JPH0983011A - Optical semiconductor device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To obtain an optical semiconductor device which can irradiate light over a long distance and can detect a small object by condensing the light emitted from a light emitting element through a lens part before being received by a light receiving element thereby enhancing the directivity of light. SOLUTION: A case 10 is composed of a light shielding resin, e.g. a liquid crystal polymer resin, and provided with a pair of first and second recesses 11, 12. The first recess 11 is provided with a first photoconductive pattern 21 and a light emitting element 31 and filled with a translucent resin 35. A hemispheric lens part 35a is provided above the translucent resin 35. The second recess 12 is provided with a second photoconductive pattern and a light receiving element 33 and filled with a translucent resin 36. A lens part 36a is provided above the translucent resin 36. The light emitted from the light emitting element 31 is condensed through the lens part 35a before impinging on an object 40. Reflected light from the object 40 is condensed through the lens part 36a on the light receiving side and impinges on the light receiving element 33.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a light emitting semiconductor device that emits light in response to an electric signal, a light receiving semiconductor device that receives light and emits an electric signal, or a light emitting element and a light receiving element integrated to form a light emitting element. The present invention relates to an optical semiconductor device such as a photo-interrupter semiconductor device, such as a photo interrupter, in which a light receiving element receives reflected light of emitted light.

[0002]

2. Description of the Related Art Recently, as a photo interrupter in which a light receiving element receives a reflected light of a light emitted from a light emitting element in order to detect the presence of an object, it has recently been formed of an insulating light-shielding resin. MID (Molded I
A device in which a light emitting element and a light receiving element are integrated with each other by using a substrate is developed. FIG.
11 is a perspective view showing an example of a photo interrupter using a MID substrate, FIG. 12 is a sectional view taken along line EE of FIG. 11, FIG. 13 is a sectional view taken along line FF of FIG.
FIG. 12 is a sectional view taken along the line GG in FIG. 11.

This photo interrupter has a rectangular parallelepiped insulating case body 70. This case body 7
0 is composed of a light-shielding resin such as a liquid crystal polymer resin. The case body 70 is provided with a pair of a first recess 71 and a second recess 72 each having a square opening in the upper surface.

A pair of conductive patterns 81 and 82 is provided in one of the first recesses 71, and a pair of conductive patterns 83 and 84 is also provided in the other second recess 72.

One of the first conductive patterns 81 provided in the first recess 71 has a mount portion 81a located on the bottom surface of the first recess 71 and the mount portion 81a passing through the inner surface and the top surface of the first recess 71. And a bottom surface portion 81c continuously provided on the end surface of the case body 70 and a bottom surface portion 81c continuously provided on the bottom surface of the case body 70 from the side surface portion 81b. These are integrally formed. Then, the light emitting element 85 is die-bonded onto the mount portion 81a of the first conductive pattern 81 by a conductive paste or the like.

The other second conductive pattern 82 provided in the first recess 71 is the mount portion 8 of the first conductive pattern 81.
1a is a bond portion 82a arranged on the bottom surface of the first recess 71 with an appropriate gap, and the end surface of the case body 70 is continuous with the bond portion 82a through the inner surface and the upper surface of the first recess 71. Side portion 82b provided on the
2b has a bottom surface portion 82c continuously provided on the bottom surface of the case body 70, and these are integrally formed by plating or the like. Then, the bond portion 82a of the second conductive pattern 82 and the light emitting element 85 are wire-bonded by a bonding wire 86 such as a gold wire.

One of the first conductive patterns 83 provided in the other second concave portion 72 passes through the mount portion 83a located on the bottom surface of the second concave portion 72 and the inner surface and the upper surface of the second concave portion 72, and the mount thereof. Case body 70 continuous to the portion 83a
Side portion 83b provided on the end surface of the
Bottom portion 8 continuously provided on the bottom surface of the case body 70
3c, and these are integrally formed by plating or the like. Then, the first conductive pattern 83
The light-receiving element 87 is die-bonded on the mount portion 83a of the device with a conductive paste or the like.

