JP3130826B2 - Semiconductor device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To reduce the manufacturing cost, entire thickness, and external size of a semiconductor device and, at the same time, to improve the productivity of the device. SOLUTION: A package main body 1 is formed in a molded article having a recessed section 11 for housing semiconductor element at the central part. A semiconductor element 2 is bonded and fixed to the recessed section 11 of the main body 1. Lead wires 4 having prescribed shapes are respectively connected to the electrode pads 21 of the element 2. In an insulating coating section 5 is provided to cover the surface of the main body 1 in the peripheral area of the recessed section and the sections from the front ends of the connecting sections between the lead wires and pads 21 to the peripheral area of the recessed sections 11.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to a semiconductor device,
In particular, the present invention relates to a semiconductor device having a package for enclosing a semiconductor element therein.

[0002]

2. Description of the Related Art Conventional typical semiconductor devices of this type include a resin-sealed type in which a semiconductor element is directly molded and sealed therein, and a ceramic package type in which a semiconductor element is sealed in a ceramic package.

FIG. 2 shows an example (first example) of a resin-sealed semiconductor device.

The semiconductor device of the first example has a lead frame comprising an element mounting portion 41 and a plurality of lead wires 4a, and a first surface adhered and fixed to the element mounting portion 41 of the lead frame. Semiconductor element 2 having a plurality of electrode pads 21, and a plurality of bonding wires 6 connecting lead wires 4a corresponding to the plurality of electrode pads 21 of semiconductor element 2, semiconductor element 2 and elements of the lead frame. The mounting portion 41 and a predetermined portion of each of the plurality of lead frames, and the sealing resin package 7 for directly molding and sealing the plurality of bonding wires 6 therein are provided.

In the first example, a sealing resin having a predetermined thickness is required for the lower part of the element mounting part 41 and the semiconductor element 2 and the bonding wire 6 above the element mounting part 41. Therefore, there is a problem that the thickness of the entire semiconductor device is large and the external dimensions are also large.

Further, in the semiconductor device of the second example, as shown in FIG. 3 (for example, see Japanese Patent Application Laid-Open No. 4-127558), a device hole 81 is provided at the center, and the device hole 81 on the first surface is provided. , A thin film wiring 82 is formed on the second surface which is one step lower than the first surface.
Lead pins 12 connected to thin film wiring 82 through
Is provided, and a plurality of electrode pads 21 are formed on the first surface, and the plurality of electrode pads 21 and the thin film wiring 82 are TAB (Tape Automated).
a semiconductor chip 2 connected by an attached bonding tape 10 and housed in a device hole 81; a heat sink 9 joined to the second surface of the semiconductor element 2 and joined to a third surface of the ceramic package 8; The configuration includes a first surface of the package 8, a first surface of the semiconductor element 2, and a cap 13 formed so as to cover the TAB tape 10.

In the semiconductor device of the second example, the first surface of the ceramic package 8 needs to be smooth and dense so that the thin film wiring 82 and the TAB tape 10 can be bonded well. In addition, the ceramic package 8 is baked and polished to form the thin film wiring 82. On the other hand, the plurality of lead pins 12 provided on the second surface are connected and fixed to electrode pads formed by firing metallization in order to increase the tensile strength and the like. When the first surface is polished, the second surface is one surface lower than the first surface in order to prevent the electrode pad formed by firing metallization from being polished.

[0008]

In the first example, the conventional semiconductor device described above has a lower portion,
Since a sealing resin having a predetermined thickness is required on the semiconductor element 2 and the bonding wires 6, there is a problem that the overall thickness is large and the external dimensions are large. 8 is a complicated shape and requires high-precision polishing or the like, which requires a lot of processing man-hours, and is expensive because the material is ceramic. This is a complicated structure in which the wiring is formed at a narrow pitch, so that it is expensive and requires high-precision alignment work between the wiring of the TAB tape 10 and the electrode pads 21 and the thin-film wiring 82 of the semiconductor element 2. Therefore, there is a problem that productivity is poor.

An object of the present invention is to provide a semiconductor device which is inexpensive, has high productivity, and can be reduced in overall thickness and external dimensions.

[0010]

According to the present invention, there is provided a semiconductor device comprising:
A package body having a predetermined shape formed by providing a concave portion having a preset width and depth at a central portion of the first surface, and a plurality of electrode pads formed at predetermined positions on the first surface. A second surface on the back side of the first surface of the semiconductor device, the front surface of the semiconductor device being in front of the bottom surface of the concave portion of the package body.
Wherein a semiconductor element, a plurality of respective electrode pads and the corresponding connection a predetermined shape of the semiconductor device in which the first face of the serial semiconductor element and the first surface of the package body is adhesively fixed to be approximately in the same plane Lead wires formed on the semiconductor device, the entire first surface of the semiconductor element to which the plurality of lead wires are connected, at least a peripheral portion of the package body, and corresponding electrode pads of each of the plurality of lead wires And an insulating coating portion formed of an insulating material so as to cover the entire surface from the end of the connection portion to at least the periphery of the concave portion of the package body.

[0011] Each of the plurality of lead wires extends from a connection portion with a corresponding one of the electrode pads along a first surface of the package body to a first side of the first surface and the side surface, Bent along the first side and along the side surface and the back side of the side surface and the first surface of the package body
The second extends to the second side of the plane, the second in the side bent to the outside of the package body to a predetermined by the length extending shape, the portion that is bent to the outside of the package body is, It is characterized in that it is the same as or slightly protrudes from the extension surface of the second surface of the package body.

[0012]

Embodiments of the present invention will now be described with reference to the drawings.

