JPS61179749U - - Google Patents
Info
- Publication number
- JPS61179749U JPS61179749U JP6440085U JP6440085U JPS61179749U JP S61179749 U JPS61179749 U JP S61179749U JP 6440085 U JP6440085 U JP 6440085U JP 6440085 U JP6440085 U JP 6440085U JP S61179749 U JPS61179749 U JP S61179749U
- Authority
- JP
- Japan
- Prior art keywords
- transfer
- view
- wafer cartridge
- transfer means
- semiconductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004065 semiconductor Substances 0.000 claims description 8
- 238000010586 diagram Methods 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
Landscapes
- Intermediate Stations On Conveyors (AREA)
Description
第１図〜第７図は本考案の実施例を示すもので
あつて、第１図はウエハカートリツジの移送経路
を示す概略平面図、第２図は第一の移送手段の部
分斜視図、第３図は半導体処理用移送装置の平面
図、第４図はウエハカートリツジがＣＶＤ装置の
装入孔直下に位置する状態を示す一部断面正面図
、第５図はウエハカートリツジをＣＶＤ装置内へ
装入する置前の状態を示す一部断面正面図、第６
図はウエハカートリツジがＣＶＤ装置内に装入さ
れた状態を示す一部断面正面図、第７図は他の例
を示す装置の部分一部断面正面図である。第８図
〜第１０図は従来例を示すものであつて、第８図
は装置の使用状態の概略図、第９図は移送装置の
概略正面図、第１０図はウエハカートリツジ挟着
時の断面図である。
なお、図面に示された符号に於いて、１……第
一の移送装置、１０１……第二の移送装置、２…
…未処理のウエハカートリツジ、２ａ……ウエハ
カートリツジの底板、２ｂ……ウエハカートリツ
ジ底板の突起部、１０２……処理済みのウエハカ
ートリツジ、３……ＣＶＤ装置、５……装入孔、
６……コンベヤ、７，１０７……レバー、７ａ，
１０７ａ……レバーの一端、９，１０９……軸、
１２，１１２……担持部、１４，１１４……フオ
ーク、１６，１１６……カム、１７……案内軸、
１９，２２，１１９……平歯車、２０，１２０…
…ピニオン、１２，１２３……ラツク、２４……
ガイド溝、２６……底蓋、２７……挿入部、３０
……昇降装置、３１……シリンダ、３５……ラム
、である。
1 to 7 show an embodiment of the present invention, in which FIG. 1 is a schematic plan view showing the transfer path of the wafer cartridge, FIG. 2 is a partial perspective view of the first transfer means, Fig. 3 is a plan view of the transfer device for semiconductor processing, Fig. 4 is a partial cross-sectional front view showing the state in which the wafer cartridge is located directly below the charging hole of the CVD equipment, and Fig. 5 is a plan view of the wafer cartridge being placed in the CVD equipment. A partially sectional front view showing the state before loading into the interior, No. 6
The figure is a partially sectional front view showing a state in which a wafer cartridge is loaded into the CVD apparatus, and FIG. 7 is a partially sectional front view showing another example of the apparatus. 8 to 10 show conventional examples, in which FIG. 8 is a schematic diagram of the device in use, FIG. 9 is a schematic front view of the transfer device, and FIG. 10 is when the wafer cartridge is clamped. FIG. In addition, in the symbols shown in the drawings, 1...first transfer device, 101...second transfer device, 2...
...Unprocessed wafer cartridge, 2a... Bottom plate of wafer cartridge, 2b... Protrusion of wafer cartridge bottom plate, 102... Processed wafer cartridge, 3... CVD apparatus, 5... Charging hole ,
6...Conveyor, 7,107...Lever, 7a,
107a... One end of the lever, 9, 109... Shaft,
12, 112... Carrying part, 14, 114... Fork, 16, 116... Cam, 17... Guide shaft,
19,22,119...Spur gear, 20,120...
...Pinion, 12,123...Rack, 24...
Guide groove, 26... Bottom cover, 27... Insertion section, 30
. . . lifting device, 31 . . . cylinder, 35 . . . ram.
Claims (1)
体を移送する第一の移送手段と、この第一の移送
手段とは別に、前記半導体処理部から前記半導体
搬送部へ処理済みの半導体を移送する第二の移送
手段とを有する半導体処理用移送装置。 a first transfer means for transferring unprocessed semiconductors from the semiconductor transfer section to the semiconductor processing section; and a first transfer means for transferring processed semiconductors from the semiconductor processing section to the semiconductor transfer section, separate from the first transfer means; A transfer device for semiconductor processing having two transfer means.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6440085U JPH0648843Y2 (en) | 1985-04-30 | 1985-04-30 | Transfer device for semiconductor processing |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6440085U JPH0648843Y2 (en) | 1985-04-30 | 1985-04-30 | Transfer device for semiconductor processing |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS61179749U true JPS61179749U (en) | 1986-11-10 |
| JPH0648843Y2 JPH0648843Y2 (en) | 1994-12-12 |
Family
ID=30595449
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6440085U Expired - Lifetime JPH0648843Y2 (en) | 1985-04-30 | 1985-04-30 | Transfer device for semiconductor processing |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0648843Y2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63278225A (en) * | 1987-05-08 | 1988-11-15 | Teru Sagami Kk | Boat for heat treatment |
-
1985
- 1985-04-30 JP JP6440085U patent/JPH0648843Y2/en not_active Expired - Lifetime
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63278225A (en) * | 1987-05-08 | 1988-11-15 | Teru Sagami Kk | Boat for heat treatment |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0648843Y2 (en) | 1994-12-12 |
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