The other second conductive pattern 84 provided in the second recess 72 is the mount portion 8 of the first conductive pattern 83.
3a and a bond portion 84a arranged on the bottom surface of the second recess 72 with an appropriate gap therebetween, and an end surface of the case body 70 continuous with the bond portion 84a through the inner surface and the upper surface of the second recess 72. Side portion 84b provided on the
4b and a bottom surface portion 84c provided on the bottom surface of the case body 70 in a continuous manner, and these are integrally formed by plating or the like. Then, the second conductive pattern 8
The bonding portion 84a of No. 4 and the light receiving element 87 are wire-bonded by a bonding wire 88 such as a gold wire.

In the first recess 71 and the second recess 72,
Translucent resin bodies 74 and 75 for sealing the light emitting element 85 and the light receiving element 87 together with the bonding wires 86 and 88, respectively, are filled. The surface of each translucent resin body 74 and 75 has a concave portion 71 and 7
2 respectively, and the surface of each is flat.

The case body 70 has bottom surface portions 81c to 84c and side surface portions 81b to 84b of the conductive patterns 81 to 84 with respect to an electrode pattern of a predetermined printed wiring board.
Are soldered and mounted on the printed wiring board.

In such a photo interrupter, as shown in FIG.
As shown in FIG. 2, the light emitted from the light emitting element 85 and emitted from the translucent resin body 74 is reflected by the detected object 40 when the detected object 40 exists, and the second concave portion is formed. 7
The light enters the light-transmitting resin body 75 in 2 and is received by the light receiving element 87.

[0012]

In such a photo interrupter, the light emitted from the light emitting element 85 is omnidirectionally irradiated from the flat surface of the transparent resin body 74. . Therefore, when the detected object 40 is located at a distance from the light emitting element 85, the amount of light emitted from the light emitting element 85 and reflected by the detected object decreases, and as a result, The amount of light received by the light receiving element 87 decreases,
There is a possibility that the object to be detected cannot be detected. Further, since the light emitted from the translucent resin body 74 is dispersed on the surface thereof, the spot diameter of the light with which the object to be detected is irradiated becomes large. For this reason, when the detected object 40 is small, the amount of reflected light decreases, and the amount of light received by the light receiving element 87 decreases, which may make it impossible to detect the detected object.

The present invention solves such a problem, and an object thereof is to provide an optical semiconductor device which is excellent in directivity of light and is easy to manufacture.

[0014]

In the optical semiconductor device of the present invention, a pair of recesses opening in the same direction are arranged in parallel, and a case body made of an insulating light-shielding resin and each recess are provided. A conductive pattern provided in each recess so as to extend from the inner surface of the case to the outer surface and the bottom surface of the case body, and die-bonded on one conductive pattern in one recess to the other conductive pattern in the recess. The wire-bonded light-emitting element and the light-receiving element die-bonded on one conductive pattern in the other recess and wire-bonded to the other conductive pattern in the recess, and the light-emitting element and light-receiving element in each recess And a translucent resin body which is filled so as to be sealed and has a hemispherically projecting lens portion on the surface of each recess on the opening side.

The bottom surface of each recess is provided with a through hole for filling each recess with a transparent resin.

The inner surface of each recess is inclined so that the opening side is widened, and the lens portion of each translucent resin body is
Secondary molding is performed by a secondary molding die fixed on the inclined surface.

Alternatively, a step portion that spreads outward is formed on the inner surface of each of the recesses, and the lens portion of each of the translucent resin bodies is fixed by a secondary molding die fixed by the inclined surface thereof. Each is secondary molded.

An optical semiconductor device according to a fifth aspect of the present invention is provided with a concave portion which is opened on the surface, and is formed of an insulating light-shielding resin, and a case body is formed from the inner surface of the concave portion. A pair of conductive patterns provided in the recess so as to cover the outer surface and the bottom surface, and a light emitting element or a light-receiving element that is die-bonded on one conductive pattern in the recess and wire-bonded to the other conductive pattern in the recess. An element and a translucent resin that is filled so as to seal the light emitting element or the light receiving element in the concave portion and has a hemispherically projecting lens portion on the surface of the concave portion on the opening side. It is characterized by

The bottom surface of the recess is provided with a through hole for filling the recess with a transparent resin.

The inner surface of the recess is inclined so that the opening side is widened, and the lens portion of the translucent resin body is secondarily molded by a secondary molding die fixed by the inclined surface. .

Alternatively, a step portion that spreads outward is formed on the inner surface of each of the recesses, and the lens portion of the translucent resin body is formed by a secondary molding die fixed by the inclined surface thereof. Next molded.

