JP3437709B2 - Three-dimensional wiring type optical coupling device and reflection type optical coupling device - Google Patents

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a three-dimensional wiring type optical coupling device and a reflection type optical coupling device which are composed of three-dimensional wiring and mount a surface mounting type optical coupling element.

[0002]

2. Description of the Related Art As a conventional reflection type optical coupling device, for example, as shown in FIG. 5, a light emitting element 10 is provided on the bottom surface of two recesses of a three-dimensional wiring member 101 made of resin-molded light-impermeable resin.
It is generally known that the light emitting element 102 and the light receiving element 103 are respectively arranged and the light emitting element 102 and the light receiving element 103 are sealed with a light transmissive resin 104.

The optical signal output from the light emitting element 102 of the reflection type optical coupling device is a reflection plate (aluminum vapor deposition surface, white paper, white plastic, etc.) installed above the device.
The light is reflected by 105 and propagates to the light receiving element 103.

FIGS. 6 (a) and 6 (b) are views showing a concrete structure of the conventional reflection type optical coupling device, FIG. 6 (a) is a perspective view thereof, and FIG. 6 (b) is a sectional view thereof. Is.

This reflection type optical coupling device is provided with a light impermeable three-dimensional wiring member 201 which is resin-molded so as to have two concave portions on the same surface. Then, two electrode wirings 202, 203 and 204, 205 are laid with a multi-plated layer in the two concave portions of the three-dimensional wiring member 201, respectively.

These electrode wirings 202, 203 and 204,
Reference numeral 205 denotes a three-dimensional wiring member 20 as shown in FIG.
One of the electrode wirings 20 is laid from a part of the back surface of the concave portion 1 to the bottom surface through the outer wall and the inner wall of the concave portion.
2, 204 are laid on the bottom surface of the recess with an area large enough to mount the element chip, and the other electrode wiring 203,
205 is laid in such an area that a wire can be connected to the surface electrode of the element chip.

A light emitting element 206 and a light receiving element 207 are mounted on the electrode wirings 202 and 204 as the element chips by a conductive adhesive (Ag paste) 207a. The surface electrode of the light emitting element 206 is connected to the electrode wiring 203 via the bonding wire 208, and the surface electrode of the light receiving element 207 is the bonding wire 2
It is connected to the electrode wiring 205 via 09. This wire bonding is performed by using, for example, a nail head method, and the contacts with the surface electrodes of the light emitting element 206 and the light receiving element 207 are used as the first bonding portion, and the contacts with the electrode wirings 203 and 205 are used as the second bonding portion. It is a thing.

Then, each recess of the three-dimensional wiring member 201 is
It is sealed with a light transmissive resin 210.

[0009]

However, the reflection type optical coupling device having the structure shown in FIG. 6 has the following problems.

(1) Surface electrodes of chips 206 and 207 and electrode wiring 20 of plating using bonding wires
3 and 205 are connected to each other, but the wire loop (the second bonding portion) is located on the lower side by the height of the chip, and therefore the wire loop becomes extremely high (about twice the chip thickness: About 0.6 mm). Since the bonding tool is lowered onto the second bonding portion with such a high loop, the second bonding portion requires a relatively large area. In addition, the distance from the second bonding portion to the edge of the chip naturally increases. For this reason, there is a limit in terms of reduction with respect to the reflection type optical coupling device that requires a small size. Further, when the chips 206 and 207 are sealed, a light-transmissive resin is injected. However, depending on the injection amount, the central portion of the recess may be dented due to surface tension. If it is high, the bonding wire may be exposed.

(2) Due to variations in the plating range and the like, especially when the area of the second bonding portion in the electrode wirings 203 and 205 becomes extremely small, the bonding tool cannot be moved down, or even if it can be moved down, the position adjustment is performed. I needed it. As a result, the yield of product assembly is deteriorated, and the cost for adjustment time due to assembly adjustment is high.

