JPS61177496U - - Google Patents
Info
- Publication number
- JPS61177496U JPS61177496U JP6258385U JP6258385U JPS61177496U JP S61177496 U JPS61177496 U JP S61177496U JP 6258385 U JP6258385 U JP 6258385U JP 6258385 U JP6258385 U JP 6258385U JP S61177496 U JPS61177496 U JP S61177496U
- Authority
- JP
- Japan
- Prior art keywords
- side plate
- case
- circuit board
- printed circuit
- frame
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000000638 solvent extraction Methods 0.000 claims 1
- 229910000679 solder Inorganic materials 0.000 description 2
- 238000005476 soldering Methods 0.000 description 1
Landscapes
- Casings For Electric Apparatus (AREA)
Description
第1図〜第4図は本考案の実施例を示すもので
あり、第1図は枠体とプリント基板とを示す斜視
図、第2図は枠体とプリント基板の装着部を拡大
して示す斜視図、第3図はデイツプ半田する向き
を示す枠体とプリント基板の断面図、第4図はプ
リント基板に半田をデイツプした状態を示す斜視
図、第5図は従来のケースの一例としてRFモジ
ユレータの枠体を示す斜視図、第6図は従来の枠
体とプリント基板との装着を示す断面図である。
11……枠体、11a,11b……側板、11
c……シールド板、11e……接合片、12……
プリント基板、12a……切欠き、14,14a
,14b……半田。
Figures 1 to 4 show an embodiment of the present invention. Figure 1 is a perspective view showing the frame and the printed circuit board, and Figure 2 is an enlarged view of the mounting portion of the frame and the printed circuit board. 3 is a cross-sectional view of the frame and printed circuit board showing the direction of dip soldering, FIG. 4 is a perspective view showing the printed circuit board with solder dip, and FIG. 5 is an example of a conventional case. FIG. 6 is a perspective view showing the frame of the RF modulator, and a sectional view showing the attachment of the conventional frame and printed circuit board. 11...Frame body, 11a, 11b...Side plate, 11
c... Shield plate, 11e... Joining piece, 12...
Printed circuit board, 12a...notch, 14, 14a
, 14b...Solder.
Claims (1)
るシールド板が設けられている枠体と、この枠体
の開口部に設置されるプリント基板とを有してい
る電子機器用ケースにおいて、前記シールド板の
側板に対する接合部は、プリント基板を貫通して
枠体の開口部へ延ばされており、且つこの接合部
と側板の内面とが半田付けされていることを特徴
とする電子機器用ケース。 In a case for an electronic device, the case has a frame body provided with a side plate surrounding all sides and a shield plate partitioning the inside of the side plate, and a printed circuit board installed in an opening of the frame body. What is claimed is: 1. A case for electronic equipment, characterized in that a joint portion to the side plate extends through the printed circuit board to an opening of the frame, and the joint portion and the inner surface of the side plate are soldered.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP6258385U JPS61177496U (en) | 1985-04-24 | 1985-04-24 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP6258385U JPS61177496U (en) | 1985-04-24 | 1985-04-24 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS61177496U true JPS61177496U (en) | 1986-11-05 |
Family
ID=30591934
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP6258385U Pending JPS61177496U (en) | 1985-04-24 | 1985-04-24 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS61177496U (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH01100495U (en) * | 1987-12-22 | 1989-07-05 |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS4824482U (en) * | 1971-07-27 | 1973-03-22 |
-
1985
- 1985-04-24 JP JP6258385U patent/JPS61177496U/ja active Pending
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS4824482U (en) * | 1971-07-27 | 1973-03-22 |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH01100495U (en) * | 1987-12-22 | 1989-07-05 |
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