JPS61171565A - デイスペンサ−用注射筒 - Google Patents

デイスペンサ−用注射筒

Info

Publication number
JPS61171565A
JPS61171565A JP60013036A JP1303685A JPS61171565A JP S61171565 A JPS61171565 A JP S61171565A JP 60013036 A JP60013036 A JP 60013036A JP 1303685 A JP1303685 A JP 1303685A JP S61171565 A JPS61171565 A JP S61171565A
Authority
JP
Japan
Prior art keywords
resin composition
piston
dispenser
cylinder
syringe
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP60013036A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0410390B2 (enExample
Inventor
Nobuo Ichimura
市村　信雄
Iwao Maekawa
前川　磐雄
Yasuo Miyamoto
宮本　泰雄
Daisuke Makino
大輔 牧野
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Resonac Corp
Original Assignee
Hitachi Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Chemical Co Ltd filed Critical Hitachi Chemical Co Ltd
Priority to JP60013036A priority Critical patent/JPS61171565A/ja
Publication of JPS61171565A publication Critical patent/JPS61171565A/ja
Publication of JPH0410390B2 publication Critical patent/JPH0410390B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/741—Apparatus for manufacturing means for bonding, e.g. connectors
    • H01L24/743—Apparatus for manufacturing layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/741—Apparatus for manufacturing means for bonding, e.g. connectors
    • H01L2224/743—Apparatus for manufacturing layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/156—Material
    • H01L2924/15786—Material with a principal constituent of the material being a non metallic, non metalloid inorganic material
    • H01L2924/15787—Ceramics, e.g. crystalline carbides, nitrides or oxides

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Coating Apparatus (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Die Bonding (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
JP60013036A 1985-01-25 1985-01-25 デイスペンサ−用注射筒 Granted JPS61171565A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP60013036A JPS61171565A (ja) 1985-01-25 1985-01-25 デイスペンサ−用注射筒

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP60013036A JPS61171565A (ja) 1985-01-25 1985-01-25 デイスペンサ−用注射筒

Publications (2)

Publication Number Publication Date
JPS61171565A true JPS61171565A (ja) 1986-08-02
JPH0410390B2 JPH0410390B2 (enExample) 1992-02-25

Family

ID=11821891

Family Applications (1)

Application Number Title Priority Date Filing Date
JP60013036A Granted JPS61171565A (ja) 1985-01-25 1985-01-25 デイスペンサ−用注射筒

Country Status (1)

Country Link
JP (1) JPS61171565A (enExample)

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003010757A (ja) * 2001-07-03 2003-01-14 Hitachi Chem Co Ltd ディスペンサー用注射筒及びペースト状接着剤
JP2009539607A (ja) * 2006-06-13 2009-11-19 ノードソン コーポレーション 液体吐出シリンジ
JP5101743B1 (ja) * 2012-04-02 2012-12-19 加賀ワークス株式会社 空圧ディスペンサ用プランジャ
US20140366797A1 (en) * 2013-06-17 2014-12-18 Panasonic Corporation Paste supply apparatus and screen printing machine
US9126702B2 (en) 2010-08-24 2015-09-08 Kaga Works Co., Ltd. Viscous-material filling method
US20150258774A1 (en) * 2014-03-17 2015-09-17 Panasonic Intellectual Property Management Co., Ltd. Screen printing machine and screen printing method
US10293361B2 (en) 2015-10-19 2019-05-21 Kaga Works Co., Ltd. Cartridge for viscous-material dispenser
US10479587B2 (en) 2014-08-25 2019-11-19 Kaga Works Co., Ltd. Cartridge for viscous-material dispenser

Cited By (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003010757A (ja) * 2001-07-03 2003-01-14 Hitachi Chem Co Ltd ディスペンサー用注射筒及びペースト状接着剤
JP2009539607A (ja) * 2006-06-13 2009-11-19 ノードソン コーポレーション 液体吐出シリンジ
US9340306B2 (en) 2010-08-24 2016-05-17 Kaga Works Co., Ltd. Viscous-material filling apparatus
US10336478B2 (en) 2010-08-24 2019-07-02 Kaga Works Co., Ltd. Viscous-material filling method
US9731846B2 (en) 2010-08-24 2017-08-15 Kaga Works Co., Ltd. Viscous-material filling method
US9126702B2 (en) 2010-08-24 2015-09-08 Kaga Works Co., Ltd. Viscous-material filling method
US9598223B2 (en) 2012-04-02 2017-03-21 Kaga Works Co., Ltd. Plunger for pneumatic dispenser
WO2013150683A1 (ja) * 2012-04-02 2013-10-10 加賀ワークス株式会社 空圧ディスペンサ用プランジャ
JP5101743B1 (ja) * 2012-04-02 2012-12-19 加賀ワークス株式会社 空圧ディスペンサ用プランジャ
US20140366797A1 (en) * 2013-06-17 2014-12-18 Panasonic Corporation Paste supply apparatus and screen printing machine
US20150258774A1 (en) * 2014-03-17 2015-09-17 Panasonic Intellectual Property Management Co., Ltd. Screen printing machine and screen printing method
US9393775B2 (en) * 2014-03-17 2016-07-19 Panasonic Intellectual Property Management Co., Ltd. Screen printing machine and screen printing method
US10479587B2 (en) 2014-08-25 2019-11-19 Kaga Works Co., Ltd. Cartridge for viscous-material dispenser
US10293361B2 (en) 2015-10-19 2019-05-21 Kaga Works Co., Ltd. Cartridge for viscous-material dispenser
US10507487B2 (en) 2015-10-19 2019-12-17 Kaga Works Co., Ltd. Cartridge for viscous-material dispenser

Also Published As

Publication number Publication date
JPH0410390B2 (enExample) 1992-02-25

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