(3) If the gap between the plated portions on the bottom surface of the recess, that is, the gap between the electrode wiring on the mount side and the electrode wiring on the second bonding portion side is narrow, the voltage applied to the chip during actual use may cause In some cases, a phenomenon in which Ag atoms of the Ag paste used for mounting are ionized and move along with an electric field (Ag migration). That is, in the case of electrode separation on the same bottom surface, a bias voltage is often applied to the light receiving element 207 in particular, and for example, a bias voltage is applied to the light receiving element 207 on the Ag paste 207a where moisture has penetrated for a long time. As a result, Ag ions are released, and both electrode wirings 2
There was a risk of a short circuit between 04 and 205.

The present invention has been made in order to solve the above-mentioned conventional problems, and an object thereof is to reduce the loop of the bonding wire to prevent its exposure and to realize a three-dimensional wiring capable of downsizing. Type optical coupling device and reflective type optical coupling device. Another object of the present invention is to provide a three-dimensional wiring type optical coupling device and a reflection type optical coupling device which can reduce the cost and improve the yield of product assembly by eliminating the need for adjusting the bonding position. Further, another object is to provide a three-dimensional wiring type optical coupling device and a reflection type optical coupling device which can avoid occurrence of defects due to migration.

[0014]

In order to achieve the above object, the features of the three-dimensional wiring type optical coupling device of the first invention are as follows.
A three-dimensional wiring member in which bonding electrode wiring is directly provided on the surface of a light-impermeable member formed by resin molding and having at least one recessed portion on the same surface, and light emission disposed on the bottom surface of the recessed portion. In the three-dimensional wiring type optical coupling device comprising an element or a light receiving element, the surface electrode of the light emitting element or the light receiving element and the bonding electrode wiring are connected by a bonding wire, and sealed with a light transmitting resin, A step portion is provided on at least one inner wall side surface of the recess portion, and the bonding electrode wiring is extended through the inner wall side surface of the recess portion through the horizontal surface of the step portion and further extending to a midpoint of the vertical surface of the step portion, and a surface electrode of the bonding electrode wire and the light emitting element or the light receiving element on a horizontal surface of the step portion are connected by a bonding wire, before
In the bonding electrode wiring, the thickness of the step is set to 1
If you do, from the upper end of the step, from 1/4 to 3/4
That is , it extends along the vertical surface of the step portion to the range of .

According to the first aspect of the invention, since the second bonding is performed on the step portion, the loop of the bonding wire becomes lower than in the conventional case, and the wire is prevented from being exposed. Further, the distance from the second bonding portion to the end of the chip is shortened and the device can be downsized. In addition, since the bonding electrode wiring extends through the side surface of the inner wall of the recess through the horizontal surface of the step portion and further extends to the middle of the vertical surface of the step portion, the area of the second bonding portion is enlarged and the bonding position adjustment is unnecessary. Becomes Also, the bonding electrode
If the thickness of the step portion is 1, the wiring is
From the upper end to within the range of 1/4 to 3/4
Since it is extended along the vertical surface of the
It is possible to improve the adhesion of the end plating
And migration can be avoided.

A feature of the three-dimensional wiring type optical coupling device of the second invention is that, in the first invention, the three-dimensional wiring member includes the bonding electrode wiring and a mounting electrode electrically insulated from the bonding electrode wiring. Wirings are provided directly on the surface of the light opaque member, and a light emitting element or a light receiving element is mounted with a conductive adhesive on the mounting electrode wiring on the bottom surface of the recess of the light opaque member. It is in.

According to the second aspect of the present invention, the electric field between the bonding electrode wiring and the mounting electrode wiring on the step portion is not in the horizontal direction, so that migration can be avoided.

