JPS61174750A - 冷却構造 - Google Patents

冷却構造

Info

Publication number
JPS61174750A
JPS61174750A JP60015901A JP1590185A JPS61174750A JP S61174750 A JPS61174750 A JP S61174750A JP 60015901 A JP60015901 A JP 60015901A JP 1590185 A JP1590185 A JP 1590185A JP S61174750 A JPS61174750 A JP S61174750A
Authority
JP
Japan
Prior art keywords
bonding material
sheet
convex surface
heat transfer
cooling
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP60015901A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0322704B2 (enExample
Inventor
Mitsuhiko Nakada
仲田　光彦
Yukihisa Katsuyama
勝山　幸寿
Toshio Kizawa
鬼沢　俊夫
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP60015901A priority Critical patent/JPS61174750A/ja
Publication of JPS61174750A publication Critical patent/JPS61174750A/ja
Publication of JPH0322704B2 publication Critical patent/JPH0322704B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
JP60015901A 1985-01-30 1985-01-30 冷却構造 Granted JPS61174750A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP60015901A JPS61174750A (ja) 1985-01-30 1985-01-30 冷却構造

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP60015901A JPS61174750A (ja) 1985-01-30 1985-01-30 冷却構造

Publications (2)

Publication Number Publication Date
JPS61174750A true JPS61174750A (ja) 1986-08-06
JPH0322704B2 JPH0322704B2 (enExample) 1991-03-27

Family

ID=11901678

Family Applications (1)

Application Number Title Priority Date Filing Date
JP60015901A Granted JPS61174750A (ja) 1985-01-30 1985-01-30 冷却構造

Country Status (1)

Country Link
JP (1) JPS61174750A (enExample)

Also Published As

Publication number Publication date
JPH0322704B2 (enExample) 1991-03-27

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