In the optical semiconductor device according to the first aspect of the present invention, the light emitted from the light emitting element is irradiated onto the object to be detected while being condensed by the lens portion of the translucent resin body. The reflected light is collected by the lens portion of the translucent resin body filled in the other concave portion and received by the light receiving portion.

The translucent resin body in each recess is filled from the through hole provided in the bottom surface of each recess. The lens portion of each translucent resin body is secondarily molded by a secondary molding die fixed to the inclined surface or the step portion of each recess.

According to another aspect of the optical semiconductor device of the present invention, the light emitted from the light emitting element or the light received by the light receiving element is collected by the lens portion of the transparent resin body. Become.

The translucent resin body in the recess is filled through a through hole provided in the bottom surface of the recess. The lens portion of the translucent resin body is secondarily molded by a second molding die fixed to the inclined surface of the concave portion or the step portion.

[0026]

Embodiments of the present invention will be described below in detail with reference to the drawings.

FIG. 1 is a perspective view showing an example of the optically coupled semiconductor device of the present invention, FIG. 2 is a sectional view taken along line AA of FIG.
3 is a sectional view taken along line BB of FIG. 1, and FIG. 4 is C of FIG.
It is sectional drawing in the -C line.

This optically coupled semiconductor device has a rectangular parallelepiped insulating case body 10. This case body 10
Is made of a light-shielding resin such as a liquid crystal polymer resin, and has a top surface 15 and a bottom surface 17, a pair of side surfaces 16 and 18 extending along the longitudinal direction, and end surfaces 14 and 19. The case body 10 is provided with a pair of a first recess 11 and a second recess 12 each having a square opening 11a and 12a in the upper surface 15. Further, a partition 13 is formed between the recesses 11 and 12. As shown in FIGS. 2 to 4, the bottom surfaces 11b and 12b of the recesses 11 and 12 have a square shape smaller than that of the openings 11a and 12a.
1 and 12 have an inverted quadrangular pyramid shape. Therefore, the inner surfaces 11c and 11d along the side surfaces 16 and 18 of the recess 11, the inner surface 11e along the end surface 14,
The inner surface 11f along the partition wall portion 13 is inclined so that the side of the opening 11a is widened, and the inner surfaces 12c and 12 along the side surfaces 16 and 18 of the recess 12 are respectively formed.
d, the inner surface 12e along the end surface 19, and the inner surface 12f along the partition wall portion 13 are also inclined so that the opening 12a side expands.

A pair of conductive patterns 2 is formed in the first recess 11.
1 and 22 are provided, and the second recess 12 is also provided with a pair of conductive patterns 23 and 24.

FIG. 5 is a plan view of the case body 10, and FIG. 6 is a bottom view thereof. As shown in FIGS. 1 to 6, one of the first conductive patterns 21 provided in the first recess 11 has a first
It has a side surface portion 21 a that covers the end surface 14 of the case body 10 close to the recess 11. This side surface portion 21a is a side surface 16
The side part of the end face 14 close to the
The lower end portion is continuous with the bottom surface portion 21b that covers a part of the bottom surface 17 of the case body 10. Further, the upper end portion of the side surface portion 21a is continuous with the upper surface portion 21c that covers the upper surface 15 of the case body 10 located above the end surface 14 and the side surface 16, respectively. The upper surface portion 21c covers the upper surface 15 located above the side surface 16 except for the vicinity of the partition wall portion 13.

The upper surface portion 21c of the first conductive pattern 23 is
The inner surface 11c of the first recess 11 along the side surface 16 is continuous with a connecting portion 21d that vertically covers the inner surface 11c. This connecting portion 21d
Has an appropriate space from the inner surface 11e along the end surface 14, and its lower end portion is continuous with the mount portion 21e that covers the bottom surface 11b of the recess 11. The mount portion 21e is
The inner surface 11f along the partition wall portion 13 is provided with an appropriate gap. The tip of the mount portion 21e reaches the vicinity of the inner surface 11d that faces the inner surface 11c of the recess 11 provided with the coupling portion 21d.