[0018]

[0019]

A third aspect of the reflective optical coupling device of the present invention is that the first and second concave portions are formed on the same surface with respect to the surface of the light opaque member formed by resin molding. And a three-dimensional wiring member formed by directly providing first and second bonding electrode wirings respectively corresponding to the second and second recesses, and a light emitting element and a light receiving element respectively disposed on the bottom surfaces of the first and second recesses. And the surface electrodes of the light emitting element and the light receiving element and the first and second bonding electrode wirings are respectively connected by bonding wires, and the first and second recesses are sealed with a light-transmissive resin. In the reflection type optical coupling device for reflecting the output light of the light emitting element to the external reflection plate and propagating it to the light receiving element, the first recess is provided with a first step portion on at least one inner wall side surface. , The first The bonding electrode wiring, and Shin設 to the middle of the vertical surface of the stepped portion of the further first through a horizontal plane of the first step portion through the inner wall side surface, and the first
The first bonding electrode wiring on the horizontal surface of the step portion and the surface electrode of the light emitting element are connected by a bonding wire, and the second recess is formed on at least one inner wall side surface of the second step portion. The second bonding electrode wiring is extended through the side surface of the inner wall, through the horizontal surface of the second step portion, to a midpoint of the vertical surface of the second step portion, and The second bonding electrode wiring on the horizontal surface of the step portion and the surface electrode of the light receiving element are connected by a bonding wire to form the first and second bonding wires.
The electrode wiring for bonding is formed on the first and second step portions.
When the thickness is 1, the thickness of each of the first and second step portions is increased.
From the edge, within the range of 1/4 to 3/4
It lies in that they were extended along the vertical plane .

According to the third aspect of the invention, the second bonding is performed on the first and second step portions, so that the first and second steps are performed.
The loop of the bonding wire becomes lower in the concave portion than in the conventional case, and the wire is prevented from being exposed. Furthermore, the second
The distance from the bonding portion to the end of each chip is also shortened, and the device can be downsized. Furthermore, the first and second
The area of the second bonding portion is enlarged in the concave portion, and the bonding position adjustment is unnecessary. Also bonde
If the thickness of the step is 1
Range from 1/4 to 3/4 from the top of the step
Since it was extended to the inside along the vertical surface of the step,
The plating area can be expanded and the end is plated.
It is possible to improve the adhesion and to avoid migration.

The reflection-type optical coupling device according to the fourth invention is characterized in that in the third invention, the three-dimensional wiring member is electrically insulated from the first and second bonding electrode wirings. And the first and second mounting electrode wirings are directly provided on the surface of the light opaque member, and the first mounting electrode wiring on the bottom surface of the first recess is formed by a conductive adhesive. While mounting the light emitting element on the top,
The light receiving element is mounted on the second mounting electrode wiring on the bottom surface of the second recess.

According to the fourth aspect of the invention, since the electric field direction between the bonding electrode wiring and the mounting electrode wiring is not horizontal in the first and second recesses, migration can be avoided.

[0024]

BEST MODE FOR CARRYING OUT THE INVENTION Embodiments of the present invention will be described below with reference to the drawings. 1A, 1B, and 1C are diagrams showing the configuration of a three-dimensional wiring type optical coupling device according to a first embodiment of the present invention, and FIG. 1A is a top perspective view of the same. FIG. 2B is a rear perspective view, and FIG. 1C is a cross-sectional view of the light receiving element side.

In this three-dimensional wiring type optical coupling device, a light-impermeable member (eg LCP:
A three-dimensional wiring member 1 mainly composed of a liquid crystal polymer is provided. The three-dimensional wiring member 1 has two recesses 1 on the same surface.
The recesses 1a and 1b are formed, and the stepped portions 1c and 1d are provided on one of the inner wall side surfaces of the recesses 1a and 1b, respectively, and the four corners of the rear surface (solder mounting electrodes: see FIG. 1B) Multi-plated layer (Cu underlayer / intermediate N)
The electrode wirings 2, 3 and 4, 5 (i / surface Au) are laid inside the recesses 1a and 1b, respectively. Here, the height of the step portions 1c and 1d is set to be substantially equal to the height of the chip, for example, and the area of the horizontal plane is such that it does not hinder the wire bonding described later.

That is, the electrode wirings 3 and 5 have
The electrode wirings 2 and 4 extend through the horizontal surface of the step portions 1c and 1d through the side surfaces of the inner wall portions a and 1b, and further extend to the middle of the vertical surface of the step portions 1c and 1d. Via the bottom of each recess 1a, 1b
On the bottom surface, the area is large enough to mount a chip.

