JPS61174633A - スパッタエッチング装置 - Google Patents

スパッタエッチング装置

Info

Publication number
JPS61174633A
JPS61174633A JP60013496A JP1349685A JPS61174633A JP S61174633 A JPS61174633 A JP S61174633A JP 60013496 A JP60013496 A JP 60013496A JP 1349685 A JP1349685 A JP 1349685A JP S61174633 A JPS61174633 A JP S61174633A
Authority
JP
Japan
Prior art keywords
anode electrode
plate
film
insulating substance
deposited
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP60013496A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0531294B2 (enExample
Inventor
Izumi Nakayama
泉 中山
Hisaharu Obinata
小日向　久治
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ulvac Inc
Original Assignee
Ulvac Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ulvac Inc filed Critical Ulvac Inc
Priority to JP60013496A priority Critical patent/JPS61174633A/ja
Publication of JPS61174633A publication Critical patent/JPS61174633A/ja
Publication of JPH0531294B2 publication Critical patent/JPH0531294B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P50/00—Etching of wafers, substrates or parts of devices

Landscapes

  • ing And Chemical Polishing (AREA)
  • Drying Of Semiconductors (AREA)
JP60013496A 1985-01-29 1985-01-29 スパッタエッチング装置 Granted JPS61174633A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP60013496A JPS61174633A (ja) 1985-01-29 1985-01-29 スパッタエッチング装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP60013496A JPS61174633A (ja) 1985-01-29 1985-01-29 スパッタエッチング装置

Publications (2)

Publication Number Publication Date
JPS61174633A true JPS61174633A (ja) 1986-08-06
JPH0531294B2 JPH0531294B2 (enExample) 1993-05-12

Family

ID=11834723

Family Applications (1)

Application Number Title Priority Date Filing Date
JP60013496A Granted JPS61174633A (ja) 1985-01-29 1985-01-29 スパッタエッチング装置

Country Status (1)

Country Link
JP (1) JPS61174633A (enExample)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2004059716A1 (en) * 2002-12-20 2004-07-15 Lam Research Corporation A system and method for controlling plasma with an adjustable coupling to ground circuit
CN100426941C (zh) * 2004-07-12 2008-10-15 应用材料股份有限公司 低电感等离子室的设备、制造方法、及与之一起使用的装置

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5687667A (en) * 1979-12-20 1981-07-16 Toshiba Corp Reactive ion etching method
JPS5687670A (en) * 1979-12-15 1981-07-16 Anelva Corp Dry etching apparatus
JPS57210631A (en) * 1981-06-19 1982-12-24 Toshiba Corp Reactive type ion etching method
JPS58202531A (ja) * 1982-05-21 1983-11-25 Hitachi Ltd 反応性スパツタエツチング装置

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5687670A (en) * 1979-12-15 1981-07-16 Anelva Corp Dry etching apparatus
JPS5687667A (en) * 1979-12-20 1981-07-16 Toshiba Corp Reactive ion etching method
JPS57210631A (en) * 1981-06-19 1982-12-24 Toshiba Corp Reactive type ion etching method
JPS58202531A (ja) * 1982-05-21 1983-11-25 Hitachi Ltd 反応性スパツタエツチング装置

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2004059716A1 (en) * 2002-12-20 2004-07-15 Lam Research Corporation A system and method for controlling plasma with an adjustable coupling to ground circuit
JP2006511059A (ja) * 2002-12-20 2006-03-30 ラム リサーチ コーポレーション 半導体チャンバ、及びプラズマ処理チャンバ内のプラズマの制御方法
CN100380606C (zh) * 2002-12-20 2008-04-09 朗姆研究公司 等离子体处理系统
US8518211B2 (en) 2002-12-20 2013-08-27 Lam Research Corporation System and method for controlling plasma with an adjustable coupling to ground circuit
CN100426941C (zh) * 2004-07-12 2008-10-15 应用材料股份有限公司 低电感等离子室的设备、制造方法、及与之一起使用的装置

Also Published As

Publication number Publication date
JPH0531294B2 (enExample) 1993-05-12

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