The other second conductive pattern 22 provided in the first concave portion 11 is arranged symmetrically with respect to the first conductive pattern 21 in the first concave portion 11, and the side surface portion 21 a of the first conductive pattern 21. A side surface portion 22a that covers the end surface 14 of the case body 10 at an appropriate interval. The side surface portion 22a vertically covers a side portion of the end surface 14 close to the side surface 18, and a lower end portion of the side surface portion 22a has a lower end portion.
Is continuous with a bottom surface portion 22b that covers a part of the bottom surface 17 of the.
Further, the upper end of the side surface portion 22 a is the end surface 1 of the case body 10.
4 and the upper surface portion 22c that covers the upper surface 15 located above the side surface 18 that is continuous with the end surface 14, respectively. The upper surface portion 22c is formed on the upper surface 15 along the side surface 18.
Is covered with the exception of the vicinity of the partition wall portion 13.

A portion of the upper surface portion 22c close to the partition wall portion 13 is continuous with a connecting portion 22d which covers the inner surface 11d of the first recess 11 in the vertical direction. The lower end of this connecting portion 22d is
It is continuous with the bond portion 22e that covers the bottom surface 11b of the first recess 11. The bond portion 22e covers the bottom surface 11b of the first recess 11 with a proper gap from the mount portion 21e of the first conductive pattern that covers the bottom surface 11b.

The first conductive pattern 23 and the second conductive pattern 24 provided in the second recess 12 are symmetrical with respect to the first conductive patterns 21 and 22 of the first recess 11 with the partition wall 13 interposed therebetween. And the first conductive pattern 23 provided in the second concave portion 12 has the side surface portion 23.
a, a bottom surface portion 23b, a top surface portion 23c, a connecting portion 23d, and a mount portion 23e, the second conductive pattern 24 is
Side surface portion 24a, bottom surface portion 24b, upper surface portion 24c, connecting portion 2
4d and the bond part 24e.

The conductive patterns 21 and 22 provided in the first recess 11 and the conductive patterns 23 and 24 provided in the second recess 12 are integrally formed by plating.

A light emitting element 31 formed of a light emitting diode or the like is die-bonded to the mount portion 21e of the first conductive pattern 21 provided in the first recess 11 by a conductive paste or the like, and the upper surface of the light emitting element 31 is formed. When,
The bonding portion 22e of the second conductive pattern 22 is wire-bonded with the bonding wire 32 formed of a gold wire or the like.

A light receiving element 33 composed of a photodiode or the like is die-bonded to the mount portion 23e of the first conductive pattern 23 provided in the second recess 12 by a conductive paste or the like, and the upper surface of the light receiving element 33 is formed. And the bonding portion 24e of the second conductive pattern 24 are wire-bonded by a bonding wire 34 made of a gold wire or the like.

On the bottom surface 17 of the case body 10, the first recess 1 is formed.
A through hole 17a communicating with the inside of the first recess 1 and a through hole 17b communicating with the inside of the second recess 12 are provided respectively.

A transparent resin body 35 is filled in the first recess 11 of the case body 10. This translucent resin body 35
Is made of a thermosetting resin such as epoxy resin, and seals the light emitting element 31 and the bonding wire 32 provided in the first recess 11. The lens portion 3 protruding upward in a hemispherical shape is provided on the upper portion of the transparent resin body 35.
5a is provided. The lens portion 35a is provided so as not to project upward from the upper surface 15 of the first concave portion 11 in a state in which the center is located slightly above the light emitting element 31 and closer to the second concave portion 12, and the lens portion 35a is excluded. The upper surface of the translucent resin body 35 is flat.

The translucent resin body 35 is filled from the through hole 17a provided in the bottom surface 17 of the case body 10, and the lens portion 35a is fitted in the upper portion of the first recess 11. Secondary molding is performed using a secondary molding die. The secondary molding die has an inclined inner surface 11c in the first recess 11.
It is designed to be installed in a fixed state by ~ 11f.

A transparent resin body 36 made of a thermosetting resin such as an epoxy resin is also filled in the second recess 12 of the case body 10. This translucent resin body 36 is
The light receiving element 33 and the bonding wire 34 provided in the second recess 12 are sealed. Translucent resin body 36
A lens portion 36a protruding upward in a hemispherical shape is provided on the upper part of the. The lens portion 36a is provided on the light receiving element 33.
Is provided so as not to project upward from the upper surface 15 of the second concave portion 12 in a state in which the center is located slightly above the first concave portion 11 and the upper surface of the translucent resin body 36 excluding the lens portion 36a is It is flat.