Further, a light emitting element (for example, infrared light emitting diode) 6 and a light receiving element (for example, phototransistor) 7 serving as the chips are respectively formed on the electrode wirings 2 and 4 on the bottom surfaces of the recesses 1a and 1b by a conductive adhesive ( Ag paste) 7a
Mounted by. The surface electrode of the light emitting element 6 is connected to the electrode wiring 3 on the horizontal surface of the step portion 1c via the bonding wire 8, and the surface electrode of the light receiving element 7 is connected to the electrode wiring 5 on the horizontal surface of the step portion 1d via the bonding wire 9. It is connected to the.

The recesses 1a, 1 of the three-dimensional wiring member 1 are
b is sealed with a light transmissive resin (eg, epoxy resin) 10.

Next, a method of assembling the optical coupling device having the above structure will be described.

First, in order to manufacture the three-dimensional wiring member 1, first, for example, LCP is injected into a mold, and two recesses 1a,
A light-impermeable member having a shape including 1b and the step portions 1c and 1d is formed. Then, electrode wirings 2 to 5 are laid on the surface of this light opaque member by a normal plating process to form a three-dimensional wiring circuit. In order to make the plating range (masking) suitable for the optical sensor at this time, as described above, the electrode wirings 3 and 5 among the electrode wirings 2 to 5 routed from the back surface are the recesses 1
After passing through the side surfaces of the inner walls of a and 1b, passing through the horizontal surfaces of the stepped portions 1c and 1d, and reaching the middle of the vertical surface, the electrode wiring 2,
4 is set so as to reach the middle of the bottom surface of each recess 1a, 1b through the inner wall side surface on the opposite side.

Further, in order to mass-produce the three-dimensional wiring member 1, for example, one plate-shaped member in which light-impermeable members are arranged in a matrix is formed, and at the same time, a plating process is performed.

The three-dimensional wiring member 1 produced in this way
The light emitting element 6 and the light receiving element 7 are mounted on the electrode wirings 2 and 4 in the recesses 1a and 1b, respectively, with the Ag paste 7a.

After that, the surface electrode of the light emitting element 6 and the step portion 1
The electrode wiring 3 on c is connected via the bonding wire 8, and at the same time, the surface electrode of the light receiving element 7 and the electrode wiring 5 on the step portion 1d are connected via the bonding wire 9. This wire bonding is performed by using, for example, a nail head method, and the contact points with the surface electrodes of the light emitting element 6 and the light receiving element 7 are used as the first bonding section, and the contact points with the electrode wirings 3 and 5 are used as the second bonding section. It is a thing.

Then, the concave portions 1a, 1 of the three-dimensional wiring member 1 are formed.
By injecting, for example, the epoxy resin 10 into b and heating and solidifying it, the three-dimensional wiring type optical coupling device having the above structure is obtained.

When this device is constructed as a reflection type optical coupling device, as described in the example shown in FIG. 5, a reflection plate is provided outside and the output light from the light emitting element 6 is provided on the reflection plate. The light is reflected and propagated to the light receiving element 7.

This embodiment has the following advantages.

(1) Recess 1 at the time of wire bonding
Steps 1c and 1d provided on the side surfaces of the inner walls of a and 1b, respectively
Since the second bonding portion is provided on the electrode wirings 3 and 5 on the horizontal plane, the loop of the wire can be suppressed low (for example, about 0.2 mm). As a result, the height of the wire is 0.5 mm or less even when combined with the chip thickness, so that the wire can be prevented from being exposed.

(2) Since the bonding wire is stretched from the chip surface electrode of the first bonding portion to the horizontal surface of the step portion of the second bonding portion, when the wire is looped at an angle of 45 °, the length of the wire is It is possible to reduce the thickness by the chip thickness (0.3 mm), and as a result,
It is possible to reduce the size of the device.