FIGS. 1A and 1B are a side sectional view and a perspective view showing an embodiment of the present invention.

In this embodiment, a rectangular package body 1 molded with a recess 11 having a preset width and depth at the center of the first surface is provided. A plurality of electrode pads 21 are formed in a peripheral portion, and a second surface on the back side of the first surface is formed in the concave portion 11 of the package body 1.
And a plurality of electrode pads 21 of the semiconductor element 2 adhered and fixed on the bottom surface of the semiconductor element 2 so that the first surface and the first surface of the package body 1 are substantially flush with each other. A plurality of lead wires 4 correspondingly connected to each other and formed into a predetermined shape; a first surface of the semiconductor element 2 to which these lead wires 4 are connected;
The package body 1 is formed of an insulating material so as to cover the entire peripheral portion of the concave portion 11 and a portion from the tip of the connection portion of each of the plurality of lead wires to the corresponding electrode pad (21) to the peripheral portion of the concave portion 11 of the package body 1. It has a configuration having an insulating coating portion 5.

Each of the plurality of lead wires 4 is
A portion extending from the connection portion with the corresponding electrode pad 21 extends along the first surface of the package body 1 to a first side at the intersection of the first surface and the side surface, and bends at the first side to form the side surface. Along the second side of the intersection of the side surface and the second surface, and is bent outside the package body 1 at the second side to extend by a predetermined length. The contact surface with the mounting substrate of the portion extended outward has the same shape as the second surface of the package main body 1 or slightly protrudes from the second surface.

The depth of the recess 11 of the package body 1 is such that the first surface of the semiconductor element 2 is the first surface of the package body 1.
The thickness of the semiconductor element 2 and the thickness of the adhesive 3 are substantially the same as the surface of the semiconductor element 2, and the thickness of the adhesive is actually extremely small. The dimensions are of the order.

The package body 1 is molded by injecting an insulating resin into a mold previously manufactured according to the finished product dimensions. The package body 1 has a simple shape and a simple manufacturing process, and is inexpensive.
Costs can be kept low. The thickness of the bottom surface and the second surface of the concave portion 11 and the thickness of the side surface portion can withstand the force when the lead wire 4 is attached and the force when the lead wire 4 is mounted on the mounting board. It should be just the dimensions,
In addition, the thickness of the insulating coating portion 5 may be a dimension enough to obtain moisture resistance.
And the external dimensions can be reduced. If the lead wire 4 is processed into a predetermined shape in advance, a force due to its bending will not be applied to the semiconductor element 2 or the package body 1.

The connection of the lead wire 4 to the electrode pad 21 of the semiconductor element 2 is performed by a bonding tool.
This is performed while simultaneously applying ultrasonic waves, heat and load. After this connection, the insulating coating portion 5 is formed with an insulating material.

[0019]

As described above, according to the present invention, the package body is a molded product having a concave portion for accommodating a semiconductor element in the center, and the semiconductor element is bonded and fixed to the concave portion to form a lead wire having a predetermined shape. Is connected to the electrode pads of the semiconductor element, and an insulating coating portion is formed so as to cover the entire surface of the semiconductor element, at least the periphery of the concave portion of the package body, and a portion corresponding to these portions of the lead wire, Can simplify the structure and manufacturing process of each part, and can use an inexpensive material, so that the cost can be reduced and the productivity can be improved. Since the thickness of the semiconductor device can be reduced, there is an effect that the thickness of the entire semiconductor device can be reduced and the external dimensions can be reduced.

[Brief description of the drawings]

FIG. 1 is a side sectional view and a perspective view showing an embodiment of the present invention.

FIG. 2 is a side sectional view of a first example of a conventional semiconductor device.

FIG. 3 is a side sectional view of a second example of a conventional semiconductor device.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Package main body 2 Semiconductor element 3 Adhesive 4, 4a Lead wire 5 Insulation coating part 6 Bonding wire 7 Sealing resin package 8 Ceramic package 9 Heat sink 10 TAB tape 12 Lead pin 13 Cap 21 Electrode pad

──────────────────────────────────────────────────続 き Continued on the front page (58) Field surveyed (Int.Cl. ⁷ , DB name) H01L 23 / 02,23 / 28,23 / 12 H01L 23 / 50,21 / 60

Claims (1)

(57) [Claims] 1. A package body having a predetermined shape provided with a recess having a predetermined width and depth at a center portion of a first surface, and a plurality of package bodies having a predetermined shape at a predetermined position on the first surface. A first surface of the semiconductor device and a first surface of the package body, the second surface of the semiconductor device being provided on the bottom surface of the concave portion of the package body. The semiconductor element which is bonded and fixed so that the surface of the semiconductor element is substantially the same as a surface of the semiconductor element; a plurality of lead wires formed in a predetermined shape which are respectively connected to a plurality of electrode pads of the semiconductor element; From the entire first surface of the semiconductor element to which the package is connected, at least the periphery of the concave portion of the package body, and the tip of the connection portion of each of the plurality of lead wires with the corresponding electrode pad. An insulating coating portion formed of an insulating material so as to cover the entire surface of at least the periphery of the concave portion of the main body, wherein each of the plurality of lead wires is connected to a corresponding one of the electrode pads through a third portion of the package main body. The first side extends along the first side to the first side of the first side and the side, and is bent at the first side to extend along the side of the first side and the back side of the first side of the package body . The second side extends to a second side with the second surface, and the second side is bent to the outside of the package main body to extend by a predetermined length, and the portion bent to the outside of the package main body is A semiconductor device characterized in that it is the same as or slightly protrudes from an extension of the second surface of the package body.