The transparent resin body 36 is also filled from the through hole 17b provided in the bottom surface 17 of the case body 10, and the lens portion 36a is fitted in the upper portion of the second recess 12. Secondary molding is performed using a secondary molding die. The secondary molding die has an inclined inner surface 12c in the second recess 12.
It is designed to be installed in a fixed state by ~ 12f.

The translucent resin bodies 35 and 36 are provided on the bottom surface 17 of the case body 10 with the secondary molding dies installed and fixed in the recesses 11 and 12 of the case body 10. It is molded by being simultaneously filled from the respective through holes 17a and 17b. Lens part 35a
And 36a are each made of 2 by the secondary molding die.
Next molded.

The optical coupling semiconductor device having such a structure is mounted on a printed wiring board or the like, and the bottom surface 1 of the case body 10 is mounted.
Bottom part 21 of each conductive pattern 21-24 provided in 7
b to 24b and side surface portions 21a to 24a provided on the respective end surfaces 14 and 19 of the case body 10 are soldered to an electrode pattern of a printed wiring board or the like and mounted on the printed wiring board.

The optically coupled semiconductor device mounted on a printed wiring board or the like is used for confirming the existence of an object to be detected, and the light emitted from the light emitting element 31 is transmitted through the transparent resin body 3.
The light passes through the lens portion 35a of No. 5 and is emitted from the transparent resin body 35 in a condensed state. As shown in FIG. 2, when the object 40 to be detected is present, the light emitted from the light-transmissive resin 35 is reflected by the object 40 and the light-transmissive resin 36 on the light receiving side. Is radiated into the inside of the lens part 36a. Then, the light is received by the light receiving element 33 in a state of being condensed by the lens portion 36a.

In this case, the light emitted from the light emitting element 31 is reflected by the object to be detected 40 while being collected by the lens portion 35a of the transparent resin body 35, and further, the transparent resin on the light receiving side. Since the light is received by the light receiving element 33 in a state of being collected by the lens portion 36a of the body 36, the incidence efficiency of light on the light receiving element 33 is dramatically improved. As a result, even if the distance from the optically coupled semiconductor device to the detected object 40 becomes long, the presence of the detected object 40 can be reliably detected.

The light emitted from the light emitting element 31 is
Since the detected object 40 is irradiated with the condensed light by the lens portion 35a of the transparent resin body 35, the detected object 40
Even if the upper light spot diameter becomes smaller and the detected object 40 becomes smaller, its presence can be reliably detected. Since the lens portions 35a and 36a are formed by the secondary molding of the translucent resin bodies 35 and 36, the light emitting element 3 is formed.
1 and the light receiving element 33 are not displaced,
Placed with high precision.

The lens portions 35a and 36a of the translucent resin bodies 35 and 36 are injected with the translucent resin at the same time from the through holes 17a and 17b provided in the bottom surface 17 of the case body 10. Since it is molded by the secondary molding using a mold, it is excellent in workability and economical because the number of parts does not increase.

By cutting such an optically coupled semiconductor device along the partition 13 at the center of the partition 13, the light emitting semiconductor device and the light receiving semiconductor device of the present invention can be obtained.

FIG. 7 is a vertical sectional view showing another example of the optically coupled semiconductor device of the present invention, and FIG. 8 is a sectional view taken along the line DD of FIG. This optically coupled semiconductor device has a transparent resin body 3
The first recess 11 in the case body 10 for positioning the secondary molding die for forming the lens portion 35a
Steps 1 that spread horizontally outward on the inner surfaces 11c to 11f of the
1g is provided all around. Similarly, in order to position the secondary molding die for forming the lens portion 36a of the translucent resin body 36, the inner surface 12c of the second recess 12 is formed.
Also, a step portion 12g that horizontally spreads outward is provided on all of the outer surfaces 12f to 12f.

The connecting portion 2 along the inner surface 11c of the recess 11 in the first conductive pattern 21 provided in the first recess 11.
1d is in a state of covering the step portion 11g,
The connecting portion 22d of the conductive pattern 22 along the inner surface 11d of the recess 11 also covers the step portion 11g. First conductive pattern 23 provided in second recess 12
23d along the inner surface 12c of the recess 12 in
And the inner surface 12 of the recess 12 in the second conductive pattern 24.
The connecting portion 24d along the line d also covers the step portion 12g. The other structure is similar to that of the above-mentioned embodiment.