(3) Even if a bias voltage is applied to the light receiving element 7, since the direction of the electric field between the electrode wiring 5 and the electrode wiring 4 on the step portion 1d is not horizontal, Ag of the Ag paste 7a is Ag.
The release of ions is less likely to occur, and the migration described above can be avoided.

(4) Connect the electrode wirings 3 and 5 to the recesses 1a and 1
Since the horizontal planes of the step portions 1c and 1d are passed through the side surface of the inner wall b, and the vertical surfaces of the step portions 1c and 1d are extended to the middle (see FIG. 2A), the assembly yield can be remarkably increased. it can.

The advantage of (4) will be specifically described below.

In a normal plating process, since the accuracy of the plating range is determined by the masking accuracy, it is impossible to secure a sufficient bonding area on the horizontal surfaces of the step portions 1c and 1d when the masking with an error is performed. Can also occur. Therefore, in order to secure a sufficient bonding area, it is conceivable to perform plating on the entire horizontal surface of the stepped portions 1c and 1d, but in this case, the adhesion of the plating near the edge becomes a problem, and the bonding failure occurs. Is afraid.

In order to avoid this, as shown in FIG. 2 (b), when plating is applied to the inner side leaving the edge of the step portion 1d, every time the second bonding is performed due to the variation in the position of the plated end. Position adjustment is required. Therefore, the workability is extremely poor and the cost increase due to the process time becomes remarkable.

On the other hand, in this embodiment, the step portion 1
Since the plating is applied through the horizontal planes of c and 1d and to the middle of the vertical plane, the adhesion of the plating at the ends is improved and the plating area of the stepped portions 1c and 1d on the horizontal plane is enlarged. There is no variation in the plating end position. This eliminates the need for bonding position adjustment, and is expected to reduce process work time by about 40%. Furthermore, migration is also avoided.

Here, depending on to which position on the vertical surface the plating is brought, if the thickness of the step portions 1c and 1d is 1, then 1 / from the upper end of the step portions 1c and 1d.
A range of 4 to 3/4 is suitable. In particular, if the plating tip is brought from the upper ends of the stepped portions 1c and 1d to the position of 3/4, migration is well avoided.

FIGS. 3 (a) and 3 (b) are views showing the structure of a three-dimensional wiring type optical coupling device according to a second embodiment of the present invention, and FIG. 3 (a) is a top perspective view and the same view. (B) is a rear perspective view, and elements common to those in FIG. 1 are denoted by the same reference numerals, and description thereof will be omitted.

The present embodiment shows an example in which the output on the light receiving side has multiple pins (the number of surface electrodes is large). If the outputs of multiple pins are arranged in a horizontal row, it is necessary to ensure a sufficient plating interval between adjacent bonding tools so that the bonding tool does not touch the adjacent wires during wire bonding, which hinders downsizing of the device. become. Therefore, by taking advantage of the structural characteristics of the present device, stepped portions are provided at various places in the recess and the bonding wires are separately punched, so that the multi-pin type can be downsized and mass productivity can be improved.

A specific structure will be described. In this optical coupling device, in the first embodiment, the light receiving IC 7 having three surface electrodes is used instead of the photodiode (light receiving element).
In this example, -1 is installed. This light receiving IC 7-1 is assumed to be of a type having no back electrode.

That is, three surface electrodes (power supply potential Vcc and intermediate potential Vcc) are formed on the bottom surface of the concave portion 1b of this optical coupling device.
o, the light receiving IC 7-1 having the ground potential GND) is directly mounted. In this concave portion 1b, three step portions 1d-1, 1d-2, 1d corresponding to the three surface electrodes are formed.
-3 is provided, and the step portions 1d-1 and 1d-2 are provided at respective corner portions of one inner wall side surface, and the step portion 1d-3 is provided on the other inner wall side surface.

Then, each stepped portion 1d-1, 1d-2, 1
Similarly to the above, d-3 is also laid from the horizontal plane to the vertical plane, and the electrode wiring 5- of the multiple plating layer is laid out from the back side of the device.
1, 5-2, 5-3 are laid respectively, and the light receiving IC 7-
Each surface electrode of No. 1 and the electrode wirings 5-1 to 5-3 on the horizontal plane of the stepped portions 1d-1 to 1d-3 are connected via bonding wires 9-1 to 9-3, respectively.

Also in the multi-pin type as in this embodiment, miniaturization can be realized and mass productivity can be improved, and the same advantages as those of the first embodiment can be enjoyed.

FIGS. 4A and 4B are views showing the structure of a three-dimensional wiring type optical coupling device according to the third embodiment of the present invention. FIG. 4A is a top perspective view of the same. (B) is a rear perspective view, and elements common to those in FIG. 1 are denoted by the same reference numerals, and description thereof will be omitted.

This embodiment also shows an example in which the output on the light receiving side is multi-pin (the number of surface electrodes is large), as in the second embodiment.

This optical coupling device is an example in which in the first embodiment, a light receiving IC 7-11 having four surface electrodes (a type having no back surface electrode) is installed in place of the photodiode (light receiving element). is there. This light receiving IC 7-11
For example, a light modulation type light receiving IC that senses only light of a certain constant frequency as a signal can be cited.

That is, the light receiving IC 7-11 having four surface electrodes is directly mounted in the concave portion 1b of this optical coupling device, and further four step portions 1d-11, corresponding to the four surface electrodes. 1d-12, 1d-13, 1d-14
Are provided in the four corners.

Then, the step portions 1d-11 to 1d-14
The electrode wirings 5-11 to 5-14 of the multi-plated layer drawn from the back side of the device are laid on the front surface of the device, respectively, and the front surface electrodes of the light receiving IC 7-11 and the step portion 1d-1.
The electrode wirings 5-1 to 5-4 on the electrodes 1 to 1d-14 are connected via bonding wires 9-1 to 9-4, respectively.

Also in the multi-pin type as in this embodiment, downsizing can be realized and mass productivity can be enhanced, and the same advantages as those of the first embodiment can be enjoyed.

[0058]

As described in detail above, according to the three-dimensional wiring type optical coupling device of the first invention, the loop of the bonding wire becomes lower than in the conventional case, and therefore the exposure of the bonding wire can be prevented. it can. Furthermore, since the distance from the second bonding portion to the edge of the chip is shortened, the device can be downsized. Further, since the area of the second bonding portion is enlarged, the bonding position adjustment is unnecessary. As a result, the cost can be reduced and the yield of product assembly can be improved. Also,
The thickness of the step portion of the bonding electrode wiring is 1
In the case of
Since it was extended along the vertical surface of the step to the range,
The area of the end can be expanded and the end
Improves the adhesion of the kick and avoids migration
It

According to the three-dimensional wiring type optical coupling device of the second invention, in addition to the same effect as the first invention, it is possible to avoid the occurrence of defects due to migration.

According to the reflection type optical coupling device of the third invention, the same effect as that of the first invention can be obtained.

According to the reflection type optical coupling device of the fourth invention, the same effect as that of the second invention can be obtained.

[Brief description of drawings]

FIG. 1 is a diagram showing a configuration of a three-dimensional wiring type optical coupling device according to a first embodiment of the present invention.

FIG. 2 is a diagram for explaining the plating range and the quality of wire bonding.

FIG. 3 is a diagram showing a configuration of a three-dimensional wiring type optical coupling device according to a second embodiment of the present invention.

FIG. 4 is a diagram showing a configuration of a three-dimensional wiring type optical coupling device according to a third embodiment of the present invention.

FIG. 5 is a diagram showing a function of a conventional reflection type optical coupling device.

FIG. 6 is a diagram showing a configuration of a conventional three-dimensional wiring type optical coupling device.