In the optically coupled semiconductor device according to the present embodiment, the step portions 11g and 12g of the recesses 11 and 12 cause
Since the secondary molding dies are respectively positioned, the inner surfaces 11c to 11f and 12c of the recesses 11 and 12 are positioned.
There is no risk of damaging the 12f, and the lens portions 35a and 36a of the respective transparent resin bodies 35 and 36 are aligned with the light emitting element 31 and the light receiving element 33 with high accuracy.

In each of the above embodiments, the transparent resin body 3
Although the lens parts 35a and 36a of 5 and 36 are provided so as not to protrude from the recesses 11 and 12 of the case body 10, as shown in FIG. The projection 13a made of a light-shielding resin is provided over the entire surface, and the translucent resin bodies 35 and 36 filled in the recesses 11 and 12 are projected above the case body 10. The lens portions 35a and 36a may be secondarily molded above the stage 10 by a second molding die.
In this case, the upper surface of the protrusion 13a is in a state of protruding above the respective lens portions 35a and 36a, and the light emitted from the light emitting element 31 and emitted from the lens portion 35a is directly on the light receiving side. It does not enter the lens portion 36a.

Each side surface 13b and 13c of the protrusion 13a
Is a state in which the upper end of the protrusion 13a is inclined so as to be tapered, and 2 for molding the lens portions 35a and 36a by the inclined side surfaces 13b and 13c.
The secondary molding dies are each positioned and fixed.

The optically coupled semiconductor device of each of the above embodiments is manufactured using, for example, the substrate 50 shown in FIG. The substrate 50 is made of an insulating light-shielding resin and is called an MID (Molded Interconnection Device) substrate. The substrate 50 has a large number of recesses 51 formed in a matrix. Through holes are provided on the bottom surface of each recess 51. Each of the recesses 51 is a set of two aligned in the vertical direction, and elongated holes 53 extending in the horizontal direction are linearly provided between adjacent sets at appropriate intervals. Each of the long holes 53 has such a length as to extend between the respective side portions of a pair of recesses 51 that are laterally adjacent to each other, and is in a state of penetrating both sides.

A set of each recess 51 corresponds to the first recess 11 and the second recess 12 of the optically coupled semiconductor device, respectively, and a pair of conductive patterns 54 and 55 are provided in each recess 51.
Are formed by plating. In this case, one conductive pattern 54 is integrally formed with the conductive pattern 55 of the recess 51 that is adjacent in the lateral direction. Each of the conductive patterns 54 and 55 reaches the bottom surface of the substrate 50 through the inner peripheral surface of the elongated hole 53. Each conductive pattern 54 and 5
5 corresponds to the first conductive pattern 21 or 23 and the second conductive pattern 22 or 24 of the optically coupled semiconductor device, respectively.

After that, the light emitting element is die-bonded on one of the first conductive patterns of the one set of recesses 51 and wire-bonded to the second conductive pattern, and the other recess 5 is formed.
The light-receiving element is die-bonded on the first conductive pattern and wire-bonded to the second conductive pattern.

Next, with the secondary molding die for molding the lens portion set in each recess 51, the translucent resin is simultaneously filled through the through holes provided in each recess 51. Then, the translucent resin filled in each recess 51 is subjected to the secondary molding of the lens portion by the secondary molding die to form the translucent resin body. After that, each of the two recesses 51 is 1
As shown in FIG. 10, the VV line, the WW line, and the X line shown in FIG.
-Cut along the X-ray, YY line, and ZZ line. As a result, the optically coupled semiconductor device of each of the above embodiments is manufactured.

The light-emitting semiconductor device and the light-receiving semiconductor device of the present invention are respectively formed by further cutting each manufactured optical-coupled semiconductor device into each recess.

[0060]

As described above, the optical semiconductor device of the present invention has the following features.
The light emitted from the light emitting element is emitted while being condensed by the lens portion of the transparent resin body, and the light received by the light receiving element is also condensed by the lens portion of the transparent resin body. To be in a state. As a result, the directivity of the light is excellent, and the light emitted from the light emitting element can be irradiated in a condensed state over a long distance, and the amount of light received by the light receiving element is significantly increased. In the optically coupled semiconductor device in which the light emitting element and the light receiving element are integrated, it is possible to reliably detect a small object to be detected that is far away.