[Explanation of symbols]

1 Three-dimensional wiring member 1a, 1b recess 1c, 1d steps 1d-1 to 1d-3, 1d-11 to 1d-14 Step portion 2-5 electrode wiring 5-1-5-3 Electrode wiring 6 light emitting element 7 Light receiving element 7-1, 7-11 Light receiving IC 7a Ag paste 8,9 Bonding wire 9-1 to 9-3 Bonding wire 10 Light-transmissive resin

─────────────────────────────────────────────────── ─── Continuation of the front page (56) Reference JP-A-5-175553 (JP, A) JP-A-6-45636 (JP, A) JP-A-8-78457 (JP, A) JP-A-7- 15046 (JP, A) Actual Kaihei 7-7159 (JP, U) (58) Fields investigated (Int.Cl. ⁷ , DB name) H01L 31/12

Claims (4)

(57) [Claims] 1. A three-dimensional wiring member in which at least one recess is formed on the same surface and a bonding electrode wiring is directly provided on the surface of a light-impermeable member formed by resin molding, and a bottom surface of the recess. A three-dimensional wiring type light having a light emitting element or a light receiving element arranged in the light emitting element or the light receiving element, the surface electrode of the light emitting element or the light receiving element and the bonding electrode wiring are connected by a bonding wire, and sealed with a light transmitting resin. In the coupling device, a step portion is provided on the inner wall side surface of at least one of the recesses, and the bonding electrode wiring is passed through the inner wall side surface of the recess portion, through the horizontal surface of the step portion, and up to the middle of the vertical surface of the step portion. and Shin設to connect the surface electrode of the bonding electrode wire and the light emitting element or the light receiving element on a horizontal surface of the step portion by a bonding wire, the Bindings electrode wiring, the thickness of the stepped portion 1
If it is, from the upper end of the stepped portion to 1/4 to 3/4
A three-dimensional wiring type optical coupling device, characterized in that the optical coupling device extends along the vertical surface of the step portion up to the range . 2. The three-dimensional wiring member is configured by directly providing the bonding electrode wiring and the mounting electrode wiring electrically insulated from the bonding electrode wiring on the surface of the light opaque member, and The three-dimensional wiring type optical coupling device according to claim 1, wherein a light emitting element or a light receiving element is mounted on the mounting electrode wiring on the bottom surface of the recess of the impermeable member with a conductive adhesive. 3. The first and second recesses corresponding to the first and second recesses, respectively, with respect to the surface of the light-impermeable member formed by resin molding and having the first and second recesses on the same surface. Two
And a light emitting element and a light receiving element respectively disposed on the bottom surfaces of the first and second recesses, and a surface electrode of the light emitting element and the light receiving element. The first and second bonding electrode wirings are connected to each other by bonding wires, and the first and second recesses are sealed with a light-transmitting resin, so that the output light of the light emitting element is transmitted to an external reflection plate. In the reflection type optical coupling device for reflecting and propagating to the light receiving element, the first concave portion is provided with a first step portion on at least one inner wall side surface, and the first bonding electrode wiring is provided on the inner wall side surface. Through the horizontal plane of the first step portion and further extending to a midpoint of the vertical plane of the first step portion, and the first bonding electrode wiring on the horizontal plane of the first step portion and the The second concave portion is provided with a second step portion on at least one inner wall side surface, and the second bonding electrode wiring is formed on the inner wall side surface. Through the horizontal surface of the second step portion and further extending to the middle of the vertical surface of the second step portion, and the second bonding electrode wiring on the horizontal surface of the second step portion and the light receiving portion. constituted by connecting the surface electrode of the element by a bonding wire, said first and second bonding electrode wiring, said first
When the thickness of the first and second step portions is 1, the first and second step portions are
The range from 1/4 to 3/4 from the upper end of each second step
A reflection type optical coupling device, characterized in that the reflection type optical coupling device is extended to the inside along the vertical surface of the step portion . 4. The three-dimensional wiring member includes the first and second wiring members.
Of the bonding electrode wire and the first and second mounting electrode wires electrically insulated from the bonding electrode wire are directly provided on the surface of the light opaque member, and are formed by a conductive adhesive. The light emitting element is mounted on the first mounting electrode wiring on the bottom surface of the first recess, and the light receiving element is mounted on the second mounting electrode wiring on the bottom surface of the second recess. The reflective optical coupling device according to claim 3 .