Since the through hole is provided in the bottom surface of the concave portion, the lens portion is formed by the secondary molding die that is filled with the transparent resin through the through hole and fixed to the inclined inner surface of the concave portion or the step portion. The transparent resin body having a lens portion can be formed accurately and efficiently.

[Brief description of drawings]

FIG. 1 is a perspective view showing an example of an optically coupled semiconductor device of the present invention.

FIG. 2 is a sectional view taken along line AA of FIG.

FIG. 3 is a sectional view taken along line BB in FIG.

4 is a cross-sectional view taken along the line CC of FIG.

FIG. 5 is a plan view of a case body used for the optically coupled semiconductor device.

FIG. 6 is a bottom view of the case body.

FIG. 7 is a vertical cross-sectional view showing another example of the optically coupled semiconductor device of the present invention.

FIG. 8 is a sectional view taken along line DD of FIG. 7;

FIG. 9 is a perspective view showing another example of the optically coupled semiconductor device of the present invention.

FIG. 10 is a perspective view showing an example of a process of manufacturing the optically coupled semiconductor device of the present invention using an MID substrate.

FIG. 11 is a perspective view showing an example of a conventional optically coupled semiconductor device.

FIG. 12 is a sectional view taken along line EE of FIG. 11;

13 is a cross-sectional view taken along the line FF of FIG.

14 is a cross-sectional view taken along the line GG of FIG.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 10 Case body 11 1st recessed part 12 2nd recessed part 13 Partition wall 17 Bottom surface 17a Through hole 17b Through hole 21 1st conductive pattern 22 2nd conductive pattern 31 Light emitting element 32 Bonding wire 33 Light receiving element 34 Bonding wire 35 Translucent resin body 35a Lens part 36 Translucent resin body 36a Lens part

Claims (8)

[Claims] 1. A pair of recesses that are open in the same direction are arranged side by side, and a case body made of an insulative light-shielding resin extends from the inner surface of each recess to the outer surface and the bottom surface of the case body. , A conductive pattern provided with a pair in each recess, a light-emitting element die-bonded on one conductive pattern in one recess and wire-bonded to the other conductive pattern in the recess, and in the other recess The light receiving element is die-bonded on one of the conductive patterns and wire-bonded to the other conductive pattern in the recess, and the light emitting element and the light receiving element in each recess are filled so as to seal the recess. An optical semiconductor device, comprising: a translucent resin body having a lens portion protruding in a hemispherical shape on the surface of the opening portion side thereof. 2. The optical semiconductor device according to claim 1, wherein the bottom surface of each recess is provided with a through hole for filling each recess with a transparent resin. 3. The inner surface of each of the recesses is inclined so that the opening side is widened, and the lens portion of each of the light-transmissive resin bodies is respectively formed by a secondary molding die fixed on the inclined surface. The optical semiconductor device according to claim 2, which is secondarily molded. 4. A step portion that spreads outward is formed on the inner surface of each of the recesses, and the lens portion of each of the translucent resin bodies is formed by a secondary molding die fixed at the step portion. The optical semiconductor device according to claim 2, each of which is secondarily molded. 5. A recess having an opening on the surface is provided,
A case body made of an insulative light-shielding resin, a pair of conductive patterns provided in the recess so as to extend from the inner surface of the recess to the outer surface and the bottom surface of the case body, and one conductive pattern in the recess. The light emitting element or the light receiving element die-bonded to the other conductive pattern in the recess and the light emitting element or the light receiving element in the recess are filled so as to seal the opening of the recess. An optical semiconductor device comprising: a light-transmitting resin having a lens portion protruding in a hemispherical shape on a side surface thereof. 6. The optical semiconductor device according to claim 5, wherein the bottom surface of the recess is provided with a through hole for filling the recess with a transparent resin. 7. The inner surface of the recess is inclined so that the opening side is widened, and the lens portion of the translucent resin body is subjected to secondary molding by a secondary molding die fixed by the inclined surface. The optical semiconductor device according to claim 6. 8. A step portion that spreads outward is formed on the inner surface of each of the recesses, and the lens portion of the translucent resin body is formed by a secondary molding die fixed by the inclined surface thereof.
The optical semiconductor device according to claim 6, which is molded next.